Atomistic Simulations of Steps in Bimetallic Interfaces as Barriers to Interface Slip Transmission

Abstract

Atomistic models of coherent interfaces in the CuNi system with and without (111)-steps were used to study slip transmission across interfaces in CuNi metallic bilayers. The lattice mismatch of the CuNi system results in large coherency stresses at the interface. The (111)-steps afford a larger barrier to slip than the flat, coherent interface. The coherent flat interface dislocation barrier is largely due to the large compressive stresses in the Cu layer that must be overcome by applied tensile stresses. Additional Koehler forces are present as the dislocation in the elastically softer Cu approaches the stiffer Ni layer. The step, however, possesses a small residual edge dislocation with a Burgers vector equal to the difference of bCu and bNi times the height of the (111)-step in (111)-layers. We find that these steps are potent slip barriers, which suggests that homogeneous slip is preferred in such systems.