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Application of Tem on Sub-Half Micron Semiconductor Devices
Published online by Cambridge University Press: 10 February 2011
Abstract
Application of transmission electron microscopy on sub-half micron devices has been illustrated in terms of process evaluation and failure analysis. For process evaluation, it is emphasized that a large number of features need to be examined in order to have reliable conclusions about the processes, while for failure analysis, the goal is to pin-point a single process step causing failure or a single source introducing the particle defect.
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- Copyright © Materials Research Society 1998
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