Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-11-28T17:14:25.875Z Has data issue: false hasContentIssue false
  • English
  • Français

Adhesive Bonding Via Exposure to Variable Frequency Microwave Radiation

Published online by Cambridge University Press:  10 February 2011

Felix L. Paulauskas ,
April D. McMillan  and
C. David Warren
Felix L. Paulauskas
Affiliation:
Oak Ridge National Laboratory, P.O. Box 2009, Oak Ridge, Tennessee 37831-8048
April D. McMillan
Affiliation:
Oak Ridge National Laboratory, P.O. Box 2009, Oak Ridge, Tennessee 37831-8048
C. David Warren
Affiliation:
Oak Ridge National Laboratory, P.O. Box 2009, Oak Ridge, Tennessee 37831-8048
Get access

Abstract

Adhesive bonding through the application of variable frequency microwave (VFM) radiation has been evaluated as an alternative curing method for joining composite materials. The studies showed that the required cure time of a thermosetting epoxy adhesive is substantially reduced by the use of VFM when compared to conventional (thermal) curing methods. Variable frequency microwave processing appeared to yield a slight reduction in the required adhesive cure time when compared to processing by the application of single frequency microwave radiation. In contrast to the single frequency processing, the variable frequency methodology does not readily produce localized overheating (burnt or brown spots) in the adhesive or the composite. This makes handling and location of the sample in the microwave oven less critical for producing high quality bonds and allows for a more homogeneous distribution of the cure energy. Variable frequency microwave processing is a valuable alternative method for rapidly curing thermoset adhesives at low input power levels.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 430: Symposium O – Microwave Processing of Materials V , 1996 , 493
Copyright
Copyright © Materials Research Society 1996

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Office of Transportation Materials, Materials for Lightweight Vehicles Program Plan, United States Department of Energy, (1992).Google Scholar
2. Surrett, A.D., Lauf, R.J., Paulauskas, F.L. and Johnson, A.C., MRS Symposium Proceedings, 347, 691 (1994).Google Scholar
3. Johnson, A.C., Lauf, R.J. and Surrett, A.D., MRS Symposium Proceedings, 347, 453 (1994).Google Scholar
4. Lauf, R.J., Paulauskas, F.L. and Johnson, A.C., 28th Microwave Symposium Proceedings - International Microwave Power Institute, 150 (1993).Google Scholar
5. Espinosa, R.J., Johnson, A.C., Thigpen, L.T., Lewis, W.A., Everleigh, C.A. and Garard, R.S., 28th Microwave Symposium Proceedings - International Microwave Power Institute, 26 (1993).Google Scholar
6. Paulauskas, F.L., Meek, T.T. and Warren, C.D., SAMPE International Technical Conference Proceedings, 27, 114 (1995).Google Scholar
7. Warren, C.D., Boeman, R.G. and Paulauskas, F.L., 1994 DOE Contractors Coordination Meeting Conference Proceedings, 2, 1 (1994).Google Scholar
8. Boeman, R.G. and Warren, C.D., 10th Annual ASM/ESD Advanced Composites Conference Proceedings, 473 (1995).Google Scholar
9. Paulauskas, F.L., Meek, T.T. and Warren, C.D., MRS Symposium Proceedings, 430 (1996) In press in this proceeding.Google Scholar
10. Paulauskas, F.L. and Meek, T.T., MRS Symposium Proceedings, 347, 743 (1994).Google Scholar