No CrossRef data available.
Article contents
A 3D Soft-EHL Model for Simulating Feature-scale Defects in Advanced Node ICs
Published online by Cambridge University Press: 10 July 2013
Abstract
A new multiphysics, multiscale framework is presented which is capable of capturing and predicting both wafer-scale and feature-scale defects. Through physics-based modeling, the empirical wear/Preston coefficient often found in popular feature scale models has been eliminated. Simulation results show the topography evolution of an actual metal 1 layout between two dies located in different positions on a wafer during the CMP process.
Keywords
- Type
- Articles
- Information
- Copyright
- Copyright © Materials Research Society 2013