Hostname: page-component-78c5997874-j824f Total loading time: 0 Render date: 2024-11-07T21:29:19.075Z Has data issue: false hasContentIssue false
  • English
  • Français

Characteristics of nickel thin films prepared by electroless plating in foam of electrolyte

Published online by Cambridge University Press:  06 November 2017

Takahiro Furuhashi ,
Yoshiyasu Yamada ,
Masato Hayashi ,
Shoji Ichihara  and
Hiroaki Usui
Takahiro Furuhashi
Affiliation:
Yamada Co. Ltd., Ryouke, Naka-ku, Hamamatsu, Shizuoka 430-0852, Japan
Yoshiyasu Yamada
Affiliation:
Yamada Co. Ltd., Ryouke, Naka-ku, Hamamatsu, Shizuoka 430-0852, Japan
Masato Hayashi
Affiliation:
Division of Applied Chemistry, Institute of Engineering, Tokyo University of Agriculture and Technology, 2-24-16 Naka-cho, Koganei, Tokyo 184-8588, Japan
Shoji Ichihara
Affiliation:
Division of Applied Chemistry, Institute of Engineering, Tokyo University of Agriculture and Technology, 2-24-16 Naka-cho, Koganei, Tokyo 184-8588, Japan
Hiroaki Usui*
Affiliation:
Division of Applied Chemistry, Institute of Engineering, Tokyo University of Agriculture and Technology, 2-24-16 Naka-cho, Koganei, Tokyo 184-8588, Japan
*
Address all correspondence to Hiroaki Usui at [email protected]
Get access

Abstract

Nickel thin films were prepared by electroless plating in a foam of electrolyte that was generated by bubbling nitrogen gas into a hypophosphite-based electroless plating solution to which was added a surfactant of sulfuric acid monododecyl ester sodium salt. Although the film growth rate in the foam was considerably lower than that in the conventional liquid, film growth was enhanced by inducing a flow in the foam. Compared with films deposited in liquid, the films deposited in foam had a smaller number of pinholes, smaller crystallite size, and superior corrosion resistance. The ferroxyl indicator test showed that the area of corrosion can be reduced to less than 1/20 by depositing the film in foam instead of liquid.

Type
Research Letters
Information
MRS Communications , Volume 7 , Issue 4 , December 2017 , pp. 953 - 959
Check for updates
Copyright
Copyright © Materials Research Society 2017 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Tsai, W.L., Hsu, P.C., Hwu, Y., Chen, C.H., Chang, L.W., Je, J.H., Lin, H.M., Groso, A., and Margaritondo, G.: Electrochemistry: building on bubbles in metal electrodeposition. Nature 417, 139 (2002).CrossRefGoogle ScholarPubMed
2. Hsu, P.C., Seol, S.K., Lo, T.N., Liu, C.J., Wang, C.L., Lin, C.S., Hwu, Y., Chen, C.H., Chang, L.W., Je, J.H., and Margaritondo, G.: Hydrogen bubbles and the growth morphology of ramified zinc by electrodeposition. J. Electrochem. Soc. 155, D400 (2008).CrossRefGoogle Scholar
3. Vogt, H. and Balzer, R.J.: The bubble coverage of gas-evolving electrodes in stagnant electrolytes. Electrochim. Acta 50, 2073 (2005).CrossRefGoogle Scholar
4. Balzer, R.J. and Vogt, H.: Effect of electrolyte flow on the bubble coverage of vertical gas-evolving electrodes. J. Electrochem. Soc. 150, E11 (2003).Google Scholar
5. Bari, G.A.D.: Nickel plating. In ASM Handbook Vol. 5: Surface Engineering, edited by Cotell, C.M., Sprague, J.A., and Smidt, F.A. Jr. (ASM International, Materials Park, OH, 1994), p. 201.Google Scholar
6. Yoshida, H., Sone, M., Mizushima, A., Yan, H., Wakabayashi, H., Abe, K., Tao, X.T., Ichihara, S., and Miyata, S.: Application of emulsion of dense carbon dioxide in electroplating solution with nonionic surfactants for nickel electroplating. Surf. Coat. Technol. 173, 285 (2003).Google Scholar
7. Yoshida, H., Sone, M., Wakabayashi, H., Abe, K., Tao, X.T., Yan, H., Ichihara, S., and Miyata, S.: New electroplating method of nickel in emulsion of supercritical carbon dioxide and electroplating solution to enhance uniformity and hardness of plated film. Thin Solid Films 446, 194 (2004).Google Scholar
8. Yan, H., Sone, M., Sato, N., Ichihara, S., and Miyata, S.: The effects of dense carbon dioxide on nickel plating using emulsion of carbon dioxide in electroplating solution. Surf. Coat. Technol. 182, 329 (2004).Google Scholar
9. Yamada, Y., Mitsuya, S., Furuhashi, T., Ichihara, S., and Usui, H.: Novel electroplating method using foam of an electrolyte solution. J. Chem. Eng. Jpn. 43, 966 (2010).Google Scholar
10. Yamada, Y., Fujisawa, Y., Sugawara, T., Furuhashi, T., Ichihara, S., and Usui, H.: Removal of a bubble on the surface of solid in liquid using flow of foam. Hyomen Gijutsu 63, 266 (2012).Google Scholar
11. Yamada, Y., Fujisawa, Y., Sugawara, T., Furuhashi, T., Ichihara, S., and Usui, H.: Electroplating of nickel films using stable foam electrolyte solution. Hyomen Gijutsu 63, 531 (2012).Google Scholar
12. Madavan, N.K., Deutsch, S., and Merkle, C.L.: Reduction of turbulent skin friction by microbubbles. Phys. Fluids 27, 356 (1984).Google Scholar
13. Kato, H., Fujii, Y., Yamaguchi, H., and Miyanaga, M.: Frictional drag reduction by injecting high-velocity fluid into turbulent boundary layer. Am. Soc. Mech. Eng. Fluids Eng. Div. 107, 15 (1991).Google Scholar
14. Kawamura, T., Moriguchi, Y., Kato, H., Kakugawa, A., and Kodama, Y.: Effect of bubble size on the microbubble drag reduction of a turbulent boundary layer. In Proc. 4th ASME/JSME Joint Fluids Eng. Conf., Honolulu, HI, July 6–10, 2003, p. 647.Google Scholar
15. Furuhashi, T., Yamada, Y., Ichihara, S., Takai, A., and Usui, H.: Electroless plating of Ni thin films using foam of electrolye. Jpn. J. Appl. Phys. 55, 02BC06 (2016).Google Scholar
16. Yamada, Y., Sugawara, T., Furuhashi, T., Ichihara, S., and Usui, H.: Effect of bubble size in the electroplating using foam of electrolyte. Hyomen Gijutsu 63, 269 (2012).Google Scholar
17. Wilde, P.J.: Encyclopedia of Surface and Colloid Science, 2nd ed., Vol. 4 (Taylor and Francis, London, 2006), p. 2613.Google Scholar
18. Top Nicoron F-153; Technical Note K-035; Okuno Chemical Industries Co. Ltd.: Osaka, Japan, 1990.Google Scholar
19. Wakabayashi, H., Sato, N., Sone, M., Takada, Y., Yan, H., Abe, K., Mizumoto, K., Ichihara, S., and Miyata, S.: Nano-grain structure of nickel films prepared by emulsion plating using dense carbon dioxide. Surf. Coat. Technol. 190, 200 (2005).Google Scholar
20. Allen, R.M. and VanderSande, J.B.: The structure of electroless nickel-phosphorus coatings as a function of composition. Scr. Metall. 16, 1161 (1982).Google Scholar
21. Kumar, P.S. and Nair, P.K.: Effect of phosphorus content on the relative proportions of crystalline and amorphous phases in electroless NiP deposits. J. Mater. Sci. Lett. 13, 671 (1994).Google Scholar
22. Yamada, Y., Sugawara, T., Furuhashi, T., Ichihara, S., and Usui, H.: Adhesion strength of nickel films deposited on aluminum surface in a foam of electrolyte. Hyomen Gijutsu 63, 329 (2012).Google Scholar
23. Tomlinson, W.J. and Carroll, M.W.: Substrate roughness, deposit thickness and the corrosion of electroless nickel coatings. J. Mater. Sci. 25, 4972 (1990).Google Scholar
24. Hsu, C.H., Chiu, S.C., and Shih, Y.H.: Effects of thickness of electroless Ni-P deposit on corrosion fatigue damage of 7075-T6 under salt spray atmosphere. Mater. Trans. 45, 3201 (2004).Google Scholar