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Tribology of MEMS

Published online by Cambridge University Press:  31 January 2011

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Because of large surface-to-volume ratios and low restoring forces, unwanted adhesion and friction can dominate the performance of microelectromechanical systems (MEMS) devices. To guarantee the function and reliability of MEMS devices, tribologists must understand the origins of adhesion, friction, and wear over a broad range of length scales from the macroscopic to the molecular. In this article, we present an overview of challenges, successes, and initial steps toward a fundamental understanding.

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Research Article
Copyright
Copyright © Materials Research Society 2001

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References

1Sniegowski, J.J. and de Boer, M.P., Annu. Rev. Mater. Sci. 30 (2000) p.297.CrossRefGoogle Scholar
2Mastrangelo, C.H. and Hsu, C.H.Ieee/Asme J.Mems 2 (1993) p.33.Google Scholar
3Mulhern, G.T.Soane, D.S. and Howe, R.T. in Proc. 7th Int. Conf. on Solid-State Sensors and Actuators (Transducers '93) (IEEE Electron Devices Society, Yokohama, Japan, 1993) p.296.Google Scholar
4Guckel, H.Burns, D.W.Visser, C.C.G.Tilmans, H.A.C. and Deroo, D.IEEE Trans. Electron Devices 35 (1988) p.800.CrossRefGoogle Scholar
5Henck, S.A.Tribol. Lett. 3 (1997) p.239.CrossRefGoogle Scholar
6Martin, J.R. and Zhao, Y.U.S. Patent No.5,694, 740 (1997).Google Scholar
7Maboudian, R.Surf. Sci. Rep. 3 (1998) p. 209.Google Scholar
8Bunker, B.C.Carpick, R.W.Assink, R.Thomas, M.L.Hankins, M.G.Voigt, J.A.Sipola, D.L.de Boer, M.P., and Gulley, G.L.Langmuir 16 (2001) p.7742.CrossRefGoogle Scholar
9Kushmerick, J.G.Hankins, M.G.de Boer, M.P., Clews, P.J.Carpick, R.W. and Bunker, B.C.Tribol. Lett. 10 (1–2) (2000) p.103.Google Scholar
10Srinivasan, U.Houston, M.R.Howe, R.T. and Maboudian, R.Ieee/Asme J. MEMS 7 (1998) p.252.Google Scholar
11de Boer, M.P., Knapp, J.A.Michalske, T.A.Srinivasan, U. and Maboudian, R.Acta Mater. 48 (2000) p.4531.CrossRefGoogle Scholar
12Mayer, T.M.de Boer, M.P., Shinn, N.D.Clews, P.J. and Michalske, T.A.J.Vac. Sci. Technol., B 18 (2000) p.2433.Google Scholar
13Smith, B.K.Sniegowski, J.J.LaVigne, G. and Brown, C.Sens. Actuators, A 70 (1998) p.159.CrossRefGoogle Scholar
14Ashurst, W.R.Yau, C.Carraro, C.Howe, R.T. and Maboudian, R. in Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 2000) p.320.Google Scholar
15Zhu, X.Y.Boiadjiev, V.Mulder, J.A.Hsung, R.P. and Major, R.C.Langmuir 16 (2000) p.6766.CrossRefGoogle Scholar
16DePalma, V. and Tillman, N.Langmuir 5 (1989) p.868.CrossRefGoogle Scholar
17Kiely, J.D.Houston, J.E.Mulder, J.A.Hsung, R.P. and Zhu, X.Y.Tribol. Lett. 7 (1999) p.103.CrossRefGoogle Scholar
18Rye, R.R.Nelson, G.C. and Dugger, M.T.Langmuir 13(1997) p.2965.CrossRefGoogle Scholar
19Srinivasan, U.Foster, J.D.Habib, U.Howe, R.T.Maboudian, R.Senft, D.C. and Dugger, M.T.Proc. Solid-State Sensor and Actuator Workshop (Transducers Research Foundation, Cleveland, 2000) p.156.Google Scholar
20Mani, S.S.Fleming, J.G.Sniegowski, J.J.de Boer, M.P., Irwin, L.W.Walraven, J.A.Tanner, D.M. and Van, D.A. La, in Materials Science of Microelectromechanical Systems (MEMS) Devices II, edited by de Boer, M.P., Heuer, A.H.Jacobs, S.J. and Peeters, E. (Mater. Res. Soc. Symp. Proc. 605, Warrendale, PA, 2000) p.135.Google Scholar
21de Boer, M.P., Smith, N.F.Masters, N.D.Sinclair, M.B. and Pryputniewicz, E.J. in ASTM STP 1413 (2001) in press.Google Scholar
22Jensen, B.D.de Boer, M.P., Masters, N.D.Bitsie, F., and Van, D.A. La, IEEE/ASME J.MEMS (2001) in press.Google Scholar
23Jensen, B.D.de Boer, M.P., and Bitsie, F. in Proc. SPIE Materials and Device Characterization in Micromachining, Vol. 3875, edited by Vladimirsky, Y. and Friedrich, C.R. (SPIE—The International Society for Optical Engineering, Bellingham, WA, 1999) p.61.Google Scholar
24Boer, M.P. de and Michalske, T.A.J. Appl. Phys. 86 (1999) p.817.CrossRefGoogle Scholar
25de Boer, M.P., Clews, P.J.Smith, B.K. and Michalske, T.A. in Microelectromechanical Structures for Materials Research, edited by Brown, S.Gilbert, J.Guckel, H.Howe, R.Johnson, G.Krulevitch, P. and Muhlstein, C. (Mater. Res. Soc. Symp. Proc. 518, Warrendale, PA, 1998) p. 131.Google Scholar
26de Boer, M.P., Redmond, J.M. and Michalske, T.A. in Proc. SPIE Materials and Device Characterization in Micromachining, Vol. 3512 (SPIE—The International Society for Optical Engineering, Bellingham, WA, 1998) p.241.CrossRefGoogle Scholar
27Crozier, B.T.de Boer, M.P., Redmond, J.M.Bahr, D.F. and Michalske, T.A. in Materials Science of Microelectromechanical Systems (MEMS) Devices II, edited by de Boer, M.P., Heuer, A.H.Jacobs, S.J. and Peeters, E. (Mater. Res. Soc. Symp. Proc. 605, Warrendale, PA, 2000) p.129..Google Scholar
28Carpick, R.W. and Salmeron, M.Chem. Rev. 97 (1997) p.1163.CrossRefGoogle Scholar
29Salmeron, M. CHEMTECH (September 1998) p.17.Google Scholar
30Barrena, E.Kopta, S.Ogletree, D.F.Charych, D.H. and Salmeron, M.Phys. Rev. Lett. 82 (1999) p.2880.CrossRefGoogle Scholar
31Kim, H.I.Graupe, M.Oloba, O.Koini, T.Imaduddin, S.Lee, T.R. and Perry, S.S.Langmuir 15 (1999) p.3179.CrossRefGoogle Scholar