Micromachining of 10 μM Al–0.5 wt% Cu Films Achieved through Porous Anodization Technique with Reduced Undercutting

Siari Sosa

doi:10.1557/mrs2006.171

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Micromachining of 10 μM Al–0.5 wt% Cu Films Achieved through Porous Anodization Technique with Reduced Undercutting

Published online by Cambridge University Press: 31 January 2011

Siari Sosa

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Type: Research/Researchers
Information: MRS Bulletin , Volume 31 , Issue 9: Density Functional Theory in Materials Research , September 2006 , pp. 655

DOI: https://doi.org/10.1557/mrs2006.171 [Opens in a new window]
Copyright: Copyright © Materials Research Society 2006

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Micromachining of 10 μM Al–0.5 wt% Cu Films Achieved through Porous Anodization Technique with Reduced Undercutting

Volume 31, Issue 9
Siari Sosa
DOI: https://doi.org/10.1557/mrs2006.171

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Micromachining of 10 μM Al–0.5 wt% Cu Films Achieved through Porous Anodization Technique with Reduced Undercutting

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