Hostname: page-component-586b7cd67f-g8jcs Total loading time: 0 Render date: 2024-11-24T17:52:56.614Z Has data issue: false hasContentIssue false
  • English
  • Français

Microelectronics Packaging and Integration

Published online by Cambridge University Press:  31 January 2011

Robert H. Reuss  and
Babu R. Chalamala

Abstract

Core share and HTML view are not available for this content. However, as you have access to this content, a full PDF is available via the ‘Save PDF’ action button.

The focus of this issue of MRS Bulletin is to explore the impact of materials science and technology on microelectronics packaging and integration. Progress in microelectronics packaging has been intimately tied to the continuous advances made in the associated materials, process technologies, and design tools. This is especially true now, as packaging moves into an era driven by the need for complex system-level solutions. This issue is our attempt to present the current status of microelectronics packaging technology and integration and to highlight various perspectives on the future evolution of the field.

Keywords

microelectronics packaging and integrationmicroelectronic materialstechnology roadmaps
Type
Research Article
Information
MRS Bulletin , Volume 28 , Issue 1: Microelectronics Packaging and Integration , January 2003 , pp. 11 - 20
Copyright
Copyright © Materials Research Society 2003