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Metallization of High Thermal Conductivity Materials

Published online by Cambridge University Press:  31 January 2011

Yoshihiko Imanaka  and
Michael R. Notis
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Extract

Great progress in LSI (large-scale integration) has been made over the past 10 years, and more rapid progress is expected in the future. In recent years, the increased circuit density in LSI devices has led to remarkable heat generation, thereby creating thermalmanagement issues for microelectronics packaging. In order to develop highperformance LSI effectively, packaging and system-level configuration of the computer must be modified to handle the heat.

Type
Research Article
Information
MRS Bulletin , Volume 26 , Issue 6: High Thermal Conductivity Materials , June 2001 , pp. 471 - 476
Copyright
Copyright © Materials Research Society 2001

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