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Mechanical Characterization of Thin Films by Micromechanical Techniques

Published online by Cambridge University Press:  29 November 2013

Jan-Åke Schweitz
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Evaluating the mechanical properties of thin films on thick substrates is tricky. Some useful techniques for mechanical property measurements on macroscopic film specimens exist, e.g., internal stress measurements by x-ray diffraction or by wafer buckling. Many conventional techniques, however, such as indentation for hardness measurement or scratch testing for evaluation of adhesion or wear resistance, yield results that are difficult or impossible to evaluate in terms of more fundamental film properties. In fact, these techniques are more practical engineering tools than tools for scientific study.

One solution is to miniaturize the test probe to dimensions approaching the film thickness. The nanoindentation technique for submicrohardness measurement described elsewhere in this issue by Pharr and Oliver is a recent example of such an approach. Still, for very thin films it is difficult to separate the influence of the substrate properties from the film properties, and the indentation process is inherently too complex to be well suited for determining fundamental materials parameters.

The rapidly evolving field of micromechanics offers some new possibilities in thin film characterization. Important film properties such as internal stress, elastic moduli, plastic yield limit, and fracture data can be extracted from experiments with micromachined test structures in the 10–1,000 μm size range.

Type
Mechanical Behavior of Thin Films
Information
MRS Bulletin , Volume 17 , Issue 7 , July 1992 , pp. 34 - 45
Copyright
Copyright © Materials Research Society 1992

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References

1.Hoffman, R.W., in Physics of Nonmetallic Thin Films, edited by Dupuy, C.H.S. and Cachard, A. (Plenum, New York, 1976).Google Scholar
2.Doerner, M.F., Gardner, D.S., and Nix, W.D., J. Mater. Res. 1 (1987) p. 845.CrossRefGoogle Scholar
3.Microindentation Techniques in Materials Science and Engineering, edited by Blau, P.J. and Lawn, B.R. (ASTM, STP 889, 1986).Google Scholar
4.Perry, A.J., Surf. Eng. 2 (1986) p. 183.CrossRefGoogle Scholar
5.Steinmann, P.A., Tardy, Y., and Hintermann, H.E., Thin Solid Films 154 (1987) p. 333.CrossRefGoogle Scholar
6.Hedenqvist, P., PhD thesis, Uppsala University, 1991.Google Scholar
7.Nix, W.D., Met. Trans. 20A (1989) p. 2217.CrossRefGoogle Scholar
8.Boman, M., Westberg, H., Johansson, S., and Schweitz, J-Å., in Proc. IEEE Micro Electro Mechanical Systems, February 4-7, 1992, Travemünde, Germany, p. 162; W.H. Brünger and K.T. Kahlmann, in Proc. IEEE Micro Electro Mechanical Systems, February 4-7, 1992, Travemünde, Germany, p. 168.CrossRefGoogle Scholar
9.Bacher, W., Harmening, M., Bley, P., Kalb, H., Menz, W., Michel, A., and Mohr, J., in Proc. IEEE Micro Electro Mechanical Systems, February 4-7, 1992, Travemünde, Germany, p. 202.Google Scholar
10.Ericson, F. and Schweitz, J-Å., J. Appl. Phys. 68 (1990) p. 5840.CrossRefGoogle Scholar
11.Timoshenko, S.P and Gere, J.M., in Mechanics of Materials (Van Nostrand, New York, 1972), p. 179.Google Scholar
12.Johansson, S., Ericson, F., and Schweitz, J-Å., J. Appl. Phys. 65 (1989) p. 122.CrossRefGoogle Scholar
13.Schweitz, J-Å., J. Micromech. Microeng. 1 (1991) p. 10.CrossRefGoogle Scholar
14.Mullen, R.L., Mehregany, M., Omar, M.P., and Ko, W.H., in Proc. IEEE Micro Electro Mechanical Systems, January 30-February 2, 1991, Nara, Japan, p. 154.CrossRefGoogle Scholar
15.Valli, J., J. Vac. Sci. Technol. A 4 (1986) p. 3007.CrossRefGoogle Scholar
16.Adhesion Measurement of Thin Films, Thick Films, and Bulk Coatings, edited by Mittal, K.L. (ASTM, STP 640, 1978).CrossRefGoogle Scholar
17.Johansson, S., KGustafsson, ., and Schweitz, J-Å., Sensors and Materials 3 (1988) p. 143.Google Scholar
18.Johansson, S., Gustafsson, K., and Schweitz, J-Å., Sensors and Materials 4 (1988) p. 209.Google Scholar
19.Öberg, Å., Mårtensson, N. and Schweitz, J-Å., Met. Trans. 16A (1985) p. 841.CrossRefGoogle Scholar
20.Senturia, S.D., in Digest of Technical Papers, 4th Int. Conf. on Solid-State Sensors and Actuators (Inst. of Electrical Engineers of Japan, 1987), p. 11.Google Scholar
21.Brantley, W.A., J. Appl. Phys. 44 (1973) p. 534.CrossRefGoogle Scholar
22.Vinci, R.P. and Bravman, J.C., in Digest of Technical Papers, 1991 Int. Conf. on Solid-State Sensors and Actuators, p. 943.Google Scholar
23.Weihs, T.P., Hong, S., Bravman, J.C., and Nix, W.D., J. Mater. Res. 3 (1988) p. 931.CrossRefGoogle Scholar
24.Hong, S., Weihs, T.P, Bravman, J.C., and Nix, W.D., in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J.C., Nix, W.D., Barnett, D.M., and Smith, D.A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989) p. 93.Google Scholar
25.Weihs, T.P., Hong, S., Bravman, J.C. and Nix, W.D., in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J.C., Nix, W.D., Barnett, D.M., and Smith, D.A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989), 87.Google Scholar
26.Smith, U., Kristensen, N., Ericson, F., and Schweitz, J-Å., J. Vac. Sci. Technol. A 9 (1991) p. 2527.CrossRefGoogle Scholar
27.Kristensen, N., Ericson, F., Schweitz, J-Å., and Smith, U., J. Appl. Phys. 69 (1991) p. 2097.CrossRefGoogle Scholar
28.Kristensen, N., Ericson, F., Schweitz, J-Å., and Smith, U., Thin Solid Films 197 (1991) p. 67.CrossRefGoogle Scholar
29.Ericson, F., Kristensen, N., Schweitz, J-Å., and Smith, U., J. Vac. Sci. Technol. B 9 (1991) p. 58.CrossRefGoogle Scholar
30.Johansson, S., Schweitz, J-Å., Tenerz, L., and Tirén, J., J. Appl. Phys. 63 (1988) p. 4799.CrossRefGoogle Scholar
31.Ljungcrantz, H., Hultman, L., Sundgren, J-E., Johansson, S., Kristensen, N., Schweitz, J-Å., and Shute, C., submitted.Google Scholar
32.Maseeh, F., Schmidt, M.A., Allen, M.G., and Senturia, S.D., in Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, South Carolina, June 6–9, 1988, p. 84.Google Scholar
33.Ding, X., Ko, W.H., and Mansour, J.M., Sensors and Actuators, A21–A23 (1990) p. 866.CrossRefGoogle Scholar
34.Ding, X., PhD thesis, Case Western Reserve University, 1990.Google Scholar
35.Allen, M.G., Mehregany, M., Howe, R.T. and Senturia, S.D., Appl. Phys. Lett. 51 (1987) p. 241.CrossRefGoogle Scholar
36.Walker, J.A., Gabriel, K.J., and Mehregany, M., in Proc. IEEE Micro Electro Mechanical Systems, Nara, Japan, January 30-February 2, p. 56.Google Scholar
37.Tabata, O., Kawahata, K., Sugiyama, S., and Igarashi, I., Sensors and Actuators 20 (1989) p. 135.CrossRefGoogle Scholar
38.Hong, S., Weihs, T.P., Bravnnan, J.C., and Nix, W.D., J. Electronic Materials 19 (1990) p. 903.CrossRefGoogle Scholar
39.Najafi, K. and Suzuki, K., in Proc. IEEE Micro Electro Mechanical Systems, Salt Lake City, Utah, February 20-22, 1989, p. 96.Google Scholar
40.Tai, Y-C. and Muller, R.S., in Proc. IEEE Micro Electro Mechanical Systems, Napa Valley, California, February 11-14, 1990, p. 147.Google Scholar
41.Guckel, H., Burns, D.W., Tilmans, H.A.C., DeRoo, D.W., and Rutigliano, C.R., in Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, South Carolina, June 6-9, 1988, p. 97.Google Scholar
42.Petersen, K.E. and Guarnieri, C.R., J. Appl. Phys. 50 (1979) p. 6761.CrossRefGoogle Scholar
43.Putty, M.W., Chang, S.C., Howe, R.T, Robinson, A.L., and Wise, K.D., in Proc. IEEE Micro Electro Mechanical Systems, Salt Lake City, Utah, February 20-22, 1989, p. 60.Google Scholar
44.Zhang, L.M., Uttamchandari, D., and Culshaw, B., Sensors and Actuators, A 29 (1991) p. 79.CrossRefGoogle Scholar
45.Hirano, T., Furuhata, T., Gabriel, K.J., and Fujita, H., in Digest of Technical Papers, 1991 Int. Conf. on Solid-State Sensors and Actuators, p. 873.Google Scholar
46.Pratt, R.I., Johnson, G.C., Howe, R.T., and Chang, J.C., Digest of Technical Papers, 1991 Int. Conf. on Solid-State Sensors and Actuators, p. 205.Google Scholar
47.Hall, J.J., Phys. Rev. 161 (1967) p. 756.CrossRefGoogle Scholar
48.Kim, C.K, J. Appl. Phys. 52 (1981) p. 3693.CrossRefGoogle Scholar
49.Grimvall, G., in Thermophysical Properties of Materials (North-Holland, Amsterdam, 1986) p. 61.Google Scholar
50.Krulevitch, P., Howe, R.T., Johnson, G.C. and Huang, J., in Digest of Technical Papers, 1991 Int. Conf. on Solid-State Sensors and Actuators, p. 949.Google Scholar
51.Berry, B.S. and Pritchet, W.C., J. Appl. Phys. 67 (1990) p. 3661.CrossRefGoogle Scholar
52.Lober, T.A., Huang, J., Schmidt, M.A., and Senturia, S.D., in Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, South Carolina, June 6-9, 1988, p. 92.Google Scholar
53.Flowers, D.L., Ristic, L., and Hughes, H.G., in Digest of Technical Papers, 1991 Int. Conf. on Solid-State Sensors and Actuators, p. 961.Google Scholar
54.Hong, S., Weihs, T.P., Bravman, J.C., and Nix, W.D., in Thin Film: Stresses and Mechanical Properties, edited by Bravman, J.C., Nix, W.D., Barnett, D.M., and Smith, D.A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989) p. 93.Google Scholar
55.Burns, D.W. and Guckel, H., J. Vac. Sci. Technol. A 8 (1990) p. 3606.CrossRefGoogle Scholar
56.Maseeh, F. and Senturia, S.D., Sensors and Actuators, A21–A23 (1990) p. 861.CrossRefGoogle Scholar
57.Tong, L., Hsu, J-T., Ko, W.H. and Ding, X., in Digest of Technical Papers, 1991 Int. Conf. on Solid-State Sensors and Actuators, p. 185.Google Scholar
58.Orpana, M. and Korhonen, A.O., in Digest of Technical Papers, 1991 Int. Conf. on Solid-State Sensors and Actuators, p. 957.Google Scholar
59.Guckel, H., Randazzo, T., and Burns, D.W., J. Appl. Phys. 57 (1985) p. 1671.CrossRefGoogle Scholar
60.Fan, L-S., Muller, R.S., Yun, W., Howe, R.T., and Huang, J., in Proc IEEE Micro Electro Mechanical Systems, Napa Valley, California, February 11-14, 1990, p. 177.Google Scholar
61.Mehregany, M., Howe, R.T., and Senturia, S.D., J. Appl. Phys. 62 (1987) p. 3579.CrossRefGoogle Scholar
62.Connally, J.A. and Brown, S.B., in Digest of Technical Papers, 1991 Int. Conf. on Solid-State Sensors and Actuators, p. 953.Google Scholar
63.Hjort, K. and Schweitz, J-Å., Sensors and Materials 2 (1990) p. 1.Google Scholar
64.Tai, Y.C. and Muller, R.S., in Technical Digest, IEEE Solid-State Sensor and Actuator Workshop, Hilton Head Island, South Carolina, June 6-9, 1988, p. 88.Google Scholar
65.Fan, L.S., Howe, R.T., and Muller, R.S., Sensors and Actuators, A21–A23 (1990) p. 872.CrossRefGoogle Scholar
66.Weihs, T.P., Hong, S., Bravman, J.C., and Nix, W.D., in Thin Films: Stresses and Mechanical Properties, edited by Bravman, J.C., Nix, W.D., Barnett, D.M., and Smith, D.A. (Mater. Res. Soc. Symp. Proc. 130, Pittsburgh, PA, 1989) p. 87.Google Scholar
67.Tai, Y-C. and Muller, R.S., Sensors and Actuators, A21–A23 (1990) p. 180.Google Scholar
68.Gabriel, K.J., Makadevan, R., and Mehregany, M., Sensors and Actuators, A21–A23 (1990), p. 184.CrossRefGoogle Scholar
69.Lim, M.G., Chang, J.C., Schultz, D.P., Howe, R.T., and White, R.M., in Proc IEEE Micro Electro Mechanical Systems, Napa Valley, California, February 11-14, 1990, p. 82.Google Scholar
70.Deng, K., Ho, W.H., and Michal, G.M., in Digest of Technical Papers, 1991 Int. Conf. on Solid-State Sensors and Actuators, p. 213.Google Scholar
71.Dhuler, V.R., Mehregany, M., Phillips, S.M., and Lang, J.H., in Proc. IEEE Micro Electro Mechanical Systems, Travemünde, Germany, February 4-7, 1992, p. 171.CrossRefGoogle Scholar
72.Kaneko, R., J. Microscopy 152 (1988) p. 363.CrossRefGoogle Scholar
73.Kaneko, R., Proc. Japan Int. Tribology Conf. '90, Vol. II, Nagoya, Japan, October 29-November 1, 1990, p. 1289.Google Scholar
74.Kaneko, R., in Proc. IEEE Micro Electro Mechanical Systems, Nara, Japan, January 30-February 2, 1991, p. 1.Google Scholar
75.Hirano, M. and Shinjyo, K., Phys. Rev. B 15 (1990) p. 11837.CrossRefGoogle Scholar