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Materials in Electronic Manufacturing: Electronic Packaging
Published online by Cambridge University Press: 29 November 2013
Extract
Electronic packaging involves using an appropriate combination of conductive and dielectric materials to electrically interconnect and mechanically support electronic components in a reliable and cost-effective manner. Since the invention of the integrated circuit in 1959 and mass wave-soldering in 1958, the vast majority of electronic packaging has involved a planar substrate to which semiconductor devices in protective packages are attached by melting eutectic solder. The planar substrates or printed circuit boards (PCBs) were invented in 1940, but their widespread implementation was limited until the invention of mass soldering. PCBs use conventional epoxy-glass dielectric material with mass patterned conductive traces of copper, but alternative materials have been used for either enhanced electrical performance or lower product cost.
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- Materials Manufacturing
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- Copyright © Materials Research Society 1992
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