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Materials for 3D Packaging of Electronic and Optoelectronic Systems

Published online by Cambridge University Press:  31 January 2011

Volkan H. Ozguz  and
James Yamaguchi
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Abstract

Advanced three-dimensional (3D) packaging techniques for electronic components are promising for the realization of “systems-in-packages.” Three-dimensional packages require the use of a variety of materials within a small physical size range. Materials selection is therefore critical from electrical, optical, mechanical, structural, thermal, and manufacturability viewpoints. The materials combination depends also on the intended application for the 3D packaged modules. This article reviews 3D packaging approaches, materials classes, and examples. Three-dimensional packaged systems using judiciously selected materials offer performance advantages that cannot be provided by planar implementation.

Keywords

electronic materialsmicroelectronics packaging and integrationthree-dimensional (3D) packaging techniques
Type
Research Article
Information
MRS Bulletin , Volume 28 , Issue 1: Microelectronics Packaging and Integration , January 2003 , pp. 35 - 40
Copyright
Copyright © Materials Research Society 2003

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