Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-11-27T20:47:01.305Z Has data issue: false hasContentIssue false
  • English
  • Français

High-Aspect-Ratio Structures for MEMS

Published online by Cambridge University Press:  31 January 2011

Stella W. Pang
Get access

Extract

Many microelectromechanical systems (MEMS) use the changing capacitance of movable parallel plates to drive and sense motion. An increase in this capacitance improves the performance of these micromechanical structures by means of increased electromechanical coupling for lower driving voltages and increased sensitivity of the micromechanical motion.

Type
Research Article
Information
MRS Bulletin , Volume 26 , Issue 4: Microelectromechanical Systems (MEMS): Technology and Applications , April 2001 , pp. 307 - 308
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1Tang, W.C. T.Nguyen, C.H.Judy, M.W. and Howe, R.T.Sens. Actuators, A 21–23 (1990) p. 328.CrossRefGoogle Scholar
2Bustillo, J.M.Howe, R.T. and Muller, R.S. in Proc. IEEE 86 (1998) p. 1552.CrossRefGoogle Scholar
3Weigold, J.W.Juan, W.H. and Pang, S.W.J. Electrochem. Soc. 145 (1998) p. 1767.CrossRefGoogle Scholar
4Weigold, J.W.Juan, W.H.Pang, S.W. and Borenstein, J.T.J. Vac. Sci. Technol., B 17 (1999) p. 1336.CrossRefGoogle Scholar
5Juan, W.H. and Pang, S.W.J. Vac. Sci. Technol., B 12 (1994) p. 422.CrossRefGoogle Scholar
6Juan, W.H. and Pang, S.W.IEEE/ASME J. MEMS 5 (1996) p. 18.CrossRefGoogle Scholar
7Stern, M.B. and Medeiros, S.S.J. Vac. Sci. Technol., B 10 (1992) p. 2520.CrossRefGoogle Scholar
8Klaassen, E.H.Petersen, K.Noworolski, J.M.Logam, J.Maluf, N.I.Brown, J.Storment, C.McCulley, W. and Kovacs, G.T.A.Sens. Actuators, A 52 (1996) p. 132.CrossRefGoogle Scholar
9Yunkin, V.A.Fischer, D. and Voges, E.Microelectron. Eng. 23 (1994) p. 373.CrossRefGoogle Scholar
10Juan, W.H. and Pang, S.W.J. Vac. Sci. Technol., A 14 (1996) p. 1189.CrossRefGoogle Scholar
11Weigold, J.W. and Pang, S.W.IEEE/ASME J. MEMS 7 (1998) p. 201.CrossRefGoogle Scholar
12Weigold, J.W.Wong, A.C.Nguyen, C.T.C. and Pang, S.W.IEEE/ASME J. MEMS 8 (1999) p. 221.CrossRefGoogle Scholar
13Juan, W.H. and Pang, S.W.J. Vac. Sci. Technol., B 14 (1996) p. 4080.CrossRefGoogle Scholar
14Juan, W.H. and Pang, S.W.IEEE/ASME J. MEMS 7 (1998) p. 207.CrossRefGoogle Scholar