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Evaporation Processes

Published online by Cambridge University Press:  29 November 2013

R.F Bunshah  and
C.V. Deshpandey
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Extract

Physical vapor deposition (PVD) technology consists of the basic techniques of evaporation deposition and sputter deposition. PVD is used to deposit films and coatings or self-supported shapes such as sheet, foil, tubing, etc. The thickness of the deposits can vary from angstroms to millimeters.

Applications range widely, from decorative to utilitarian and over significant segments of the engineering, chemical, nuclear, microelectronics, and related industries. They have been increasing rapidly because modern high technology demands multiple and often conflicting sets of properties from engineering materials, e.g., combination of two or more of the following: high temperature strength, impact strength, specific optical, electrical or magnetic properties, wear resistance, fabricability into complex shapes, biocompatibility, cost, etc. A single or monolithic material cannot meet such demands. The solution is a composite material, a core material and a coating each having the requisite properties to meet the specifications.

This article will review evaporation-based deposition technologies, theory and mechanisms, processes, deposition of various types of materials, and also the evolution of the microstructure and its relationship to the properties of the deposits.

The first evaporated thin films were probably prepared by Faraday in 1857 when he exploded metal wires in a vacuum. The deposition of thin metal films in vacuum by Joule heating was discovered in 1887 by Nahrwold and was used by Kundt in 1888 to measure refractive indices of such films. In the ensuing period, the work was primarily of academic interest, concerned with optical phenomena associated with thin layer of metals, research into kinetics and diffusion of gases, and gas-metal reactions.

Type
Deposition Processes
Information
MRS Bulletin , Volume 13 , Issue 12 , December 1988 , pp. 33 - 39
Copyright
Copyright © Materials Research Society 1988

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References

1.Faraday, M., Philos. Trans. 147 (1857) p. 145.Google Scholar
2.Nahrwold, R., Ann. Physik 31 (1887) p. 467.Google Scholar
3.Kundt, A., Ann. Physik 34 (1888) p. 473.Google Scholar
4.Soddy, F., Proc. R. Soc. London 78 (1967) p. 429.Google Scholar
5.Langmuir, I., J. Am. Chem. Soc. 35 (1918) p. 931.CrossRefGoogle Scholar
6.Glang, R., in Handbook of Thin Film Technology, edited by Maissel, L.I. and Glang, R. (McGraw-Hill, 1970) p. 1–7.Google Scholar
7.Handbook of Thin Film Technology, edited by Maissel, L.I. and Gland, R. (McGraw-Hill, 1970).Google Scholar
8.Holland, L., Vacuum Deposition of Thin Films (Chapman & Hall, 1956).Google Scholar
9. (a) Science and Technology of Surface Coatings, edited by Chapman, B.N. and Anderson, J.C. (Academic Press, 1974). (b) Deposition Technologies for Films and Coatings, edited by R.F. Bunshah (Noyes Publications, 1982).Google Scholar
10.Allen, J.A., Rev. Pure Appl. Chem. 4 (1954) p. 133.Google Scholar
11.Bassett, G.A. and Pashley, D.W., J. Inst. Metals 87 (1958) p. 449.Google Scholar
12.Hoffman, R.W., Thin Films (American Society for Metals, 1964) p. 99.Google Scholar
13.Hoffman, R.W., Physics of Thin Films 3 (Academic Press, New York, 1966) p. 246.Google Scholar
14.Buckel, W., J. Vac. Sci. Technol. 6 (1969) p. 606.CrossRefGoogle Scholar
15.Kinosita, K., Thin Solid Films (1972) p. 17.CrossRefGoogle Scholar
16.Graper, E.P., J. Vac. Sci. Tech. 8 (1971) p. 333 and J. Vac. Sci. Tech. 10 (1973) p. 100.CrossRefGoogle Scholar
17.Smith, H.R., Proc. 12th Annual Technical Conference (Soc. of Vac. Coaters, Detroit, MI, 1969) p. 50–54.Google Scholar
18.Riley, T.C., “The Structure and Mechanical Properties of Physical Vapor Deposited Chromium,” PhD thesis, Stanford University, November 1974.Google Scholar
19.Bunshah, R.F. and Juntz, R.S., Trans. Vac. Met. Conf. (Amer. Vac. Soc., 1967) p. 799.Google Scholar
20.Chow, R. and Bunshah, R.F., J. Vac. Sci. Tech. 8, VM 73 (1971).CrossRefGoogle Scholar
21.Nimmaagadda, R. and Bunshah, R.F., J. Vac. Sci. Tech. 8, VM 85 (1971).CrossRefGoogle Scholar
22.Szekely, J. and Poveromo, J.J., Met. Trans. 5 (1974) p. 289.CrossRefGoogle Scholar
23.Chopra, K.L., in Thin Film Phenomena (McGraw-Hill, New York, 1969) p. 10.Google Scholar
24. (a) Cocca, M.A. and Stauffer, L.H., Trans. Vac. Met. Conf. (Amer. Vac. Soc., 1963) p. 203. (b) J.R. Morley, Trans. Vac. Met. Conf. (Amer. Vac. Soc, 1966) p. 186.Google Scholar
25.Moll, E. and Daxinger, H., “Method and Apparatus for Evaporating Materials in a Vacuum Coating Plant,” U.S. Patent 4 254 159 (December 23, 1977).Google Scholar
26.Lindfors, P.A., Mularie, W.M., and Wehner, G.K., Surf. Coat. Technol., in press.Google Scholar
27.Boxman, R.L-, Goldsmith, S., Shaley, S., Yaloz, H., and Brosh, N., Thin Solid Films 139 (1986) p. 41.CrossRefGoogle Scholar
28.Martin, P.J., McKenzie, D.R., Nettersfield, R.P., Swift, P., Filibczuk, S.W., Muller, K.H., Pacey, C.G., and James, B., Thin Solid Films 153 (1987) p. 91.CrossRefGoogle Scholar
29.Lunev, V.M., Padalka, V.G., and Khyoroshikh, V.M., Soc. Phys. Tech. Phys. 22 (1977) p. 858.Google Scholar
30.Martin, P.J., Vacuum 36 (1986) p. 585.CrossRefGoogle Scholar
31.Daalder, J.E., Physich. C. 104 (1981) p. 91.Google Scholar
32.Juttner, B., J. Phys. D. 141 (1981) p. 1265.Google Scholar
33.Plyutte, A.A., Ryzhkev, V.N., and Kapin, A.T., Soc. Phys. JETP 20 (1965) p. 328.Google Scholar
34.McClure, G.W., J. Appl. Phys. 45 (1974) p. 2078.CrossRefGoogle Scholar
35.Shaley, S., Goldsmith, S., and Boxman, R.L., IEEE Trans. Plasma Sci. 22 (1983) p. 146.CrossRefGoogle Scholar
36.Aksenov, I.I., Konovalov, I.I., Kudryautseva, E.E., Kunchenko, V.V., Padalka, V.G., and Khyoroshikh, V.M., Ser. Phys. Tech. Phys. 29 (1984) p. 893.Google Scholar
37.Tuma, D.T., Chen, C.L., and Davies, D.K., J. Appl. Phys. 49 (1979) p. 3821.CrossRefGoogle Scholar
38.Martin, P.J., Nettersfield, R.P., McKenzie, D.R., Falconer, I.S., Pacey, C.G., Tomas, P., and Sainty, W.G., J. Vac. Sei. Technol. A5 (1) (1987) p. 22.CrossRefGoogle Scholar
39.Eckhardt, G., J. Appl. Phys. 46 (1975) p. 3282.CrossRefGoogle Scholar
40.Kasasev, I.G. and Pashkova, V.V., Sov. Phys.-Tech. Phys. 4 (1959) p. 254.Google Scholar
41.Doronov, A.M., Mubeyadzhyan, S.A., Pomelov, Y., and Strukov, Yu. A., J. Appl. Mech. Techn. Phys. 22 (1982) p. 28.CrossRefGoogle Scholar
42.Aksenov, I.I., Belous, V.A., Padalka, V.G., and Khoroshikh, V.M., Soc. J. Plasma Phys. 4 (1980) p. 425.Google Scholar
43.Aksenov, I.I., Vakula, S.I., Padalka, V.G., Strel'sitskii, V.E. and Khoroshik, V.M., Sov. Phys.-Tech. Phys. 25 (1980) p. 1164.Google Scholar
44.Asksenov, I.I., Bren, V.G., Padalka, V.G., and Khoroshik, V.M., Sov. Phys. Tech. Phys. 23 (1978) p. 651.Google Scholar
45.Sanders, D.M. and Pyle, F.A., J. Vac. Sci. Technol., in press.Google Scholar
46.Bunshah, R.F., in Deposition Technologies for Films and Coatings, edited by Bunshah, R.F. (Noyes Publications, 1982) p. 116.Google Scholar
47.Abe, T., Inagawa, K., Obasa, R., Murakamu, Y., Proc. 12th Symp. on Fusion Technol. (Zurich, F.F.G., September 1982).Google Scholar
48.Bunshah, R.F., “The Activated Reactive Evaporation Process,” U.S. Patent No. 3 791 852 (1974).Google Scholar
49.Bunshah, R.F. and Deshpandey, C.V., “Activated Reactive Evaporation Process,” in Physics of Thin Films 13, edited by Vossen, J.L. and Framcombe, M.H. (Academic Press, New York, 1987) p. 59.Google Scholar
50.Bunshah, R.F., Chopra, K.L., Deshpandey, C.V., and VVankar, D., U.S. Patent No. 4 714 625 (1987).Google Scholar
51.Chopra, K.L., Agarawal, V., Vankar, V.D., Deshpandey, C.V., and Bunshah, R.F., Thin Solid Films 126 (1985) p. 307.CrossRefGoogle Scholar
52.Lin, P., Deshpandey, C., Doerr, H.J., Bunshah, R.F., Chopra, K.L., and Vankar, V.D., Thin Solid Films 153 (1987) p. 487.CrossRefGoogle Scholar