Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Sun, Rong
and
White, Mary Anne
2004.
Thermal Conductivity.
p.
239.
Tsai, S.
Lee, C.
Chiou, G.
and
Duh, J.
2005.
Elemental Redistribution and Diffusion Path Configuration Near the Edge of Sn-95Pb Solder Bump/Ni-Cu UBM Joints after Aging in the Flip-Chip Technology.
p.
1.
Hsiao, Li-yin
and
Duh, Jenq-gong
2005.
Intermetallic Compound Formation and Diffusion Path Evolution in the Flip Chip Sn-37Pb Solder Bump after Aging.
p.
1.
Lee, N. T. S.
Tan, V. B. C.
and
Lim, K. M.
2006.
Structural and mechanical properties of Sn-based intermetallics from ab initio calculations.
Applied Physics Letters,
Vol. 89,
Issue. 14,
Hsiao, Li-Yin
Chiou, Guo-Jyun
Duh, Jenq-Gong
and
Tsai, Su-Yueh
2006.
Synthesis and Application of Novel Lead-Free Solders Derived from Sn-based Nanopowders.
p.
1.
Jang, Guh-Yaw
and
Duh, Jenq-Gong
2006.
elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging.
Journal of Electronic Materials,
Vol. 35,
Issue. 11,
p.
2061.
Hsu, Yu-Ching
and
Duh, Jenq-Gong
2006.
Diffusion behavior of Cu in Cu/electroless Ni and Cu/electroless Ni/Sn-37Pb solder joints in flip chip technology.
Journal of Electronic Materials,
Vol. 35,
Issue. 12,
p.
2164.
Hsiao, Li-Yin
and
Duh, Jenq-Gong
2006.
Revealing the nucleation and growth mechanism of a novel solder developed from Sn-3.5Ag-0.5Cu nanoparticles by a chemical reduction method.
Journal of Electronic Materials,
Vol. 35,
Issue. 9,
p.
1755.
Jang, Guh-Yaw
Duh, Jenq-Gong
Takahashi, Hideyuki
and
Su, David
2006.
Solid-state reaction in an Au wire connection with an Al-Cu pad during aging.
Journal of Electronic Materials,
Vol. 35,
Issue. 2,
p.
323.
Bailey, Christopher
Hsiao, Li‐Yin
and
Duh, Jenq‐Gong
2006.
Intermetallic compound formation and diffusion path evolution in eutectic tin‐lead flip chip solder bumps after aging.
Soldering & Surface Mount Technology,
Vol. 18,
Issue. 2,
p.
18.
Lee, Hsiang-Yi
and
Duh, Jenq-Gong
2006.
Influence of Ni concentration and Ni3Sn4 nanoparticles on morphology of Sn-Ag-Ni solders by mechanical alloying.
Journal of Electronic Materials,
Vol. 35,
Issue. 3,
p.
494.
Hsiao, Li-Yin
Jang, Guh-Yaw
Wang, Kai-Jheng
and
Duh, Jenq-Gong
2007.
Inhibiting AuSn4 Formation by Controlling the Interfacial Reaction in Solder Joints.
Journal of Electronic Materials,
Vol. 36,
Issue. 11,
p.
1476.
Wang, Dong
Ma, Xiaosong
and
Guo, Dan
2007.
Reliability Analysis of Lead-free Flip Chip Solder Joint.
p.
1.
Jin-Woo Park
Young-Bok Yoon
and
Joon-Gil Lee
2009.
The Fracture Resistance of Bonded Au Wires for Interconnection.
IEEE Transactions on Components and Packaging Technologies,
Vol. 32,
Issue. 1,
p.
106.
Lu, Nanshu
Zhang, Zhen
Yoon, Juil
and
Suo, Zhigang
2012.
Singular stress fields at corners in flip-chip packages.
Engineering Fracture Mechanics,
Vol. 86,
Issue. ,
p.
38.
Ge, Rong
Zhang, Yan
Liu, Yujian
Fang, Jun
Luan, Weilin
and
Wu, Guozhang
2017.
Effect of Gd2O3 addition on mechanical, thermal and shielding properties of Al2O3 ceramics.
Journal of Materials Science: Materials in Electronics,
Vol. 28,
Issue. 8,
p.
5898.
Bedford, Denise
and
Sanchez, Thomas W.
2021.
Working Methods for Knowledge Management: Knowledge Networks.
p.
75.