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Development and Application of an Abrasive-Free Polishing Solution for Copper

Published online by Cambridge University Press:  31 January 2011

Masanobu Hanazono ,
Jin Amanokura  and
Yasuo Kamigata
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Abstract

An abrasive-free polishing (AFP) solution for chemical–mechanical planarization (CMP) of copper films on semiconductor wafers has been developed to overcome such disadvantages of conventional CMP as dishing, erosion, Cu and oxide loss, and microscratching. Electrochemical methods are an effective way of understanding the role of each chemical component in the AFP solution in order to optimize its performance. Analysis of the reaction layer of Cu elucidates the reasons for the excellent results that have been obtained. By applying the AFP solution for Cu CMP in combination with a slurry for CMP of the metal barrier layer, seven-level multilayer Cu interconnections can be successfully fabricated.

Keywords

abrasive-free polishingchemical–mechanical planarizationchemical–mechanical polishingCMPchemical reactivityelectronic materialssemiconductor materials.
Type
Research Article
Information
MRS Bulletin , Volume 27 , Issue 10: Advances in Chemical-Mechanical Planarization , October 2002 , pp. 772 - 775
Copyright
Copyright © Materials Research Society 2002

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