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Chip-to-Module Interconnections Using “Sea of Leads” Technology

Published online by Cambridge University Press:  31 January 2011

Muhannad S. Bakir ,
Hollie A. Reed ,
Anthony V. Mulé ,
Joseph Paul Jayachandran ,
Paul A. Kohl ,
Kevin P. Martin ,
Thomas K. Gaylord  and
James D. Meindl
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Abstract

The drive toward higher density and higher performance in integrated circuits creates a need to keep interconnects short and eliminate layers of packaging. In this article, we propose a novel, ultrahigh-density (exceeding 104 leads per cm2), compliant, wafer-level, input/output interconnection technology called “sea of leads” as a key enabling technology for future high-performance microsystems. The mechanical compliance is addressed through slippery leads (leads released from the surface) and embedded air gaps. The ability to fabricate embedded air gaps has enabled the integration of optical interconnects with high index-of-refraction mismatches between the core and cladding.

Keywords

elastic propertieselectronic materialsinterconnectionsmicroelectronics packaging and integrationoptical propertiessemiconductors
Type
Research Article
Information
MRS Bulletin , Volume 28 , Issue 1: Microelectronics Packaging and Integration , January 2003 , pp. 61 - 67
Copyright
Copyright © Materials Research Society 2003

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