Hostname: page-component-cd9895bd7-jkksz Total loading time: 0 Render date: 2024-12-25T01:43:14.892Z Has data issue: false hasContentIssue false
  • English
  • Français

Applications of lead-free piezoelectric materials

Published online by Cambridge University Press:  10 August 2018

Kenji Shibata ,
Ruiping Wang ,
Tonshaku Tou  and
Jurij Koruza
Kenji Shibata
Affiliation:
SCIOCS Co., Ltd., Japan; [email protected]
Ruiping Wang
Affiliation:
National Institute of Advanced Industrial Science and Technology, Japan; [email protected]
Tonshaku Tou
Affiliation:
Honda Electronics Co., Ltd., Japan; [email protected]
Jurij Koruza
Affiliation:
Technische Universität Darmstadt, Germany; [email protected]
Get access

Abstract

The piezoelectric properties of lead-free ferroelectric materials have been dramatically improved over the past two decades. For some limited applications, their properties have reached the same levels or have even surpassed the properties of the benchmark lead-based material Pb(Zr,Ti)O3 (PZT). Initial commercial lead-free products, including powders, ceramic components, films, and devices (e.g., ultrasonic cleaner, knocking sensor), are now available on the market. Several prototype devices, such as inkjet printheads, ultrasonic motors, angular sensors, and energy harvesters, have been developed. Their overall performance is still inferior to that of PZT-based devices; however, these prototypes and products point the way for future applications. Here, we provide an overview of recent industrial developments in the field and discuss the main advantages and disadvantages of lead-free piezoceramics for individual applications.

Keywords

piezoelectricceramicactuatorsensorenvironmentally protective
Type
Lead-free Piezoceramics
Information
MRS Bulletin , Volume 43 , Issue 8: Lead-free Piezoceramics , August 2018 , pp. 612 - 616
Copyright
Copyright © Materials Research Society 2018 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

Saito, Y., Takao, H., Tani, T., Nonoyama, T., Takatori, K., Homma, T., Nagaya, T., Nakamura, M., Nature 432, 84 (2004).CrossRefGoogle Scholar
Rödel, J., Webber, K.G., Dittmer, R., Jo, W., Kimura, M., Damjanovic, D., J. Eur. Ceram. Soc. 35, 1659 (2015).CrossRefGoogle Scholar
RoHS, “Study to Assess Renewal Requests for 29 RoHS 2 Annex III Exemptions” (Report, 2016), http://rohs.exemptions.oeko.info/fileadmin/user_upload/RoHS_Pack_9/RoHS_Ex_Project_Description_Pack_9_R.pdf#search=%27Study+to+assess+renewal+requests+for+29+RoHS+2+Annex+III+exemptions%27.Google Scholar
Koruza, J., Bell, A.J., Frömling, T., Webber, K.G., Wang, K., Rödel, J., J. Materiomics 4, 13 (2018).CrossRefGoogle Scholar
Shimosato, M., Tanuma, C., Toshiba Rev. 67, 45 (2012).Google Scholar
Maruyama, M., “Tokyo Institute of Technology and Konica Minolta Succeeded in Preparing Inkjet Head Using Lead-Free Piezoelectric Ceramics” (in Japanese) Nikkei Technology Online Press release, July 14, 2008, https://tech.nikkeibp.co.jp/dm/article/NEWS/20080714/154755.Google Scholar
Kawada, S., Kimura, M., Higuchi, Y., Takagi, H., Appl. Phys. Express 2, 111401 (2009).CrossRefGoogle Scholar
Kawada, S., Hayashi, H., Ishii, H., Kimura, M., Ando, A., Omiya, S., Kubodera, N., Materials 8, 7423 (2015).CrossRefGoogle Scholar
Liu, C., Liu, P., Kobayashi, K., Randall, C.A., J. Electroceram. 32, 301 (2014).CrossRefGoogle Scholar
Gao, L.S., Ko, S.W., Guo, H.Z., Hennig, E., Randall, C.A., J. Am. Ceram. Soc. 99, 2017 (2016).CrossRefGoogle Scholar
Sapper, E., Gassmann, A., Gjødvad, L., Jo, W., Granzow, T., Rödel, J., J. Eur. Ceram. Soc. 34, 653 (2014).CrossRefGoogle Scholar
Matsuoka, T., Kozuka, H., Kitamura, K., Yamada, H., Kurahashi, T., Yamazaki, M., Ohbayashi, K., J. Appl. Phys. 116, 154104 (2014).CrossRefGoogle Scholar
Ohbayashi, K., Piezoelectric Materials (InTech Open, Vienna, Austria, 2016).Google Scholar
http://www.kwfi.co.kr.Google Scholar
Tou, T., Hamaguti, Y., Maida, Y., Yamamori, H., Takahashi, K., Terashima, Y., Jpn. J. Appl. Phys. 48, 07GM03 (2009).CrossRefGoogle Scholar
Doshida, Y., Kishimoto, S., Ishii, K., Kishi, H., Tamura, H., Tomikawa, Y., Hirose, S., Jpn. J. Appl. Phys. 46, 4921 (2007).CrossRefGoogle Scholar
Doshida, Y., Kishimoto, S., Irieda, T., Tamura, H., Tomikawa, Y., Hirose, S., Jpn. J. Appl. Phys. 47, 4242 (2008).CrossRefGoogle Scholar
Hong, C., Han, H., Lee, J., Wang, K., Yao, F., Li, J., Gwon, J., Quyet, N.V., Jung, J., Jo, W., J. Sens. Sci. Technol. 24 (4), 228 (2015).CrossRefGoogle Scholar
https://www.piceramic.com/en.Google Scholar
https://www.ceramtec.com.Google Scholar
https://www.meggittferroperm.com.Google Scholar
Levassort, F., Grégoire, J.M., Lethiecq, M., Astafiev, K., Nielsen, L., Lou-Moeller, R., Wolny, W.W., IEEE Int. Ultrasonics Symp. (2011), p. 848.Google Scholar
Bantignies, C., Filoux, E., Mauchamp, P., Dufait, R., Thi, M.P., Rouffaud, R., Grégoire, J.M., Levassort, F., IEEE Int. Ultrasonics Symp. (2013), p. 785.Google Scholar
http://www.cerpotech.com.Google Scholar
Fujii, E., Takayama, R., Nomura, K., Murata, A., Hirasawa, T., Tomozawa, A., Fujii, S., Kamada, T., Torii, H., IEEE Trans. Ultrason. Ferroelectr. Freq. Control 54, 2431 (2007).CrossRefGoogle Scholar
EPSON, “Modern Piezo Technology” (in Japanese), http://www.epson.jp/technology/core_technology/inkjet/micro_piezo.htm.Google Scholar
Nicolas, S., Allain, M., Bridoux, C., Fanget, S., Lesecq, S., Zarudniev, M., Bolis, S., Pouydebasque, A., Jacquet, F., Proc. MEMS 2015 (2015), p. 65.Google Scholar
Saito, T., Wada, T., Adachi, H., Kanno, I., Jpn. J. Appl. Phys. 43, 6627 (2004).CrossRefGoogle Scholar
Nakashima, Y., Sakamoto, W., Maiwa, H., Shimura, T., Yogo, T., Jpn. J. Appl. Phys. 46, L311 (2007).CrossRefGoogle Scholar
Shibata, K., Oka, F., Ohishi, A., Mishima, T., Kanno, I., Appl. Phys. Express 1, 011501 (2008).CrossRefGoogle Scholar
Shibata, K., Suenaga, K., Watanabe, K., Horikiri, F., Nomoto, A., Mishima, T., Jpn. J. Appl. Phys. 50, 041503 (2011).CrossRefGoogle Scholar
Hitachi Metals Ltd., “Succeeded in Developing Triaxial Angular Rate Sensor Using Lead-Free Piezoelectric Thin Film” (in Japanese), http://www.hitachi-metals.co.jp/press/pdf/2014/20141021.pdf. Press release, October 21, 2014.Google Scholar
Le Van, M., Motoaki, H., Fumimasa, H., Kenji, S., Tomoyoshi, M., Hiroki, K., J. Micromech. Microeng. 23, 035029 (2013).Google Scholar
Tsujiura, Y., Suwa, E., Kurokawa, F., Hida, H., Suenaga, K., Shibata, K., Kanno, I., Jpn. J. Appl. Phys. 52, 09KD13 (2013).CrossRefGoogle Scholar
Tanaka, Y., Harigai, T., Ueda, M., Adachi, H., Fujii, E., J. Am. Ceram. Soc. 95, 3547 (2012).CrossRefGoogle Scholar