Hostname: page-component-cd9895bd7-jkksz Total loading time: 0 Render date: 2024-12-25T04:16:33.921Z Has data issue: false hasContentIssue false

Conductive Adhesives for Electronic Assemblies

Published online by Cambridge University Press:  31 January 2011

Get access

Abstract

A number of different types of adhesives are used in the assembly of electronic components and devices. This article provides an overview of such adhesives that also have another job–they work at conducting electricity or heat. The resins or binders in these adhesives range from thermosetting to pressure-sensitive. Conductivity is obtained by the judicious choice of filler. For electrically conducting adhesives, the fillers range from silver flake to silver-coated fibers. For thermally conducting adhesives, the fillers range from aluminum oxide to boron nitride. We also discuss a specific type of electrically conducting adhesive–the z-axis film adhesive. In these adhesives, particles are oriented in such a fashion that allows conduction in the direction perpendicular to the adhesive, but not in the plane of the adhesive.

Type
Research Article
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Kusy, R.P., J. Appl. Phys. 48 (1977) p. 5301.CrossRefGoogle Scholar
2.Rabilloud, G., High Performance Polymers, Vol. 1: Conductive Adhesives (Editions TECHNIP, Paris, 1997).Google Scholar
3.Reynolds, O., Philos. Trans. R. Soc. London, Ser. A 177 (1886) p. 157; see alsoGoogle Scholar
Dowson, D., History of Tribology (Longman, London, 1979) p. 322.Google Scholar
4.Sweet, J.N., in Thermal Measurements in Electronic Cooling, Chapter 5, edited by Azar, K. (CRC Press, New York, 1997).Google Scholar
5.Chui, C.-P., Solbrekken, G.L., and Chung, T.D., in Proc. SEMITHERM XIII Symp. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1997) p. 57.Google Scholar
6.Devpura, A. and Phelan, P.E., in Proc. ITHERM 2000 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 2000) p. 21.Google Scholar
7.Masayuki, T., Tateda, S., Kimura, T., and Yamato, M., U.S. Patent Application 20010004131 (June 21, 2001).Google Scholar
8.Tead, S., Bluem, G., and McCormick, F., in Proc. Soc. of Plastics Eng. Reg. Tech. Conf.: Plastics for Portable Electronics Conf. (Society of Plastics Engineers, Brookfield, CT, 1995) p. 114.Google Scholar
9.Hung, K.S., Rudman, R.L., and Murray, C., in Proc. ISIC-99 (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1999) p. 402.Google Scholar
10.Tummala, R.R. and Rymaszewski, E.J., Micro electronics Handbook (Van Nostrand Reinhold, New York, 1977) p. 268.Google Scholar
11.Bruner, D., Int. J. Microcirc. Electron. Packag. 18 (3) (1995).Google Scholar
12.Nishimura, H. and Kishimoto, Y., in Proc. First Int. Electron. Manuf. Symp. (Institute of Electrical and Electronics Engineers, Piscataway, NJ, 1997).Google Scholar
13.Pocius, A.V., Adhesion and Adhesives Technology: An Introduction, 2nd ed., Chapters 8, 9, and 10 (Hanser Gardner, Munich, 2002).Google Scholar
14.Dunn, D.J., Vano, P.P., Moran, J.P. Jr, Holmes, M., and Frauenglass, E., U.S. Patent No. 4,722,960 (February 2, 1988).Google Scholar
15.Moon, J.D., Ward, G.R., and Webb, R.J., European Patent No. EP0566093 (October 20, 1993).Google Scholar