Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-11-24T11:26:11.819Z Has data issue: false hasContentIssue false
  • English
  • Français

Adhesives for Elevated-Temperature Applications

Published online by Cambridge University Press:  31 January 2011

S. Millington  and
S. J. Shaw
Get access

Abstract

Although adhesives, particularly those based on epoxy resins, are finding increasing use in structural applications, their utilization at elevated temperature (>150°C) has been limited by their relatively poor thermal and thermo-oxidative stability. As a result, significant effort has been directed in recent years toward the development of polymers exhibiting increased thermal resistance. Although a wealth of research conducted over several decades has resulted in a myriad of polymer types exhibiting, in some cases, impressive high-temperature performance, many systems have demonstrated poor processability Thus, much emphasis has been placed on developing high-temperature performance while providing processability characteristics that are similar, if not identical, to epoxies. This article considers the various approaches that have been shown to offer such dual capabilities. In addition, the results of various studies undertaken to investigate the effects of elevated temperature on the strength and fatigue resistance of bonded joints are reported.

Keywords

adhesivesglass transitionthermal properties
Type
Research Article
Information
MRS Bulletin , Volume 28 , Issue 6: Materials Science of Adhesives: How to Bond Things Together , June 2003 , pp. 428 - 433
Copyright
Copyright © Materials Research Society 2003

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Lin, S.-C. and Pearce, E.M., High-Performance Thermosets: Chemistry, Properties, Applications (Hanser Gardner, Cincinnati, 1994).Google Scholar
2.Hergenrother, P.M., ed., High Performance Polymers, Advances in Polymer Science, Vol. 117 (Springer-Verlag, New York, 1994).CrossRefGoogle Scholar
3.May, C.A., ed., Epoxy Resins: Chemistry and Technology, 2nd ed. (Marcel Dekker, New York, 1988).Google Scholar
4.Hamerton, I., ed., Chemistry and Technology of Cyanate Ester Resins (Blackie, Glasgow, 1994).CrossRefGoogle Scholar
5.Wilson, D., Stenzenberger, H.D., and Hergenrother, P.M., Polyimides (Blackie, Glasgow, 1990).CrossRefGoogle Scholar
6.Shaw, S.J., in Rubber Toughened Engineering Plastics, edited by Collyer, A.A. (Chapman & Hall, New York, 1994) p. 310.CrossRefGoogle Scholar
7.Pinnavaia, T.J. and Beall, G.W., eds., Polymer-Clay Nanocomposites (John Wiley & Sons, New York, 2000).Google Scholar
8.Proc. Organic-Inorganic Hybrids II: Science, Technology, Applications (Paint Research Association, Teddington, UK, 2002).Google Scholar
9. Manufacturers' data: difunctional epoxy, 120°C cure—Cytec Engineered Materials Inc., FM73 film adhesive, February 1997; difunctional epoxy, 175°C cure—Ciba-Geigy Redux 319A, instruction sheet No. RTA.65d, October 1983; polyfunctional epoxy—Hexcel Composites, Redux 322, publication RTC020US, February 1999; modified bismaleimide—Hexcel Composites, Redux 326, publication RTA029, January 1997; norbornene polyimide—Cytec Engineered Materials Inc., FM35 adhesive film, June 1994; condensation polyimide—Cytec Engineered Materials Inc., FM57 film adhesive, June 1998; condensation polyimide—Cytec Engineered Materials Inc., FM680–1 film adhesive, May 1998.Google Scholar
10.Shaw, S.J., in Rubber Toughened Engineering Plastics, edited by Collyer, A.A. (Chapman & Hall, New York, 1994) p. 165.CrossRefGoogle Scholar
11. Manufacturer's data: difunctional epoxy 175°C cure—Ciba-Geigy Redux 319A, instruction sheet No. RTA.65d, October 1983; condensation polyimide—Cytec Engineered Materials Inc., FM57 film adhesive, June 1998; condensation polyimide—Cytec Engineered Materials Inc., FM680–1 film adhesive, May 1998.Google Scholar
12.Digby, R.P., Millington, S., O'Gara, P.M., and Shaw, S.J., in Proc. Euradh 2000 (Société Française du Vide, Paris, 2000) p. 610.Google Scholar
13.Ashcroft, I.A., Hughes, D.J., and Shaw, S.J., in Abstr. Pap. Am. Chem. Soc. 218 (Part 2) (American Chemical Society, Washington, DC, 1999).Google Scholar
14. Manufacturers' data: cyanate ester film— Hexcel Composites, Redux A54, in Redux Film Adhesives, Foaming Films, Pastes, and Primers, publication RTU128, April 2002; bismaleimide paste adhesive—Polymerics, Technical data sheet PX-309, http://www.polymerics.de/products/bmi/px-309_en.html (accessed April 2003); bismaleimide film adhesive—Hexcel Composites, Redux HP655, publication RTA076US, February 1999; bismaleimide paste adhesive— Polymerics, Technical data sheet PX-300, http://www.polymerics.de/products/bmi/px-300_en.html (accessed April 2003).Google Scholar