Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-24T18:53:43.487Z Has data issue: false hasContentIssue false
  • English
  • Français

Study on the Temperature Dependency Effect of Thermal Coefficient of Resistance in Amorphous Silicon for Uncooled Microbolometer Application

Published online by Cambridge University Press:  02 January 2019

Junkyo Jeong ,
Byeongjun Jeong ,
Jaeseop Oh  and
Gawon Lee
Junkyo Jeong
Affiliation:
Chungnam National University, Deajoen, Republic of Korea
Byeongjun Jeong
Affiliation:
Chungnam National University, Deajoen, Republic of Korea
Jaeseop Oh
Affiliation:
National NanoFab Center, Deajoen, Republic of Korea
Gawon Lee*
Affiliation:
Chungnam National University, Deajoen, Republic of Korea
*
*(Email: [email protected])
Get access

Abstract

In this paper, we studied the temperature dependency effect of thermal coefficient of resistance (TCR) in amorphous silicon (a-Si) on the properties of uncooled microbolometer with a-Si as a resistance layer by simulation. The temperature of the microbolometer rises during the operation mainly due to the heat generated by Joule heating as well as IR radiation. Generally, the TCR of a-Si is treated as a constant for the simplicity but the absolute value of TCR has been reported to decrease as the temperature increases. Therefore, to improve the device characteristics, the effect of temperature dependency of TCR in a-Si should be considered carefully in the range of the operating temperature. The responsivities of microbolometer are simulated according to the width of the resistance layer (W) with TCR as a function of temperature, which shows that the optimal W condition is affected by the TCR value changed by the temperature.

Keywords

sensormicroelectromechanical systems (MEMS)
Type
Articles
Information
MRS Advances , Volume 4 , Issue 8: Thermal Properties and Thermoelectric Materials , 2019 , pp. 447 - 455
Copyright
Copyright © Materials Research Society 2018 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Liger, M., Uncooled Carbon Microbolometer Imager, (California Institute of Technology, 2006).Google Scholar
Niklaus, F., Vieider, C., and Jakobsen, H., MEMS/MOEMS tech. appl. III 6836, 68360D (2008).Google Scholar
Bhan, R. K., Saxena, R. S., Jalwania, C. R., and Lomash, S. K., Def. Sci. J. 59, 580–589 (2009).CrossRefGoogle Scholar
Kylili, A., Fokaides, P. A., Christou, P., Kalogirou, S. A., Appl. Energy 134, 531–549 (2014).CrossRefGoogle Scholar
Rogalski, A., Prog. Quant. Elect. 27, 59–210 (2003).CrossRefGoogle Scholar
Sizov, F. F., Phys. Quan. Elect. Optoelec. 3, 52–58 (2000).Google Scholar
Tezcan, D. S., Kocer, F., and Akin, T., Int. Conf. on Solid-State Sensors & Actuators (TRANSDUCERS’99) 610–613 (1999).Google Scholar
Bhan, R. K., Saxena, R. S., Jalwania, C. R., and Lomash, S. K., Def. Sci. J. 59, 580–589 (2009).CrossRefGoogle Scholar
Ha, W. H., kang, H. K., Kim, M. C., Moon, S., Oh, M. H., Kim, D. H., and Choi, J. S., The Korean Institute of Electrical Engineers 1137–1139 (1999).Google Scholar
Battal, E., Bolat, S., Tanrikulu, M. Y., Okyay, A. K., and Akin, T., phys. Stat. sol. 211, 2475–2482 (2014).Google Scholar
Lee, M. H., Kang, Y. H., Jung, E. S., Kang, T. Y., and Kang, E. G., The Korean Institute of Electrical and Electronic Material Engineers 10, 238–239 (2009).Google Scholar
Abtew, T. A., Zhang, M., and Drabold, D. A., Phys. Rev. B. 76, 045212 (2007).CrossRefGoogle Scholar
Bergman, T.L., Incropera, F.P., DeWitt, D.P. and Lavine, A.S., Fundamentals of heat and mass transfer, (John Wiley & Sons, 2011).Google Scholar
Milonni, P.W., The quantum vacuum: an introduction to quantum electrodynamics, (Academic press, 2013).Google Scholar
Yon, J.J., Biancardini, L., Tissot, J.L., Letellier, L., Advanced Microsystems for Automotive Applications 2003, (Springer, 2003).Google Scholar
Kruse, P.W., and Skatrud, D.D., Uncooled infrared imaging arrays and systems, p.62 (Academic Press, 1997).Google Scholar