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Study of the thermal conductivity of a metal-coated multi-walled carbon nanotube using molecular dynamics atomistic simulations

Published online by Cambridge University Press:  03 January 2019

Dinesh Bommidi ,
Ravindra Sunil Dhumal  and
Iman Salehinia
Dinesh Bommidi
Affiliation:
Department of Mechanical Engineering, University of Rochester, Rochester, NY14627
Ravindra Sunil Dhumal
Affiliation:
Department of Mechanical Engineering, Northern Illinois University, DeKalb, IL60115
Iman Salehinia*
Affiliation:
Department of Mechanical Engineering, Northern Illinois University, DeKalb, IL60115
*
*(Email: [email protected])
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Abstract

Thermal conductivity of a nickel-coated tri-wall carbon nanotube was studied using molecular dynamics where both the phonon and electron contributions were considered. Simulations predicted a significant effect of the metal coating on the thermal conductivity, i.e. 50% decrease for 1.2 nm of Ni coating. However, the decreasing rate of the thermal conductivity is minuscule for the metal thicker than 1.6 nm. The smaller thermal conductivity of the metal coating, phonon scattering at the interface, and less impacted heat transfer on the inner tubes of the carbon nanotube rationalized the observed trends.

Keywords

thermal conductivitycoatingsimulation
Type
Articles
Information
MRS Advances , Volume 4 , Issue 8: Thermal Properties and Thermoelectric Materials , 2019 , pp. 507 - 513
Copyright
Copyright © Materials Research Society 2019 

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References

REFERENCES

Sarvar, F., Whalley, D.C., and Conway, P.P., in Electron. Syst. Technol. Conf. 2006 1st (2006), pp. 1292–1302.CrossRefGoogle Scholar
Yu, C., Shi, L., Yao, Z., Li, D., and Majumdar, A., Nano Lett. 5, 1842 (2005).CrossRefGoogle Scholar
Kim, P., Shi, L., Majumdar, A., and McEuen, P.L., Phys. Rev. Lett. 87, 215502 (2001).CrossRefGoogle Scholar
Marconnet, A.M., Panzer, M.A., and Goodson, K.E., Rev. Mod. Phys. 85, 1295 (2013).CrossRefGoogle Scholar
Qiu, L., Wang, X., Su, G., Tang, D., Zheng, X., Zhu, J., Wang, Z., Norris, P.M., Bradford, P.D., and Zhu, Y., Sci. Rep. 6, srep21014 (2016).CrossRefGoogle Scholar
Lian, F., Llinas, J.P., Li, Z., Estrada, D., and Pop, E., Appl. Phys. Lett. 108, 103101 (2016).CrossRefGoogle Scholar
Qiu, A., Bahr, D.F., Zbib, A.A., Bellou, A., Mesarovic, S.D., McClain, D., Hudson, W., Jiao, J., Kiener, D., and Cordill, M.J., Carbon 49, 1430 (2011).CrossRefGoogle Scholar
Smith, K.A., Zbib, M.B., Bahr, D.F., and Guinel, M.J.-F., MRS Commun. 4, 77 (2014).CrossRefGoogle Scholar
Stano, K.L., Chapla, R., Carroll, M., Nowak, J., McCord, M., and Bradford, P.D., ACS Appl. Mater. Interfaces 5, 10774 (2013).CrossRefGoogle Scholar
Rodríguez-Manzo, J.A., Tolvanen, A., Krasheninnikov, A.V., Nordlund, K., Demortière, A., and Banhart, F., Nanoscale 2, 901 (2010).CrossRefGoogle Scholar
Guo, S., Nanoscale 2, 2521 (2010).CrossRefGoogle Scholar
Hu, X., Pan, L.S., Gu, G., and Goodson, K.E., 597 (2009).Google Scholar
Fujii, M., Zhang, X., Xie, H., Ago, H., Takahashi, K., Ikuta, T., Abe, H., and Shimizu, T., Phys. Rev. Lett. 95, 065502 (2005).Google Scholar
Volkov, A.N., Salaway, R.N., and Zhigilei, L.V., J. Appl. Phys. 114, 104301 (2013).CrossRefGoogle Scholar
Zhong, H. and Lukes, J.R., Phys. Rev. B 74, 125403 (2006).CrossRefGoogle Scholar
Varshney, V., Lee, J., Li, D., Brown, J.S., Farmer, B.L., Voevodin, A.A., and Roy, A.K., Carbon 114, 15 (2017).CrossRefGoogle Scholar
Salaway, R.N. and Zhigilei, L.V., Phys. Rev. B 94, 014308 (2016).CrossRefGoogle Scholar
Evans, W.J., Shen, M., and Keblinski, P., Appl. Phys. Lett. 100, 261908 (2012).CrossRefGoogle Scholar
Xu, Z. and Buehler, M.J., ACS Nano 3, 2767 (2009).CrossRefGoogle Scholar
Evans, W.J. and Keblinski, P., Nanotechnology 21, 475704 (2010).CrossRefGoogle Scholar
Hu, G.-J. and Cao, B.-Y., J. Appl. Phys. 114, 224308 (2013).CrossRefGoogle Scholar
Inoue, S. and Matsumura, Y., Chem. Phys. Lett. 495, 80 (2010).CrossRefGoogle Scholar
Inoue, S. and Matsumura, Y., Chem. Phys. Lett. 469, 125 (2009).CrossRefGoogle Scholar
Song, H.-Y. and Zha, X.-W., Phys. B Condens. Matter 406, 992 (2011).CrossRefGoogle Scholar
Zhu, F., Liao, H., Tang, K., Chen, Y., and Liu, S., J. Nanomater. 2015, e767182 (2015).Google Scholar
Savage, T. and Rao, A.M., in Therm. Conduct. - Theory Prop. Appl., edited by Tritt, T., 1st ed. (Springer, New York, 2004), pp. 262–276.Google Scholar
Wang, Y., Ruan, X., and Roy, A.K., Phys. Rev. B 85, 205311 (2012).CrossRefGoogle Scholar
Aliev, A.E., Lima, M.H., Silverman, E.M., and Baughman, R.H., Nanotechnology 21, 035709 (2010).CrossRefGoogle Scholar
Das, S., Lahiri, D., Lee, D.-Y., Agarwal, A., and Choi, W., Carbon 59, 121 (2013).CrossRefGoogle Scholar
Zhang, Y., Franklin, N.W., Chen, R.J., and Dai, H., Chem. Phys. Lett. 331, 35 (2000).CrossRefGoogle Scholar
Plimpton, S., J. Comput. Phys. 117, 1 (1995).CrossRefGoogle Scholar
Stuart, S.J., Tutein, A.B., and Harrison, J.A., J. Chem. Phys. 112, 6472 (2000).CrossRefGoogle Scholar
Mishin, Y., Farkas, D., Mehl, M.J., and Papaconstantopoulos, D.A., Phys. Rev. B 59, 3393 (1999).CrossRefGoogle Scholar
Tang, X., Xie, Z., Yin, T., Wang, J.-W., Yang, P., and Huang, Q., Phys. Chem. Chem. Phys. 15, 16314 (2013).CrossRefGoogle Scholar
Salaway, R.N. and Zhigilei, L.V., Int. J. Heat Mass Transf. 70, 954 (2014).CrossRefGoogle Scholar
Ren, C., Zhang, W., Xu, Z., Zhu, Z., and Huai, P., J. Phys. Chem. C 114, 5786 (2010).CrossRefGoogle Scholar
Ho, C.Y., Powell, R.W., and Liley, P.E., J. Phys. Chem. Ref. Data 3, I (1974).Google Scholar
Ou, M.N., Yang, T.J., Harutyunyan, S.R., Chen, Y.Y., Chen, C.D., and Lai, S.J., Appl. Phys. Lett. 92, 063101 (2008).Google Scholar
Hida, S. , Hori, T., Shiga, T., Elliott, J., Shiomi, J., , Int. J. of Heat Mass Tran. 67, 1024 (2013).CrossRefGoogle Scholar
Ju, S., Liang, X., and Wang, S., J. Phys. D: Appl. Phys. 43(8), 085407 (2010).CrossRefGoogle Scholar
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