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Nanoscale temperature of plasmonic HAMR heads by polymer imprint thermal mapping

Published online by Cambridge University Press:  19 June 2017

Gregory T. Hohensee ,
Tan Nguyen ,
Ella Pek ,
Wan Kuang ,
Ozgun Suzer  and
Marc Finot
Gregory T. Hohensee*
Affiliation:
Western Digital Corporation, 1250 Reliance Way, Fremont CA94539, U.S.A.
Tan Nguyen
Affiliation:
Western Digital Corporation, 1250 Reliance Way, Fremont CA94539, U.S.A.
Ella Pek
Affiliation:
Department of Materials Science and Engineering, Materials Research Laboratory, University of Illinois at Urbana-Champaign, Urbana, IL61801, U.S.A.
Wan Kuang
Affiliation:
Western Digital Corporation, 1250 Reliance Way, Fremont CA94539, U.S.A. Department of Electrical and Computer Engineering, Boise State University, Boise, ID83725, U.S.A.
Ozgun Suzer
Affiliation:
Western Digital Corporation, 1250 Reliance Way, Fremont CA94539, U.S.A.
Marc Finot
Affiliation:
Western Digital Corporation, 1250 Reliance Way, Fremont CA94539, U.S.A.
*
*(Email: [email protected])
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Abstract

Polymer imprint thermal mapping (PITM) is a high-resolution thermal mapping technique that is especially valuable for nanoscale plasmonic devices. PITM leverages a ∼50 nm polymer film coating that crosslinks irreversibly with temperature, which records the peak temperature rise of the surface in the local, linear reduction of polymer film thickness. Using AFM to measure topography before and after heating, but not during operation, PITM sidesteps plasmonic artifacts seen in other near-field thermometries, where the probe tip disturbs and is heated directly by the near- and far-field radiation around the plasmonic device. This is notably troublesome for characterizing heat-assisted magnetic recording (HAMR) heads for next-generation hard disk drives. HAMR heads use near-field transducers (NFTs) to focus light on a magnetic media, heating a nanoscale region to its Curie temperature to enable magnetic writing. The PITM proof-of-concept was introduced at The Magnetic Recording Conference (TMRC) in 2015: here, we present a mature technique capable of benchmarking finite-element thermal simulations of nanoscale devices.

Keywords

thermal conductivitypolymeroptical
Type
Articles
Information
MRS Advances , Volume 2 , Issue 58-59: Nanomaterials , 2017 , pp. 3607 - 3612
Copyright
Copyright © Materials Research Society 2017 

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