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Mechanics of Interfacial Bonding in Dissimilar Soft Transient Materials and Electronics

Published online by Cambridge University Press:  08 June 2016

Reihaneh Jamshidi ,
Yuanfen Chen ,
Kathryn White ,
Nicole Moehring  and
Reza Montazami
Reihaneh Jamshidi
Affiliation:
Mechanical Engineering, Iowa State University, Ames, IA 50011, U.S.A.
Yuanfen Chen
Affiliation:
Mechanical Engineering, Iowa State University, Ames, IA 50011, U.S.A.
Kathryn White
Affiliation:
Ames National Laboratory, Department of Energy, Ames, IA 50011, U.S.A.
Nicole Moehring
Affiliation:
Applied Sciences, University of Wisconsin-Stout, Menomonie, WI 54751, U.S.A.
Reza Montazami*
Affiliation:
Mechanical Engineering, Iowa State University, Ames, IA 50011, U.S.A. Ames National Laboratory, Department of Energy, Ames, IA 50011, U.S.A.
*
*(Email: [email protected])
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Abstract

Soft transient electronics of polymeric substrates and silver-ink electronics are studied for correlated mechanical-electrical properties. Experimental and predictive finite element analysis are used to understand, explain and predict delamination, cracking, buckling, and failure of printed conductive components of such systems. An active transient polymer system consisting of poly(vinyl alcohol) and sodium bicarbonate is introduced that results in byproducts (alkaline and bubbles) when undergoing transiency. These byproducts are facilitated to control and expedite transiency of the electronic components based on redispersion of metallic nano/micro materials. Complete mechanical and electrical characterization of such systems is reported.

Keywords

polymerbondingnanostructure
Type
Articles
Information
MRS Advances , Volume 1 , Issue 36: Soft Materials and Biomaterials , 2016 , pp. 2501 - 2511
Copyright
Copyright © Materials Research Society 2016 

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References

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