Hostname: page-component-586b7cd67f-t7fkt Total loading time: 0 Render date: 2024-11-24T07:30:46.379Z Has data issue: false hasContentIssue false
  • English
  • Français

Impact of CMOS TiN metal gate process on microstructure and its correlation with electrical properties

Published online by Cambridge University Press:  30 January 2019

Pushpendra Kumar ,
Florian Domengie ,
Charles Leroux ,
Patrice Gergaud  and
G. Ghibaudo
Pushpendra Kumar*
Affiliation:
STMicroelectronics, 850 rue Jean Monnet, 38926, Crolles Cedex, France Univ. Grenoble Alpes, CEA, LETI, 38000Grenoble, France, IMEP-LAHC, Minatec/INPG, BP 257, 38016Grenoble, France
Florian Domengie
Affiliation:
STMicroelectronics, 850 rue Jean Monnet, 38926, Crolles Cedex, France
Charles Leroux
Affiliation:
Univ. Grenoble Alpes, CEA, LETI, 38000Grenoble, France,
Patrice Gergaud
Affiliation:
Univ. Grenoble Alpes, CEA, LETI, 38000Grenoble, France,
G. Ghibaudo
Affiliation:
IMEP-LAHC, Minatec/INPG, BP 257, 38016Grenoble, France
*
*(Email: [email protected])
Get access

Abstract

In this paper, the effect of TiN metal gate deposition conditions on the crystal orientation and size of TiN grains has been investigated. We have focused on process conditions that reduce the grain size or provide a unique orientation, which might impact CMOS threshold voltage variability. We have shown that the grain size can be significantly modulated by the RF power and pressure, with grain size as low as 5.2 nm. Further it has been shown that for a few optimized conditions, a unique grain orientation can be obtained. Then, the impact of these process conditions on TiN gate mechanical stress and electrical properties has been investigated. Mechanical stress and sheet resistance are modulated by pressure and RF power and have been correlated to the deposition rate and TiN grain size respectively. The effect of TiN process conditions on MOS capacitor effective workfunction (WFeff) has been investigated, and the trend is opposite to the expected modulation of the intrinsic TiN metal gate workfunction with grain orientation. On the contrary, WFeff variation is well correlated to the Ti/N ratio, suggesting an effect related to dipole at the SiO2/high-k interface.

Keywords

crystalelectrical propertiesgrain sizenanostructurephysical vapor deposition (PVD)
Type
Articles
Information
MRS Advances , Volume 4 , Issue 27: Processing and Manufacturing , 2019 , pp. 1565 - 1571
Copyright
Copyright © Materials Research Society 2019 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Dadgour, H. F., Endo, K., De, V., and Banerjee, K., IEEE-TED 57, 2504 - 2514 (2010).CrossRefGoogle Scholar
Matsukawa, T., Liu, Y., Mizubayashi, W., Tsukada, J., and Yamauchi, H., IEDM, 8.2.1–8.2.4(2012).Google Scholar
Thornton, J. A., Journal of Vacuum Science & Technology 11, 666–670 (1974).CrossRefGoogle Scholar
Charbonnier, M., Leroux, C. et al. , IEEE TED, 57, 1809-1819 (2010)CrossRefGoogle Scholar
Nix, W. D., Metall. Trans. A, 20A, 2217, (1989).CrossRefGoogle Scholar
Chaoumead, A., Sung, Y., and Kwak, D., Advances in Condensed Matter Physics 2012, 65158 (2012).CrossRefGoogle Scholar
Dobrev, D., Thin Solid Films 92, 41-53 (1982).CrossRefGoogle Scholar
Shen, Y.G., Materials Science and Engineering 359 (1-2), 158–167 (2003).CrossRefGoogle Scholar
Janssen, G.C.A.M., Abdalla, M.M., van Keulen, F., Thin Solid Films, 517, 1858–1867 (2009).CrossRefGoogle Scholar
D’Heurle, F. M., and Harper, J. M. E. et al. , Thin Solid Films 171(1), 81-92 (1989).CrossRefGoogle Scholar
Leroux, C., Baudot, S., and Charbonnier, M., Solid-State Electronics 88, 21-26 (2013).CrossRefGoogle Scholar
Baudot, S., Ph.D. thesis, Universite de Grenoble, 2012.Google Scholar
Lee, S. H., Choi, R., and Choi, C., Microelectronic Engineering 109, 160–162 (2013).CrossRefGoogle Scholar
Kumar, P. et al. IEDM (2018).Google Scholar