Hostname: page-component-586b7cd67f-t7czq Total loading time: 0 Render date: 2024-11-24T16:34:40.625Z Has data issue: false hasContentIssue false
  • English
  • Français

Effect of annealing and process parameters on microstructure and properties of DC Magnetron Sputtered Ni-Zr alloy thin films

Published online by Cambridge University Press:  30 January 2017

Bibhu P. Sahu  and
Rahul Mitra
Bibhu P. Sahu*
Affiliation:
Department of Metallurgical and Materials Engineering, Indian Institute of Technology, Kharagpur, 721302, West Bengal, India
Rahul Mitra
Affiliation:
Department of Metallurgical and Materials Engineering, Indian Institute of Technology, Kharagpur, 721302, West Bengal, India
*
*(Email: [email protected])
Get access

Abstract

Ni-Zr alloy thin films were processed by DC magnetron sputtering of high purity Ni and Zr targets in ultrahigh vacuum at ambient temperature, with the substrate being subjected to either 0 V or -60 V bias. Some of the as-deposited films were annealed in vacuum at 700°C for 1 h. Surface profilometer and atomic force microscope were used to measure the film thickness and surface roughness, respectively. X-ray diffraction and cross-sectional TEM analysis have shown dispersion of nano-sized Ni3Zr dispersed in nanocrystalline Ni matrix. Nano-indentation and scratch tests conducted at 2 mN load have shown variation of hardness, Young′s modulus, scratch resistance, and coefficient of friction with substrate bias and annealing due to changes in grain size and surface roughness.

Keywords

annealingthin filmsputtering
Type
Articles
Information
MRS Advances , Volume 2 , Issue 27: Mechanical Behavior and Failure Mechanisms of Materials , 2017 , pp. 1441 - 1448
Copyright
Copyright © Materials Research Society 2017 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Turnow, H., Wendrock, H. and Menzel, S., Thin Solid Films 561, 48 (2014).Google Scholar
Bhattacharya, D., Chandrasekhar Rao, T.V., Bhushan, K.G. and Arya, A., J. Alloys Compd. 649, 746 (2015).Google Scholar
Apreutesei, M., Boissy, C., Mary, N., Steyer, P., Acta Materialia 89, 305 (2015).Google Scholar
Ghidelli, M., Gravier, S. and Blandin, J., J. Alloys Compd.615, 348 (2014).Google Scholar
Wang, D. P. and Wang, S.L., Corros.Sci. 59, 88 (2012).Google Scholar
Mihailov, L., Spassov, T. and Bojinov, M., Int. J. Hydrogen Energy 37, 10499 (2012).Google Scholar
Ghosh, G., J.Mater. Res. 9, 598 (1994).Google Scholar
Chopra, K.L., Thin Film Phenomena. (Mc-Graw Hill Book Company, New York, 1969) p. 137.Google Scholar
Kumar, M., Mishra, S., Mitra, R., Surf. Coat.Technol. 228, 100 (2013); 251, 239 (2014).Google Scholar