Hostname: page-component-586b7cd67f-2plfb Total loading time: 0 Render date: 2024-11-28T01:18:02.217Z Has data issue: false hasContentIssue false
  • English
  • Français

CMP Challenges for Advanced Technology Nodes

Published online by Cambridge University Press:  16 May 2017

John H Zhang ,
Haigou Huang ,
Andrew M. Greene ,
Ruilong Xie ,
Soon-Cheon Seo ,
Pietro Montanini ,
Wei-Tsu Tseng ,
Stan Tsai ,
Matthew Malley  and
Qiang Fang
...Show all authors
John H Zhang*
Affiliation:
GLOBALFOUNDRIES, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
Haigou Huang
Affiliation:
GLOBALFOUNDRIES, 400 Stone break road extension, Malta, NY 12020
Andrew M. Greene
Affiliation:
IBM Research, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
Ruilong Xie
Affiliation:
GLOBALFOUNDRIES, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
Soon-Cheon Seo
Affiliation:
IBM Research, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
Pietro Montanini
Affiliation:
IBM Research, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
Wei-Tsu Tseng
Affiliation:
GLOBALFOUNDRIES, 400 Stone break road extension, Malta, NY 12020
Stan Tsai
Affiliation:
GLOBALFOUNDRIES, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
Matthew Malley
Affiliation:
IBM Research, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
Qiang Fang
Affiliation:
GLOBALFOUNDRIES, 400 Stone break road extension, Malta, NY 12020
Raghuveer Patlolla
Affiliation:
IBM Research, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
Dinesh Koli
Affiliation:
GLOBALFOUNDRIES, 400 Stone break road extension, Malta, NY 12020
Dechao Guo
Affiliation:
IBM Research, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
Donald F. Canaperi
Affiliation:
IBM Research, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
Charan Surisetty
Affiliation:
IBM Research, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
Jean E Wynne
Affiliation:
IBM Research, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
Walter Kleemeier
Affiliation:
GLOBALFOUNDRIES, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
Cathy Labelle
Affiliation:
GLOBALFOUNDRIES, Albany Nanotechnology Center, 257 Fuller Road, Albany, NY 12203
*
*Email: [email protected], [email protected]
Get access

Abstract

The CMP challenges for advanced technology nodes are discussed. Global and local uniformity challenges and their cumulative effects are presented. Uniformity improvements for advanced node integration were achieved through slurry, pad and platen optimization, innovative integration schemes, the reduction of incoming variation and the reduction of cumulative effects. We discuss reduction of typical CMP defect types. Defects resulting from simple mechanisms (foreign material, polish residues) and those resulting from chemical and physical interactions (corrosion, chemical attack, scratches, physical migration) and strategies for control are studied. Defectivity reduction measures include new post-CMP clean chemicals, new slurries and pads and reduction of incoming defectivity. Finally we discuss an observed tradeoff between good defectivity and good uniformity.

Keywords

CMPCudefects
Type
Articles
Information
MRS Advances , Volume 2 , Issue 44: Electronic Devices and Materials , 2017 , pp. 2361 - 2372
Copyright
Copyright © Materials Research Society 2017 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Zhang, J. H., Tseng, W-T., Economikos, L., Fang, Q., Zheng, J., Yang, L., Canaperi, D. F., Lofaro, M., Kim, B., Hu, C. K., Liniger, E. G., Murphy, R., Leo Tai, T. L., Kleemeier, W., Goldberg, C., Muncy, J., Chen, X. and Sampson, R., Mater. Res. Soc. Symp. Proc., 1428, 12-1428-c06-03( 2012).Google Scholar
Tseng, W.-T., Canaperi, D. F., Zhang, J. H., Fang, Q., Zheng, J., Ticknor, A., Tai, L., MacDougal, J., Economikos, L., Muncy, J., Chen, X., Proc. of ASMC, 57( 2012).Google Scholar
Tseng, W.-T., in Advances in Chemical Mechanical Planarization (CMP), Edit by Babu, S. V., (Elsevier, 2016), pp.433–462.Google Scholar
Zhang, J.H., Venigalla, R., Stoll, D. C., Wallner, J., Thompson, J. F., Sun, J., Zhuang, H., Xiao, C., Koo, J.E., Park, J. E., Kleemier, W., Barla, K., Truong, C., Chen, X., and Sampson, R., Proc. VMIC, 25, 95 (2008).Google Scholar
Tseng, W.-T., Mohan, K., Hull, R., Hagan, J., Truong, C., Lehuu, D. K., and Muradian, D., ECS.J. Solid State Sci. & Tech., 5 (9), P546(2016).Google Scholar
Zhang, J. H., Economikos, L., Tseng, W-T, Choi, J., Fang, Q., Tang, T J., Salfelder, J., Truong, C. and Ferreira, P., Mater. Res. Soc. Symp. Proc., 1249, 1249-E01-06 (2010).CrossRefGoogle Scholar
Zhang, J. H., Xiao, C., Strane, J., Venigalla, R., Economikos, L., Hall, L., Chen, J., Stoll, D. C., Wallner, J., Zhuang, H., Ferreira, P., Kleemeier, W., Goldberg, C., Moon, Y., Truong, C., Sudijono, J., Chen, X. and Sampson, R., Mater. Res. Soc. Symp. Proc., 1335, 1335–11-854( 2011).Google Scholar
Zhang, J. H., Tseng, W-T, Chen, T., Kim, B., Flaitz, P., Kleemier, W., Goldberg, C., Truong, C. and Grunow, S., Mater. Res. Soc. Symp. Proc., 1560, 1560-13-993( 2013).Google Scholar
Chang, F.-C., Tanawade, S., Singh, R.K., J. Electrochem. Soc. 156 (1), H39 (2009).Google Scholar
Jindal, A., Hegde, S., Babu, S.V., Electrochem. Solid State Lett. 5 (7), G48 (2002).Google Scholar
Coutinho, C.A., Mudhivarthi, S.R., Kumar, A., Gupta, V.K., Appl. Surf. Sci. 255, 309(2008).Google Scholar
Zhang, J. H., U.S. Patent No. 8 992 692 (31 March 2015).Google Scholar