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Adhesion Improvement of Polyimide/PDMS Interface by Polyimide Surface Modification

Published online by Cambridge University Press:  26 January 2016

Shivani Joshi ,
Antonie van Loon ,
Angel Savov  and
Ronald Dekker
Shivani Joshi*
Affiliation:
Department of Microelectronics, TU Delft, Mekelweg 4, 2628 CD, Delft, The Netherlands Philips Research Eindhoven, High Tech Campus 4, 5656AE, Eindhoven, The Netherlands
Antonie van Loon
Affiliation:
Department of Microelectronics, TU Delft, Mekelweg 4, 2628 CD, Delft, The Netherlands
Angel Savov
Affiliation:
Department of Microelectronics, TU Delft, Mekelweg 4, 2628 CD, Delft, The Netherlands Philips Research Eindhoven, High Tech Campus 4, 5656AE, Eindhoven, The Netherlands
Ronald Dekker
Affiliation:
Department of Microelectronics, TU Delft, Mekelweg 4, 2628 CD, Delft, The Netherlands Philips Research Eindhoven, High Tech Campus 4, 5656AE, Eindhoven, The Netherlands
*
*(Email: [email protected])
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Abstract

Silicon wafers coated with a 5μm thick layer of polyimide were treated with different surface modification techniques such as chemical adhesion promoters, oxygen plasma and an Ar+ sputter etch. After surface modification, the wafers were molded with a 1mm thick layer of PDMS. The adhesion of the PDMS was tested by peel testing and by using a Nordson DAGE wedge shear tester. It was found that commercially available chemical adhesion promoters and oxygen plasma treatment resulted in a very poor PI/PDMS adhesion, whereas the Ar+ sputter etch resulted in an adhesion so strong that the PDMS could not be delaminated from the PI surface without the failure of the material.

Keywords

polymeradhesionsputtering
Type
Articles
Information
MRS Advances , Volume 1 , Issue 1: Biomaterials and Soft Materials , 2016 , pp. 33 - 38
Copyright
Copyright © Materials Research Society 2016 

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References

REFERENCES

Hoefnagels, J. P. M., et al. "Copper–rubber interface delamination in stretchable electronics." Scripta Materialia 63.8 (2010): 875–878.CrossRefGoogle Scholar
Frinking, Peter JA, et al. "Ultrasound contrast imaging: current and new potential methods." Ultrasound in Medicine & Biology 26.6 (2000): 965–975.CrossRefGoogle Scholar
Lamuraglia, Michele, et al. "Clinical relevance of contrast-enhanced ultrasound in monitoring anti-angiogenic therapy of cancer: current status and perspectives." Critical Reviews in Oncology/Hematology 73.3 (2010): 202–212.CrossRefGoogle Scholar
Wu, Sheng-Kai, et al. "Short-time focused ultrasound hyperthermia enhances liposomal doxorubicin delivery and antitumor efficacy for brain metastasis of breast cancer." International Journal of Nanomedicine 9 (2014): 4485.Google Scholar
Daft, Chris MW. "Conformable transducers for large-volume, operator-independent imaging." Ultrasonics Symposium (IUS), 2010 IEEE. IEEE, 2010.Google Scholar
Dhayal, Marshal, et al. "The surface chemistry resulting from low-pressure plasma treatment of polystyrene: The effect of residual vessel bound oxygen." Applied Surface Science 252.22 (2006): 7957–7963.CrossRefGoogle Scholar