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Determination of the Elastic and Plastic Properties of Transversely Isotropic Thin Films on Substrates by Sharp Indentation

Published online by Cambridge University Press:  16 January 2018

Zheng Zhi  and
T. A. Venkatesh
Zheng Zhi
Affiliation:
Department of Materials Science and Chemical Engineering, Stony Brook University, NY 11794
T. A. Venkatesh*
Affiliation:
Department of Materials Science and Chemical Engineering, Stony Brook University, NY 11794
*
*(Email: [email protected])
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Abstract

A combination of dimensional analysis and finite element modeling was invoked to characterize the indentation behavior of transversely isotropic thin films on substrate materials. Through indentation simulations of over 13,500 combinations of properties for the thin film system, functional relationships that connect the indentation responses of the thin films with the elastic and plastic properties of the thin films were obtained. The forward algorithms that predict the indentation response characteristics from known material properties and the reverse algorithms that predict the material properties from known indentation responses were verified to be very accurate. Thus, the viability of using the indentation method to determine the elastic and plastic properties of transversely isotropic thin films on substrate materials was demonstrated.

Keywords

nano-indentationelastic propertieshardness
Type
Articles
Information
MRS Advances , Volume 3 , Issue 8-9: Theory, Characterization and Modeling , 2018 , pp. 445 - 450
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Copyright
Copyright © Materials Research Society 2018 

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References

REFERENCES

VanLandingham, M. R., J Res Natl Inst Stand Technol 108 (4), 249–265 (2003).CrossRefGoogle Scholar
Oliver, W. C. and Pharr, G. M., MRS Bull 35 (11), 897–907 (2010).CrossRefGoogle Scholar
Venkatesh, T. A., Van Vliet, K. J., Giannakopoulos, A. E. and Suresh, S., Scripta Mater 42 (9), 833–839 (2000).CrossRefGoogle Scholar
Lan, H. and Venkatesh, T. A., Philosophical Magazine 87 (30), 4671–4729 (2007).CrossRefGoogle Scholar
Chen, X., Ogasawara, N., Zhao, M. H. and Chiba, N., J Mech Phys Solids 55 (8), 1618–1660 (2007).CrossRefGoogle Scholar
Chen, X. and Vlassak, J. J., J Mater Res 16 (10), 2974–2982 (2001).CrossRefGoogle Scholar
Bhat, T. S. and Venkatesh, T. A., Philosophical Magazine 93 (36), 4488–4518 (2013).CrossRefGoogle Scholar
Nakamura, T. and Gu, Y., Mech Mater 39 (4), 340–356 (2007).CrossRefGoogle Scholar
Ma, T., Jiao, J., Li, Z., Qiao, L., Wang, T. and Li, F., Journal of Magnetism and Magnetic Materials (2017).Google Scholar
Akkari, F. C., Abdelkader, D., Gallas, B. and Kanzari, M., Materials Science in Semiconductor Processing 71, 156–160 (2017).CrossRefGoogle Scholar
Oliver, W. C. and Pharr, G. M., J Mater Res 7 (6), 1564–1583 (1992).CrossRefGoogle Scholar
Dao, M., Chollacoop, N., Van Vliet, K. J., Venkatesh, T. A. and Suresh, S., Acta Mater 49 (19), 3899–3918 (2001).CrossRefGoogle Scholar
Cheng, Y. T. and Cheng, C. M., Journal of Applied Physics 84 (3), 1284–1291 (1998).CrossRefGoogle Scholar
Cheng, Y. T. and Cheng, C. M., Applied Physics Letters 73 (5), 614–616 (1998).CrossRefGoogle Scholar
Buckingham, E., Physical Review 4 (4), 345–376 (1914).CrossRefGoogle Scholar
Ruan, H. H., Chen, A. Y. and Lu, J., Mech Mater 42 (5), 559–569 (2010).CrossRefGoogle Scholar
Tunvisut, K., O’Dowd, N. P. and Busso, E. P., Int J Solids Struct 38 (2), 335–351 (2001).CrossRefGoogle Scholar
Lichinchi, M., Lenardi, C., Haupt, J. and Vitali, R., Thin Solid Films 312 (1-2), 240–248 (1998).CrossRefGoogle Scholar
Zhi, Z., Computational Modeling of Indentation of Thin Films and Flow through Porous Media, Ph.D. Thesis, Stony Brook University, (2017).Google Scholar
Nelder, J. A. and Mead, R., Comput J 7 (4), 308–313 (1965).CrossRefGoogle Scholar