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Considerations and Methodology to Determine R2R Manufacturing and Scaling of Electronic Devices on Flexible Stainless Steel Foil Substrates

Published online by Cambridge University Press:  27 March 2017

Aditi Chandra ,
Mao Takashima ,
Joey Li ,
Patricia Beck ,
Scott Bruner ,
Dylan Tinsley ,
Raghav Sreenivasan  and
Arvind Kamath
Aditi Chandra*
Affiliation:
Thinfilm Electronics, San Jose, CA, 95134 United States.
Mao Takashima
Affiliation:
Thinfilm Electronics, San Jose, CA, 95134 United States.
Joey Li
Affiliation:
Thinfilm Electronics, San Jose, CA, 95134 United States.
Patricia Beck
Affiliation:
Thinfilm Electronics, San Jose, CA, 95134 United States.
Scott Bruner
Affiliation:
Thinfilm Electronics, San Jose, CA, 95134 United States.
Dylan Tinsley
Affiliation:
Thinfilm Electronics, San Jose, CA, 95134 United States.
Raghav Sreenivasan
Affiliation:
Thinfilm Electronics, San Jose, CA, 95134 United States.
Arvind Kamath
Affiliation:
Thinfilm Electronics, San Jose, CA, 95134 United States.
*
*(Email: [email protected])
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Abstract

Stainless steel substrates enable a combination of low cost, flexibility, durability, high processing temperatures, and sub-100 um thickness making it well suited for sheet based and roll-to-roll processing. NFC (13.56 MHz) based circuits using high performance polysilicon TFTs on steel sheets have been manufactured using a hybrid printed process in a production environment. The process scheme utilizes a hybrid, additive materials approach encompassing low cost manufacturing steps such as slot die coating and screen printing of silicon and dopant inks to enable a high throughput, low cost, manufacturing flow. This paper describes the approach for migrating from a sheet-based hybrid process flow to a R2R-based process. A comparison of substrate choices and considerations for R2R process integration is presented. A sensitive electrical method for evaluating the feasibility of R2R-based process integration schemes and materials selection is presented. MIM capacitor leakage, TFT device characteristics, NFC circuit performance, and defect density considerations are shown as a function of steel substrate bending, down to a diameter of 0.75 inches. Electrical characteristics and optical inspections show no measurable change to insulator characteristics, demonstrating a high degree of flexibility and overall device and process capability for R2R processing.

Keywords

Siscreen printingsteel
Type
Articles
Information
MRS Advances , Volume 2 , Issue 18: Processing and Manufacturing , 2017 , pp. 1029 - 1036
Copyright
Copyright © Materials Research Society 2017 

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References

REFERENCES

Gregg, A., York, L. and Strand, M. in Flexible Flat Panel Displays, edited by Crawford, G.P. (Wiley, New York, 2005), pp. 410–445.Google Scholar
Yeh, Y., Cheng, C., Lai, B., et al., J. SID, 21 (1), 34–40, (2013).Google Scholar
Morse, J.D., “Nanofabrication Technologies for Roll-to-Roll Processing”, Report from the NIST-NNN Workshop, 2011.Google Scholar
Perelaer, J., Smith, P. J., Mager, D., et al., J. Mater. Chem. 20, 8446–8453 (2010).Google Scholar
Takashima, M., Chandra, A., and Kamath, A., Flextech 2015 Proceedings, (Monterey, CA, 2015).Google Scholar
Takashima, M., Chandra, A., Li, J., et al., SID Symposium Digest of Technical Papers, 46 (1), 419–422 (2015).Google Scholar
Takashima, M., Chandra, A., and Kamath, A., “Flexible Hybrid Electronics for Wearable Applications – Challenges and Solutions,” presented at SemiconWest2015, San Francisco, CA, 2015 (unpublished).Google Scholar