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A study of substrate temperature distribution during ultrashort laser ablation of bulk copper

Published online by Cambridge University Press:  28 February 2007

Y.C. LAM
Affiliation:
School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore
D.V. TRAN
Affiliation:
School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore
H.Y. ZHENG
Affiliation:
The University of New South Wales, New South Wales, Australia

Abstract

With the aid of an infrared thermograph technique, we directly observed the temperature variation across a bulk copper specimen as it was being ablated by multiple femtosecond laser pulses. Combining the experimental results with simulations, we quantified the deposited thermal power into the copper specimen during the femtosecond laser ablation process. A substantial amount of thermal power (more than 50%) was deposited in the copper specimen, implying that thermal effect can be significant in femtosecond laser materials processing in spite of its ultrashort pulse duration.

Type
Research Article
Copyright
© 2007 Cambridge University Press

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References

REFERENCES

Anisimov, S.I., Kapeliovich, B.L. & Perel'man, T.L. (1974). Electron emission from metal surfaces exposed to ultrashort laser pulses. Sov. Phys. JETP 39, 375377.Google Scholar
Borowiec, A., Mackenzie, M., Weatherly, G.C. & Haugen, H.K. (2003). Transmission and scanning electron microscopy studies of single femtosecond-laser-pulse ablation of silicon. Appl. Phys. A 76, 201207.Google Scholar
Chichkov, B.N., Momma, C., Nolte S., Alvensleben, V.F., &Tunnermann, A. (1996). Femtosecond, picosecond, and nanosecond laser ablation of solids. Appl. Phys. A 63, 109115.Google Scholar
Fernandez, J.C., Hegelich, B.M., Cobble, J.A., Flippo, K.A., Letzring, S.A., Johnson, R.P., Gautier, D.C., Shimada, T., Kyrala, G.A., Wang, Y.Q., Wetteland, C.J & Schreiber, J. (2005). Laser-ablation treatment of short-pulse laser targets: Toward an experimental program on energetic-ion interactions with dense plasmas. Laser Part. Beams 23, 267273.Google Scholar
Gamaly, E.G., Luther-Davies, B., Kolev, V.Z., Madsen, N.R., Duering, M. & Rode, A.V. (2005). Ablation of metals with picosecond laser pulses: Evidence of long-lived non-equilibrium surface states. Laser Part. Beams 23, 167176.Google Scholar
Hirayama, Y. & Obara, M. (2002). Heat effects of metals ablated with femtosecond laser pulses. Appl. Surf. Sci. 197–198, 741745.Google Scholar
Hirayama, Y. & Obara, M. (2005). Heat-affected zone and ablation rate of copper ablated with femtosecond laser. J. Appl. Phys. 97, 064903.Google Scholar
Jungwirth, K. (2005). Recent highlights of the PALS research program. Laser Part. Beams 23, 177182.Google Scholar
Le Harzic, R., Huot, N., Audouard, E., Jonin, C., Laporte, P., Vallete, S., Fraczkiewicz, A. & Fortnuier, R. (2002). Comparison of heat-affected zones due to nanosecond and femtosecond laser pulses using transmission electronic microscopy. Appl. Phys. Lett. 80, 38863888.Google Scholar
Liu, X., Du, D. & Mourou, G. (1997). Laser ablation and micromachining with ultrashort laser pulses. IEEE J. Quantum. Elect. 33, 17061716.Google Scholar
Nolte, S., Momma, S., Jacobs, H., Tunnermann, A., Chichkov, B.N., Wellegehausen, B. & Welling, H. (1997). Ablation of metals by ultrashort laser pulses. J. Opt. Soc. Am. B 14, 27162722.Google Scholar
Preuss, S., Demchuk, A. & Stuke, M. (1995). Sub-picosecond UV laser ablation of metals. Appl. Phys. A 61, 3337.Google Scholar
Thareja, R.K. & Sharma, A.K. (2006). Reactive pulsed laser ablation: Plasma studies. Laser Part. Beams 24, 311320.Google Scholar