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A study of substrate temperature distribution during ultrashort laser ablation of bulk copper

Published online by Cambridge University Press:  28 February 2007

Y.C. LAM
Affiliation:
School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore
D.V. TRAN
Affiliation:
School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore, Singapore
H.Y. ZHENG
Affiliation:
The University of New South Wales, New South Wales, Australia

Abstract

With the aid of an infrared thermograph technique, we directly observed the temperature variation across a bulk copper specimen as it was being ablated by multiple femtosecond laser pulses. Combining the experimental results with simulations, we quantified the deposited thermal power into the copper specimen during the femtosecond laser ablation process. A substantial amount of thermal power (more than 50%) was deposited in the copper specimen, implying that thermal effect can be significant in femtosecond laser materials processing in spite of its ultrashort pulse duration.

Type
Research Article
Copyright
© 2007 Cambridge University Press

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