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Thermal Stress in Discretely Layered Structures with Functional Graded Materials

Published online by Cambridge University Press:  05 May 2011

S.-F. Hwang*
Affiliation:
Department of Mechanical Engineering, National Yunlin University of Science and Technology, Touliu, Taiwan 64002, R.O.C.
W.-T. Liao*
Affiliation:
Department of Mechanical Engineering, National Yunlin University of Science and Technology, Touliu, Taiwan 64002, R.O.C.
*
* Professor, corresponding author
** Graduate student
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Abstract

Functional graded materials are generally provided in discretely layered structures to reduce the abrupt mismatch and to improve failure performance. To investigate the thermal stress singularity occurring at the intersection of an interface and a free end, two-dimensional and three-dimensional finite element analyses are performed for titanium and aluminum layers with or without functional graded materials. The results indicate that once the functional graded material is added, the stress singularity around the intersection of an interface and a free end could be significantly relieved. If more FGM layers are used, the stress singularity could be further reduced to a very small value. If the longitudinal normal stresses and interlaminar shear stress are considered, two-dimensional finite element analysis may be enough, while three-dimensional analysis is necessary for the interlaminar normal stress. Otherwise, one may underestimate its stress singularity.

Type
Articles
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2008

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References

1.Koizumi, M., “The Concept of FGM,Ceramic Transactions, 34, pp. 310 (1993).Google Scholar
2.Shaw, L. L., “Thermal Residual Stresses in Plates and Coatings Composed of Multi-Layered and Functionally Graded Materials,Composites Part B, 29, pp. 199210 (1998).CrossRefGoogle Scholar
3.Erdogan, F. andBiricikoglu, V., “Two Bonded Half Planes with a Crack Going Through the Interface,International Journal of Engineering Science, 11, pp. 745766 (1973).CrossRefGoogle Scholar
4.Huang, C. S., “Analysis of Stress Singularities at Bi-Material Corners in Reddy's Theory of Plate Bending,Journal of Mechanics, 22, pp. 6775 (2006).CrossRefGoogle Scholar
5.Ginnakopoulos, A. E., Suresh, S., Finot, M. and Olsson, M., “Elastoplastic Analysis of Thermal Cycling: Layered Materials with Compositional Gradients,Acta Metallurgic Materials, 40, pp. 13351354 (1995).CrossRefGoogle Scholar
6.Lannutti, J. J., “Functional Graded Materials: Properties, Potential and Design Guidelines,Composite Engineering, 4, pp. 8194 (1994).CrossRefGoogle Scholar
7.Freund, L. B., “The Stress Distribution and Curvature of a General Compositionally Graded Semiconductor Layer,Journal of Crystal Growth, 132, pp. 341344 (1993).CrossRefGoogle Scholar
8.Lee, Y. D. and Erdogan, F., “Residual/Thermal Stresses in FGM and Laminated Thermal Barrier Coatings,International Journal of Fracture, 69, pp. 145165 (1994).CrossRefGoogle Scholar