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Simulation of Wire Bonding Process Using Explicit Fem with Ale Remeshing Technology

Published online by Cambridge University Press:  02 December 2019

C. C. Yang ,
Y. F. Su ,
Steven Y. Liang  and
K. N. Chiang Open the ORCID record for K. N. Chiang [Opens in a new window]
C. C. Yang
Affiliation:
Dept. of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, R.O.C.
Y. F. Su
Affiliation:
Dept. of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, R.O.C.
Steven Y. Liang
Affiliation:
Georgia Institute of Technology, George W Woodruff School of Mechanical Engineering, Atlanta, USA
K. N. Chiang*
Affiliation:
Dept. of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan, R.O.C.
*
*Corresponding author ([email protected])
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Abstract

Thermosonic wire bonding is a common fabrication process for connecting devices in electronic packaging. However, when the free air ball (FAB) is compressed onto the I/O pad of the chip during bonding procedure, chip cracking may occur if the contact pressure is too large. This study proposes an effective simulation technique that can predict the wire ball geometry after bonding in an accurate range. The contact force obtained in the simulation can be used for possible die cracking behavior evaluation. The simulation in this study used the explicit time integration scheme to deal with the time marching problem, and the second-order precision arbitrary Lagrangian-Eulerian (ALE) algorithm was used to deal with the large deformation of the wire ball during the bonding process. In addition, the equilibrium smoothing algorithm in LS-DYNA can make the contact behavior and geometry of the bonding wire almost the same as the experiment, which can also significantly reduce the distortion of the mesh geometry after remeshing.

Keywords

Wire Bondingelectronic packagingArbitrary Lagrangian-Eulerian (ALE)contact forceexplicit time integrationLS-DYNA
Type
Articles
Information
Journal of Mechanics , Volume 36 , Issue 1 , February 2020 , pp. 47 - 54
Copyright
Copyright © 2019 The Society of Theoretical and Applied Mechanics 

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References

REFERENCES

Munjas, N., Canadija, M. and Brnic, J., Thermo-Mechanical multiscale modeling in plasticity of metal using small strain theory, 34, Journal of Mechanics, pp. 579–589 (2018)CrossRefGoogle Scholar
Sedaghat, H., Xu, W. X., and Zhang, I. C., Ultrasonic vibration-assisted metal forming: Constitutive modelling of acoustoplasticity and applications, 265, Journal of Materials Processing Technology, pp. 122–129 (2019)CrossRefGoogle Scholar
Ramachandran, V., Wu, K. C. and Chiang, K. N., Overview Study of Solder Joint Reliablity due to Creep Deformation, 34, Journal of Mechanics, pp.637–643 (2018)Google Scholar
Wang, F. L., Qing, Q. X. and Tang, W. D., Study of Complex Looping With Five Kinks in Thermosonic Wire Bonding by Using Variable-Length Link-Spring Model, 9, IEEE Transactions on Components Packaging and Manufacturing Technology, pp. 375379 (2019)CrossRefGoogle Scholar
Ho, J. R., Chen, C. C., and Wang, C. H., Thin film thermal sensor for real time measurement of contact temperature during ultrasonic wire bonding process. Sensors and Actuators A (Physical), A111, pp. 188195 (2004).Google Scholar
Hang, C. J., Wang, C. Q., Tian, Y. H., Mayer, M. and Zhou, Y., Microstructural study of copper free air balls in thermosonic wire bonding. Microelectronic Engineering, Vol. 85, Issue 8, pp. 1815–1819 (2008).CrossRefGoogle Scholar
Ikeda, T., Miyazaki, N., Kudo, K., and Yakiyama, H., Failure estimation of semiconductor chip during wire bonding process. Journal of Electronic Packaging, Transactions of the ASME, 121, pp. 85–91 (1999).CrossRefGoogle Scholar
Hui, X., Changqing, L., Silberschmidt, V. V., and Honghui, W., “Effects of process parameters on bondability in thermosonic copper ball bonding,” Electronic Components and Technology Conference, Lake Buena Vista, FL, 27–30 (2008).CrossRefGoogle Scholar
Yeh, C. L. and Lai, Y. S., Transient analysis of the impact stage of wirebonding process on Cu /low-K wafers, Microelectronics Reliability, 45, pp. 371–378 (2005).CrossRefGoogle Scholar
Yeh, C. L. and Lai, Y. S., Comprehensive dynamic analysis of wirebonding on Cu/low-K wafers. IEEE Transactions on Advanced Packaging, 29, pp. 264–270 (2006).CrossRefGoogle Scholar
Beleran, J. D., Yang, Y. B., Robles, H. G., Milanes, A., Yeo, A. and Chan, K., “Copper wire bond analysis: Pad design effects and process considerations,” Electronic Components and Technology Conference, San Diego, CA, (2012).Google Scholar
Lin, K. C., Tsai, C. C., Su, Y. F., Hung, T. Y. and Chiang, K. N., “Analysis of LED wire bonding process using arbitrary Lagrangian-Eulerian and explicit time integration methods,” International Conference of Microsystems, Packaging, Assembly and Circuits Technology Conference, Taipei, Taiwan, (2013).CrossRefGoogle Scholar
Hang, C. J., Lum, I., Lee, J., Mayer, M., Wang, C. Q., Zhou, Y., Hong, S. J. and Lee, S. M., “Bonding wire characterization using automatic deformability measurement,” Microelectronic Engineering, 85, pp. 1795–1803 (2008).CrossRefGoogle Scholar
Yang, C. C., Tsai, C. C., Su, Y. F. and Chiang, K. N., “Analysis of LED Wire Bonding Process Using Arbitrary Lagrangian -Eulerian and Equilibrium Mesh Smoothing Algorithm” ICEP2015, Kyoto, Japan (2015).Google Scholar
Blau, P. J., Friction Science and Technology: From Concepts to Application, CRC Press (2008).CrossRefGoogle Scholar