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Hygrothermal Effect on Deformations of QFN Electronic Packaging

Published online by Cambridge University Press:  05 May 2011

M. Y. Tsai ,
C. H. Huang  and
C. Y. Huang
M. Y. Tsai*
Affiliation:
Department of Mechanical Engineering, Chang Gung University, Kwei-Shan, Tao-Yuan, Taiwan 333, R.O.C.
C. H. Huang*
Affiliation:
Department of Mechanical Engineering, Chang Gung University, Kwei-Shan, Tao-Yuan, Taiwan 333, R.O.C.
C. Y. Huang*
Affiliation:
Department of Mechanical Engineering, Chang Gung University, Kwei-Shan, Tao-Yuan, Taiwan 333, R.O.C.
*
* Professor
** Graduate student
** Graduate student
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Abstract

The hygrothermal-mechanical behavior of a quad flat non-lead (QFN) package without a chip inside is investigated experimentally and numerically. The present study is focused on understanding the effect of the inherent hygrothermal behaviors of epoxy molding compound (EMC) on the deformations of QFN package. Prior to studying the package, the coefficient of moisture expansion for the EMC is measured experimentally. Full-field moiré and Twyman-Green interferometries are used for measuring the real-time in-plane and out-of-plane deformations of the specimen, respectively, under thermal and moisture loading. In addition, the finite element and theoretical analyses are adopted for validating the experimental observations and further understanding the hygrothermal mechanics of the specimen. The coefficient of moisture expansion of the EMC was experimentally obtained to be about 0.2. The experimental results of the full-field deformations of the specimen, due to temperature, moisture and a combination of both, are presented. The experimental observations are validated by the finite element and theoretical analyses. It was observed that the maximum moisture-induced deformation (strain) can be up to as large as 50% of the thermal deformation (strain) caused by ΔT = 50°C for the specimen. As a result, neglecting moisture-induced deformations (strains) would cause the significant amount of error in thermal deformation (strain) measurement of plastic packages. Furthermore, the present study has laid down the fundamental mechanics and approaches for the QFN packaging structural design and analysis in terms of hygrothermal effects.

Keywords

Hygrothermal effectMoistureThermalDeformationElectronic packagingEMCQFNMoiré interferometryTwyman-Green interferometry
Type
Articles
Information
Journal of Mechanics , Volume 22 , Issue 4 , December 2006 , pp. 271 - 279
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2006

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References

1.Suhir, E., “Effect of Plastic Package Geometry on Its Propensity to Moisture Induced Failure,” Electronic Packaging for High Reliability, Low Cost Electronics, Tummala, R., Ed., Kluwer Academic Publishers, pp. 25–51 (1999).Google Scholar
2.Wong, E. H., Chan, K. C., Rajoo, R. and Lim, T. B., “The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging,” Electronic Components and Technology Conference, pp. 576–580 (2000).Google Scholar
3.Yi, S., Goh, J. S. and Yang, J. C., “Residual Stress in Plastic IC Packages During Surface Mounting Process Preceded by Moisture Soaking Test,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part B 20(3), pp. 247–255 (1997).Google Scholar
4.Pecht, M. G. and Govind, A., “In-Situ Measurements of Surface Mount IC Package Deformations During Reflow Soldering,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C, 20(3), pp. 207–212(1997).CrossRefGoogle Scholar
5.Uschitsky, M. and Suhir, E., “Moisture Diffusion in Epoxy Molding Compounds Filled with Particles,” Journal of Electronic Packaging, 123, pp. 47–51 (2001).CrossRefGoogle Scholar
6.Fremont, H., Deletage, J. Y., Pintus, A. and Danto, Y., “Evaluation of the Moisture Sensitivity of Molding Compounds of IC's Packages,” Journal of Electronic Packaging, 123, pp. 16–18(2001).CrossRefGoogle Scholar
7.Post, D., Han, B. and Ifju, P., High Sensitivity Moiré Experimental Analysis for Mechanics and Materials, Springer-Verlag, NY (1993).Google Scholar
8.Kobayashi, A. S., Handbook on Experimental Mechanics, Society for Experimental Mechanics, Inc. (1993).Google Scholar
9.Huang, C. H., “Moisture-Induced Deformations and Stresses in Plastic IC Packages,” Master Thesis, Chang Gung University., Taiwan (2001).Google Scholar
10.Tsai, M. Y., Hsu, C. H. and Wang, C. T., “Investigation of Thermo-Mechanical Behaviors of Flip Chip BGA in IC Packaging,” IEEE Transactions on Components and Packaging Technologies, 27(3), pp. 568–576 (2004)CrossRefGoogle Scholar
11.Huang, S. J., and Lin, H. L., “Electronic Speckle Pattern Interferometry Applied to the Displacement Measurement of Sandwich Plates with Single Fully-Potted Insert,” Journal of Mechanics, 20, pp. 273–276 (2004).CrossRefGoogle Scholar
12.Tsai, M. Y., Chiang, W. C., Liu, T. M. and Hsu, G. H., “Thermal Deformation Measurements and Predictions of MAP-BGA Electronic Packages,” Microelectronic Reliability, 46(2–4), pp. 476–486 (2006).CrossRefGoogle Scholar
13.Pan, T. Y., and Pao, Y. H., “Deformation in Multi-Layer Stacked Assemblies,” J. of Electronic Packaging, 112, pp. 30–34 (1990).CrossRefGoogle Scholar