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The Endochronic Viscoplasticity for Sn/3.9Ag/0.6Cu Solder Under Low Strain Rate Fatigue Loading Coupled with Thermal Cycling

Published online by Cambridge University Press:  05 May 2011

C. F. Lee*
Affiliation:
Department of Engineering Science College of Engineering, National Cheng-Kung University, Tainan, Taiwan 70101, R.O.C.
Z. H. Lee*
Affiliation:
Department of Engineering Science College of Engineering, National Cheng-Kung University, Tainan, Taiwan 70101, R.O.C.
S. H. Ou*
Affiliation:
Department of Engineering Science College of Engineering, National Cheng-Kung University, Tainan, Taiwan 70101, R.O.C.
*
* Professor
** Graduate Students
** Graduate Students
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Abstract

In this paper a wide range of temp. dependent kernel function ρ(Z) and the strain-rate function h(, T) in the Endochronic viscoplasticity were established first by using experimental steady hysteresis loops of Wei et. al., for Sn/3.9Ag/0.6Cu Solder at fixed 298K or 373K and strain rate at 10−3, 10−4 and 10−51/s; and then extended to predict the thermomechanical behavior of solder under constant low strain rate (10−51/s), from 0 to 1% max. strain fatigue loading with in-phase thermal cycling between 298K and 373K.

A novel approach in the theory to account for the microstructural changes enhanced by the stressassisted grain boundary diffusion mechanism during thermal cycling was proposed by using a partial relaxation function h1(T) of back stress (i.e. ρ0 in ρ(Z)).The theoretical results were in very well agreement with experimental data. These results and the out-phase results from the present theory were new and might be used as references to compare with results derived from other theories.

Type
Articles
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2009

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