Hostname: page-component-cd9895bd7-q99xh Total loading time: 0 Render date: 2024-12-18T21:12:30.693Z Has data issue: false hasContentIssue false

DSMC Study of Pressure-Driven Slip Flow through Microchannel at Non-Uniform Wall Temperature

Published online by Cambridge University Press:  23 January 2015

C.-C. Tai
Affiliation:
School of Defense Science, Chung Cheng Institute of Technology, National Defense University, Taoyuan, Taiwan
P.-Y. Tzeng
Affiliation:
Department of Mechatronic, Energy and Aerospace Engineering, Chung Cheng Institute of Technology, National Defense University, Taoyuan, Taiwan
C.-Y. Soong*
Affiliation:
Department of Aerospace and Systems Engineering, Feng Chia University, Taichung, Taiwan
*
*Corresponding author ([email protected])
Get access

Abstract

The present study is to investigate the pressure-driven gas flow in microchannel at no-uniform wall temperature. DSMC is employed to generate the flow field details which are then used in analysis of the slip flow characteristics. The major concern is the influences of thermal creep effect on the pressure-driven slip flow. Thermal creep is resulted from tangential wall temperature gradient. In this work, two kinds of thermal boundary condition are considered. One is the linearly varied temperature (LVT) applied to both walls, the other is that has the bottom wall at a thermal condition combined LVT and adiabatic (AD) wall, i.e. LVT-AD-LVT condition. The present DSMC results reveal that the fluid slip is weakened (enhanced) in the case with a negative (positive) wall temperature gradient. Relatively, thermal creep effect on fluid slip over the adiabatic wall is more pronounced in the presence of negative wall temperature gradient. The mass flowrate is a strong function of the wall temperature gradient. However, there is only little difference between the mass flowrates predicted under the two kinds of thermal conditions studied in the present work.

Type
Research Article
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2014 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Taylor, J. and Ren, C.L., “Application of Continuum Mechanics to Fluid Flow in Nanochannels,” Microfluidics andNanofluidics, 1, pp. 356363 (2005).Google Scholar
2.Ho, C.M. and Tai, Y.C., “Micro Electro Mechanical Systems (MEMS) and Fluid Flows,” Annual Review of Fluid Mechanics, 30, pp. 579612 (1998).CrossRefGoogle Scholar
3.Liu, J., Tai, Y.C. and Ho, C.M., “MEMS for Pressure Distribution Studies of Gaseous Flows in Microchannels,” IEEE International Conference on Micro Electro Mechanical Systems, Amsterdam, the Netherlands, pp. 209215 (1995).Google Scholar
4.Chen, C.S., Lee, S.M. and Sheu, J.D., “Numerical Analysis of Gas Flow in Microchannels,” Numerical Heat Transfer, Part A: Applications, 33, pp. 749762 (1998).Google Scholar
5.Xue, H., Fan, Q. and Shu, C., “Prediction of MicroChannel Flows Using Direct Simulation Monte Carlo,” Probabilistic Engineering Mechanics, 15, pp. 213219 (2000).Google Scholar
6.Alexeenko, A.A., Gimelshein, S.F., Muntz, E.P. and Ketsdever, A.D., “Kinetic Modeling of Temperature Driven Flows in Short Microchannels,” International Journal of Thermal Sciences, 45, pp. 10451051 (2006).Google Scholar
7.Ohwada, T., Sone, Y. and Aoki, K., “Numerical Analysis of the Poiseuille and Thermal Transpiration Flows Between Two Parallel Plates on the Basis of the Boltzmann Equation for Hard-Sphere Molecules,” Physics of Fluids A: Fluid Dynamics, 1, pp. 20422049 (1989).Google Scholar
8.Ye, J.J., Yang, J.A., Zheng, J.Y., Ding, X.T., Wong, I.O., Li, W.Z. and Chen, C., “Thermal Transpiration Effect on the Mass Transfer and Flow Behaviors of the Pressure-driven Hydrogen Gas Flow,” International Journal of Hydrogen Energy, 37, pp. 1247412480 (2012).Google Scholar
9.Akhlaghi, H., Roohi, E. and Stefanov, S., “A New Iterative Wall Heat Flux Specifying Technique in DSMC for Heating/Cooling Simulations of MEMS/NEMS,” International Journal of Thermal Sciences, 59, pp. 111125 (2012).Google Scholar
10.Akhlaghi, H. and Roohi, E., “Mass Flow Rate Prediction of Pressure-Temperature-Driven Gas Flows Through Micro/Nanoscale Channels,” Continuum Mechanics and Thermodynamics, 26, pp. 6768 (2014).Google Scholar
11.Tzeng, P.Y., Chou, I.W., Liu, C.H. and Li, W.K., “Improvement of the Gas-Surface Collision Rule for Adiabatic Walls in DSMC Modeling of Rarefied Gas Convection in a Micro Enclosure,” Journal of Aeronautics, Astronautics and Aviation, 43, pp. 147157 (2011).Google Scholar
12.Bird, G.A., Gallis, M.A., Torczynski, J.R. and Rader, D.J., “Accuracy and Efficiency of the Sophisticated Direct Simulation Monte Carlo Algorithm for Simulating Noncontinuum Gas Flows,” Physics of Fluids, 21, p. 017103 (2009).Google Scholar
13.Gallis, M.A., Torczynski, J.R., Rader, D.J. and Bird, G.A., “Convergence Behavior of a New DSMC Algorithm,” Journal of Computational Physics, 228, pp. 45324548 (2009).Google Scholar
14.Ikegawa, M. and Kobayashi, J., “Development of a Rarefield Gas Flow Simulator Using the Direct-Simulation Monte Carlo Method: 2-D Flow Analysis with the Pressure Conditions Given at the Upstream and Downstream Boundaries,” JSME International Journal, Series B, 33, pp. 463467 (1990).Google Scholar
15.Nance, R.P., Hash, D.B. and Hassan, H.A., “Role of Boundary Conditions in Monte Carlo Simulation of Microelectromechanical Systems,” Journal of Thermophysics and Heat Transfer, 12, pp. 447449 (1998).CrossRefGoogle Scholar
16.Wu, J.S., Lee, F. and Wong, S.C., “Pressure Boundary Treatment in Micromechanical Devices Using The Direct Simulation Monte Carlo Method,” JSME International Journal, Series B, 44, pp. 439450 (2001).CrossRefGoogle Scholar
17.Masters, , Nathan, D. and Ye, , Wenjing, , “Octant Flux Splitting Information Preservation DSMC Method for Thermally Driven Flows,” Journal of Computational Physics, 226, pp. 20442062 (2007).Google Scholar
18.Beskok, A., Karniadakis, G.E. and Trimmer, W., “Rarefaction and Compressibility Effects in Gas Microflows,” Journal of Fluids Engineering, 118, pp. 448456 (1996).Google Scholar