Hostname: page-component-78c5997874-ndw9j Total loading time: 0 Render date: 2024-11-05T05:29:24.745Z Has data issue: false hasContentIssue false
  • English
  • Français

Design and Simulation Analysis of A Z Axis Microactuator with Low Mode Cross-Talk

Published online by Cambridge University Press:  14 October 2020

Dang Van Hieu ,
Le Van Tam ,
Nguyen Van Duong ,
Nguyen Duy Vy  and
Chu Manh Hoang Open the ORCID record for Chu Manh Hoang [Opens in a new window]
Dang Van Hieu
Affiliation:
International Training Institute for Materials Science, Hanoi University of Science and Technology, Hanoi, Viet Nam FPT University, Hoa Lac High Tech Park, Hanoi, Viet Nam
Le Van Tam
Affiliation:
International Training Institute for Materials Science, Hanoi University of Science and Technology, Hanoi, Viet Nam
Nguyen Van Duong
Affiliation:
International Training Institute for Materials Science, Hanoi University of Science and Technology, Hanoi, Viet Nam Faculty of Technical Education, Hanoi National University of Education, Cau Giay, Hanoi, Viet Nam
Nguyen Duy Vy
Affiliation:
Laboratory of Applied Physics, Advanced Institute of Materials Science, Ton Duc Thang University, Ho Chi Minh City 756636, Viet Nam Faculty of Applied Sciences, Ton Duc Thang University, Ho Chi Minh City 756636, Viet Nam
Chu Manh Hoang*
Affiliation:
International Training Institute for Materials Science, Hanoi University of Science and Technology, Hanoi, Viet Nam
*
*Corresponding author ([email protected], [email protected])
Get access

Abstract

For a vibration system, the best designed spring is compliant to a desired vibration mode while it is robust to other undesired modes. There are several types of spring design for displacing the proofmass along the x and y axes, however, very few designs of spring compliant to the z axis are introduced. Therefore, we propose a z axis microactuator in which the suspending spring is designed so that it is only compliant to vibration along the z axis. The suspending spring consists of straight beam stages mechanically coupled with each other via frames which are symmetrically designed around a center plate. The operation characteristics of the microactuator is investigated by theoretical expresses and numerical simulation. The frequency split between the z axis mode and undesired modes can obtain more than 45%. The operation frequency can be modified in a wide range, from 68 kHz to 400 kHz, by changing the dimensional parameters of spring beams. The spring beams can be lengthened to increase displacement in the z axis while the mode cross-talk is still suppressed. Compared to the previously reported researches, the current microactuator shows robustness to undesired vibration modes, which is potential for integration in low mode cross-talk multi-axis micro-stages and low-noise mechanical sensors.

Keywords

Coupled mechanical springz axis microactuatorlow mode cross-talk
Type
Research Article
Information
Journal of Mechanics , Volume 36 , Issue 6 , December 2020 , pp. 881 - 888
Copyright
Copyright © 2020 The Society of Theoretical and Applied Mechanics

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

Koo, B., Correa, J. E., & Ferreira, P. M., “Parallel-kinematics XYZ MEMS part 2: Fabrication and experimental characterization”, Precision Engineering, 46, 147–157 (2016).Google Scholar
Wang, J., “Silicon-on-insulator out-of-plane electrostatic actuator with in situ capacitive position sensing”, Journal of Micro/Nanolithography, MEMS, and MOEMS, 11(3), 033006(2012).CrossRefGoogle Scholar
Sasaki, M., Bono, F., & Hane, K., “Large-Displacement Micro-XY-Stage with Paired Moving Plates”, Japanese Journal of Applied Physics, 47(4), 3226–3231(2008).CrossRefGoogle Scholar
Liu, X., Kim, K., & Sun, Y., “A MEMS Stage for 3-Axis Nanopositioning”, 2007 IEEE International Conference on Automation Science and Engineering, TuRP-E04,1, 1088-1092(2007).Google Scholar
Gu, L., Li, X., Bao, H., Liu, B., Wang, Y., Liu, M., Yang, Z., Cheng, B., “Single-wafer-processed nano-positioning XY-stages with trench-sidewall microm-achining technology”, Journal of Micromechanics and Microengineering, 16(7), 1349–1357(2006).Google Scholar
Legtenberg, R., Groeneveld, A. W., & Elwenspoek, M., “Comb-drive actuators for large displacements”, Journal of Micromechanics and Microengineering, 6(3), 320–329(1996).CrossRefGoogle Scholar
Nguyen, C., “MEMS technology for timing and frequency control”, IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 54(2), 251–270(2007).CrossRefGoogle ScholarPubMed
Nguyen, M., Ha, N., Nguyen, L., Chu, H., & Vu, H., “Z-Axis Micromachined Tuning Fork Gyroscope with Low Air Damping”, Micromachines, 8(2), 42(2017).CrossRefGoogle Scholar
Lin, M. X., Lee, S. Y., & Chen, C. K., “Nonlocal Effect on the Pull-in Instability Analysis of Graphene Sheet Nanobeam Actuator”, Journal of Mechanics, 1–12(2019).Google Scholar
Yang, Y. J., Kamon, M., Rabinovich, V. L., Ghaddar, C., Deshpande, M., Greiner, K., & Gilbert, J. R., “Modeling gas damping and spring phenomena in MEMS with frequency dependent macro-models”, Transducers 99, pp. 1148-1151(1999).Google Scholar
Lee, B. S., Lin, S. C., & Wu, W. J., “Fabrication and Evaluation of a MEMS Piezoelectric Bimorph Generator for Vibration Energy Harvesting”, Journal of Mechanics, 26(04), 493–499 (2010).Google Scholar
Chou, H. M., Lin, M. J., & Chen, R., “Investigation of mechanics properties of an awl-shaped serpentine microspring for in-plane displacement with low spring constant-to-layout area”, Journal of Micro/Nanolithography, MEMS, and MOEMS, 15(3), 035003 (2016).CrossRefGoogle Scholar
Hsu, C. P., Yip, M. C., & Fang, W., “Implementation of a gap-closing differential capacitive sensing Z-axis accelerometer on an SOI wafer”, Journal of Micromechanics and Microengineering, 19(7), 075006 (2009).CrossRefGoogle Scholar
Shi, Y., Zhao, Y., Feng, H., Cao, H., Tang, J., Li, J., Liu, J., “Design, fabrication and calibration of a high-G MEMS accelerometer”, Sensors and Actuators A: Physical, 279, 733–742 (2018).CrossRefGoogle Scholar
Tsuchiya, T., Hamaguchi, H., Sugano, K., &Tabata, O., “Design and fabrication of a differential capacitive three-axis SOI accelerometer using vertical comb electrodes”, IEEJ Transactions on Electrical and Electronic Engineering, 4(3), 345–351(2009).CrossRefGoogle Scholar
Mohammed, Z., Elfadel, I., & Rasras, M., “Monolithic Multi Degree of Freedom (MDoF) Capacitive MEMS Accelerometers”, Micromachines, 9(11), 602 (2018).CrossRefGoogle ScholarPubMed
Chiu, Y., Hong, H. C., & Chang, C. M., “Three-axis CMOS MEMS inductive accelerometer with novel Z-axis sensing scheme”, 2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), pp. 410-413(2017).CrossRefGoogle Scholar
Yang, B., Wang, B., Yan, H., & Gao, X., “Design of a Micromachined Z-axis Tunneling Magnetoresistive Accelerometer with Electrostatic Force Feedback”, Micromachines, 10(2), 158(2019).CrossRefGoogle ScholarPubMed
Huang, Y. J., Chang, T. L., & Chou, H. P., “Novel Concept Design for Complementary Metal Oxide Semiconductor Capacitive Z-Direction Accelerometer”, Japanese Journal of Applied Physics, 48(7), 076508(2009).CrossRefGoogle Scholar
Sharaf, A., & Sedky, S., “Design and simulation of a high-performance Z-axis SOI-MEMS accelerometer”, Microsystem Technologies, 19(8), 1153–1163(2012).CrossRefGoogle Scholar
Matsumoto, Y., Nishimura, M., Matsuura, M., & Ishida, M., “Three-axis SOI capacitive accelerometer with PLL C–V converter”, Sensors and Actuators A: Physical, 75(1), 77–85(1999).CrossRefGoogle Scholar
Li, G., Li, Z., Wang, C., Hao, Y., Li, T., Zhang, D., & Wu, G., “Design and fabrication of a highly symmetrical capacitive triaxial accelerometer”, Journal of Micromechanics and Microengineering, 11(1), 48–54 (2000).CrossRefGoogle Scholar
Mohammed, Z., Elfadel, I., &Rasras, M., “Monolithic Multi Degree of Freedom (MDoF) Capacitive MEMS Accelerometers”, Micromachines, 9(11), 602(2018).CrossRefGoogle ScholarPubMed
Weinberg, M. S., & Kourepenis, A., “Error Sources in In-Plane Silicon Tuning-Fork MEMS Gyroscopes”, Journal of Microelectromechanical Systems, 15(3), 479–491(2006).CrossRefGoogle Scholar
Fang, X., Dong, L., Zhao, W. S., Yan, H., Teh, K., & Wang, G., “Vibration-Induced Errors in MEMS Tuning Fork Gyroscopes with Imbalance”, Sensors, 18(6), 1755 (2018).CrossRefGoogle ScholarPubMed
Peroulis, D., Pacheco, S.P., Sarabandi, K., Katehi, L.P.B., “Electromechanical considerations in developing low-voltage RF MEMS switches”, IEEE Trans. Microw. Theory Tech. 51, 259–270 (2003).CrossRefGoogle Scholar
Liu, Y., “Stiffness Calculation of the Microstructure with Crab-Leg Flexural Suspension”, Advanced Materials Research 317-319:1123-1126 (2011).Google Scholar
Rebeiz, G. M., “RF MEMS: theory, design, and technology”, John Wiley and Sons, Hoboken, New Jersey, USA (2003).Google Scholar
Acar, C. and Shkel, A., “MEMS vibratory gyroscopes structural approaches to improve robustness”, Springer Science + Business Media LLC, USA, (2008).Google Scholar
Alper, S. E., & Akin, T., “Symmetrical and decoupled nickel microgyroscope on insulating substrate”, Sensors and Actuators A: Physical, 115(2-3), 336-350(2004).CrossRefGoogle Scholar
Gere, J. M. and Timoshenko, S. P., “Mechanics of Materials”, PWS Publishing Company (1997).Google Scholar
Urey, H., Kan, C., & Davis, W. O., “Vibration mode frequency formulae for micromechanical scanner”, Journal of Micromechanics and Microengineering, 15(9), 1713–1721(2005).CrossRefGoogle Scholar
Schiavone, G., Desmulliez, M., & Walton, A., “Integrated Magnetic MEMS Relays: Status of the Technolog”, Micromachines, 5(3), 622–653(2014).CrossRefGoogle Scholar
Hoang, C. M., Iida, T., Dat, L. T., Huy, H. T., & Vy, N. D., “Optimal coating thickness for enhancement of optical effects in optical multilayer-based metrologies”, Optics Communications, 403, 150–154 (2017).CrossRefGoogle Scholar
Hane, K., & Suzuki, K., “Self-excited vibration of a self-supporting thin film caused by laser irradiation”, Sensors and Actuators A: Physical, 51(2-3), 179–182 (1995).CrossRefGoogle Scholar
Zhang, W. M., Yan, H., Peng, Z.-K., & Meng, G., “Electrostatic pull-in instability in MEMS/NEMS: A review”, Sensors and Actuators A: Physical, 214, 187–218 (2014).CrossRefGoogle Scholar