Hostname: page-component-cd9895bd7-gvvz8 Total loading time: 0 Render date: 2024-12-19T01:19:14.853Z Has data issue: false hasContentIssue false
  • English
  • Français

Application of Optimal Design on Twin Die Stacked Package by Reliability Indicator of Average SED Concept

Published online by Cambridge University Press:  22 March 2012

R.-S. Chen ,
C.-H. Huang  and
Y.-Z. Xie
R.-S. Chen*
Affiliation:
Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan 70101, R.O.C.
C.-H. Huang
Affiliation:
Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan 70101, R.O.C.
Y.-Z. Xie
Affiliation:
Department of Engineering Science, National Cheng Kung University, Tainan, Taiwan 70101, R.O.C.
*
*Corresponding author ([email protected])
Get access

Abstract

This paper deals with the optimal design for a twin die stacked package. Firstly, the numerical model is built up in terms of a three-dimensional slice model along the diagonal direction of the package. The material behavior of the solder balls is a consequence of the viscoplastic property which can be described by the Anand's model. Secondly, the Darveaux model is applied to predict the solder ball reliability of the stacked die package under a cyclic temperature loading. Since simulation analysis found an obvious relation is found between the fatigue life of the solder ball and the distribution of the accumulated strain energy density (SED) on the critical solder ball of the package through the simulation analysis, the average value of the strain energy density for all solder balls is adopted as the optimization indicator of reliability. With such a viewpoint, the critical solder ball position can be ignored, and accordingly an efficient analysis can be obtained. Finally, the Box-Behnken regression model is adopted to construct all the experiments. Each experiment analyzes the reliability of the package under varying parameters. Subsequently, the pattern search algorithm is applied to search for optimal factors.

Through optimal analysis with the fatigue reliability indicator of an average SED, the fatigue life is found to be 59% lower than that of the original design. The fatigue life had clearly improved and the lowest ball fatigue life is found to be 2.859 times longer than the original one.

Keywords

Twin die stacked packageAnand's viscoplastic modelDarveaux modelBox-Behnken regression
Type
Articles
Information
Journal of Mechanics , Volume 28 , Issue 1 , March 2012 , pp. 135 - 142
Copyright
Copyright © The Society of Theoretical and Applied Mechanics, R.O.C. 2012

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Fukui, Y., Yano, Y., Juso, H., Matsune, Y., Miyata, K., Narai, A., Sota, Y., Takeda, Y., Fujita, K. and Kada, M., “Triple-Chip Stacked CSP,” Proceedings of 50th IEEE Electronic Components and Technology Conference, Las Vegas, NV, USA, pp. 385–389 (2000).Google Scholar
2. Zahn, B. A., “Finite Element Based Solder Joint Fatigue Life Predictions for a Same Die Stacked Chip Scale Ball Grid Array Package,” Proceedings of the 27th SEMI Technology Symposium: International Electronics Manufacturing Technology Symposium, IEMT 2002, San Jose, CA, pp. 274–284 (2002).Google Scholar
3. Zhu, W., Stoeckl, S., Pape, H. and Gan, S., “Comparative Study on Solder Joint Reliability Using Different FE-Models,” The 5th IEEE Electronic Packaging Technology Conference, Singapore, pp. 687–694 (2003).Google Scholar
4. Tee, T. Y. and Zhong, Z., “Board Level Solder Joint Reliability Analysis and Optimization of Pyramidal Stacked Die BGA Packages,” Microelectronics Reliability, 44, pp. 1957–1965 (2004).CrossRefGoogle Scholar
5. Anand, L., “Constitutive Equations for the Rate-Dependent Deformation of Metals at Elevated Temperature,” Transactions of the ASME, 104, pp. 12–17 (1982).Google Scholar
6. Darveaux, R., “Solder Joint Fatigue Life Model,” Proceedings of TMS Annual Meeting, Orlando, Florida, USA, pp. 213–218 (1997).Google Scholar
7. Darveaux, R., “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation,” Journal of Electronic Packaging, 124, pp. 147–154 (2002).CrossRefGoogle Scholar
8. Hooke, R. and Jeeves, T. A., “Direct Search Solution of Numerical and Statistical Problems,” Journal of the ACM., 8, pp. 212–229 (1961).CrossRefGoogle Scholar
9. Myers, R., Response Surface Methodology: Process and Product Optimization Using Designed Experiments, John Wiley & Sons, Inc., NY (2002).Google Scholar
10. Montgomery, D. C., Design and Analysis of Experiment, John Wiley & Sons, Inc., Fifth Edition (1997).Google Scholar