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Triple junction structure and carbide precipitation in 304L stainless steel

Published online by Cambridge University Press:  17 June 2013

Yijian Zhou*
Affiliation:
Department of Materials Science and Engineering, University of Toronto, Toronto, Ontario, Canada M5S 3E4
Gino Palumbo
Affiliation:
Integran Technologies Inc., Mississauga, Ontario, Canada L4V 1H7
Karl T. Aust
Affiliation:
Department of Materials Science and Engineering, University of Toronto, Toronto, Ontario, Canada M5S 3E4
Uwe Erb
Affiliation:
Department of Materials Science and Engineering, University of Toronto, Toronto, Ontario, Canada M5S 3E4
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Type 304L stainless steel (SS) samples were used to investigate the correlation between carbide precipitation and triple junction structure derived from crystallographic data obtained by the orientation imaging microscopy associated with electron backscattered diffraction. The samples were solution treated and annealed at different sensitization temperatures/time to introduce various degrees of carbide precipitation at the interface region, thus different degrees of selectivity toward triple junctions. Four models were used to characterize triple junction microstructures: (i) the I-line and U-line model, (ii) the coincident axial direction (CAD) model, (iii) the coincident site lattice (CSL)/grain boundary (GB) model and (iv) the plane matching (PM)/GB model. Among them, the I-line and U-line model is the most effective in identifying special triple junctions, i.e., those exhibiting the beneficial property of high resistance to carbide precipitation. The results showed that the percentage of special triple junctions (I-lines) immune to carbide precipitation, increased from 35 to 80%, as the precipitation became more selective toward triple junction structures due to the corresponding sensitization heat treatment conditions, whereas more than 80% of random triple junctions (U-lines) exhibited susceptibility to carbide precipitation regardless of the sensitization conditions.

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Copyright © Materials Research Society 2013 

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References

REFERENCES

Aust, K.T. and Chalmers, B.: Energies and structure of grain boundaries. In Metal Interfaces (ASM, Cleveland, OH, 1952), p.153.Google Scholar
McLean, D.: Grain Boundaries in Metals (Oxford University Press, London, England, 1957), pp. 1, 15, 44.Google Scholar
Aust, K.T. and Rutter, J.W.: Grain boundary migration in high-purity lead and dilute lead-tin alloys. Trans. TMS-AIME 215, 119 (1959).Google Scholar
Weinberg, F.: Grain boundaries in metals. Prog. Met. Phys. 8, 105 (1959).CrossRefGoogle Scholar
Gleiter, H. and Chalmers, B.: High-angle grain boundaries. Prog. Mater. Sci. 16, 1 (1972).Google Scholar
Pande, C.S. and Chou, Y.T.: Growth, structure and mechanical behavior of bicrystals, in Treatise on Materials Science and Technology, edited by Herman, H. (Academic Press, London, England, 1975), p. 43.CrossRefGoogle Scholar
Erb, U., Gleiter, H., and Schwitzgebel, G.: The effect of boundary structure (energy) on interfacial corrosion. Acta Metall. 30, 1377 (1982).CrossRefGoogle Scholar
Materials Interfaces: Atomic-Level Structure and Properties, edited by Wolf, D. and Yip, S. (Chapman & Hall, London, England, 1992), pp. 1, 87, 190.Google Scholar
Watanabe, T.: An approach to grain boundary design for strong and ductile polycrystals. Res. Mech. 11, 47 (1984).Google Scholar
Randle, V.: Grain boundary engineering: An overview after 25 years. Mater. Sci. Technol. 26, 253 (2010).CrossRefGoogle Scholar
Watanabe, T.: Grain boundary engineering: Historical perspective and future prospects. J. Mater. Sci. 46, 4095 (2011).CrossRefGoogle Scholar
Gottstein, G. and Shvindlerman, L.S.: Grain boundary junction engineering. Scr. Mater. 54, 1065 (2006).CrossRefGoogle Scholar
Davies, P., Randle, V., Watkins, G., and Davies, H.: Triple junction distribution profiles as assessed by electron backscatter diffraction. J. Mater. Sci. 37, 4203 (2002).CrossRefGoogle Scholar
Schuh, C., Kumar, M., and King, W.: Universal features of grain boundary networks in FCC materials. J. Mater. Sci. 40, 847 (2005).Google Scholar
Tsurekawa, S., Nakamichi, S., and Watanabe, T.: Correlation of grain boundary connectivity with grain boundary character distribution in austenitic stainless steel. Acta Mater. 54, 3617 (2006).CrossRefGoogle Scholar
Rohrer, G., Randle, V., Kim, C., and Hu, Y.: Changes in the five-parameter grain boundary character distribution in a-brass brought about by iterative thermomechanical processing. Acta Mater. 54, 4489 (2006).CrossRefGoogle Scholar
Rabukhin, V.B.: Influence of ternary joint of grain on plasticity without diffusional mobility. Phys. Met. Metall. 61, 996 (1986).Google Scholar
Palumbo, G. and Aust, K.T.: Triple line corrosion in high purity nickel. Mater. Sci. Eng., A 113, 139 (1989).CrossRefGoogle Scholar
Gottstein, G., Sursaeva, V., and Shvindlerman, L.S.: The effect of triple junctions on grain boundary motion and grain microstructure evolution. Interface Sci. 7, 273 (1999).CrossRefGoogle Scholar
Shvindlerman, L.S. and Gottstein, G.: Grain boundary and triple junction migration. Mater. Sci. Eng., A 302, 141 (2001).CrossRefGoogle Scholar
Gottstein, G., Ma, Y., and Shvindlerman, L.S.: Triple junction motion and grain microstructure evolution. Acta Mater. 53, 1535 (2005).CrossRefGoogle Scholar
Mikhailovskii, I.M. and Rabukhin, V.B.: Energy of boundaries in the vicinity of a triple junction. Phys. Status Solidi A 119, K113 (1990).CrossRefGoogle Scholar
Fortier, P., Palumbo, G., Bruce, G.D., Miller, W.A., and Aust, K.T.: Triple line energy determination by scanning tunneling microscopy. Scr. Metall. 25, 177 (1991).CrossRefGoogle Scholar
Zhao, B., Verhasselt, J.C., Shvindlerman, L.S., and Gottstein, G.: Measurement of grain boundary triple line energy in copper. Acta Mater. 58, 5646 (2010).CrossRefGoogle Scholar
Srinivasan, S.G., Cahn, J.W., Jonsson, H., and Kalonji, G.: Excess energy of grain-boundary trijunctions: An atomistic simulation study. Acta Mater. 47, 2821 (1999).CrossRefGoogle Scholar
King, A.H.: The geometric and thermodynamic properties of grain boundary junctions. Interface Sci. 7, 251 (1999).CrossRefGoogle Scholar
Upadhyay, M., Capolungo, L., Taupin, V., and Fressengeas, C.: Grain boundary and triple junction energies in crystalline media: A disclination based approach. Int. J. Solids Struct. 48, 3176 (2011).CrossRefGoogle Scholar
Palumbo, G., Thorpe, S.J., and Aust, K.T.: On the contribution on triple junctions to the structure and properties of nanocrystalline materials. Scr. Metall. Mater. 24, 1347 (1990).CrossRefGoogle Scholar
Zhou, Y., Erb, U., and Aust, K.T.: The role of interface volume fractions in the nanocrystalline to amorphous transition in fully dense materials. Philos. Mag. 87, 5749 (2007).CrossRefGoogle Scholar
Palumbo, G., Erb, U., and Aust, K.T.: Triple line disclination effects on the mechanical behavior of materials. Scr. Metall. Mater. 24, 2347 (1990).Google Scholar
Palumbo, G., Doyle, D.M., El-Sherik, A.M., Erb, U., and Aust, K.T.: Intercrystalline hydrogen transport in nanocrystalline nickel. Scr. Metall. Mater. 25, 679 (1991).CrossRefGoogle Scholar
Chellali, M.R., Balogh, Z., Bouchikhaoui, H., Schlesiger, R., Stender, P., Zheng, L., and Schmitz, G.: Triple junction transport and the impact of grain boundary width in nanocrystalline Cu. Nano Lett. 12, 3448 (2012).CrossRefGoogle ScholarPubMed
Sherik, A.M., Boylan, K., Erb, U., Palumbo, G., and Aust, K.T.: Grain-growth behavior of nanocrystalline nickel, in Structure and Properties of Interfaces in Materials, edited by Clark, W.A.T., Dahmen, U., and Briant, C.L. (Mater. Res. Soc. Symp. Proc. 238, Warrendale, PA, 1992) pp. 727732.Google Scholar
Wang, N., Wang, Z., Aust, K.T., and Erb, U.: Room temperature creep behavior of nanocrystalline nickel produced by an electrodeposition technique. Mater. Sci. Eng., A 237, 150 (1997).CrossRefGoogle Scholar
Rupert, T.J., Trelewicz, J.R., and Schuh, C.A.: Grain boundary relaxation strengthening of nanocrystalline Ni–W alloys. Mater. Res. 27, 1285 (2012).Google Scholar
Bollmann, W.: The basic concept of the O-lattice theory. Surf. Sci. 31, 1 (1972).CrossRefGoogle Scholar
Bollmann, W.: Crystal Lattices, Interfaces, Matrices (Geneva, 1982).Google Scholar
Bollmann, W.: Triple line disclinations, representations, continuity and reactions. Philos. Mag. A 57, 637 (1988).CrossRefGoogle Scholar
Bollmann, W.: Triple line disclinations in polycrystalline material. Mater. Sci. Eng., A 113, 129 (1989).CrossRefGoogle Scholar
Bollmann, W.: The stress field of a model triple line disclination. Mater. Sci. Eng., A 136, 1 (1991).CrossRefGoogle Scholar
Doni, E.G. and Bleris, G.L.: Study of special triple junctions and faceted boundaries by means of the CSL model. Phys. Status Solidi A 110, 383 (1988).CrossRefGoogle Scholar
Kurzydlowski, K.J., Ralph, B., and Garbacz, A.: The crystal texture effect on the characteristic of grain boundaries in polycrystals: Individual boundaries and three-fold edges. Scr. Metall. Mater. 29, 1365 (1993).CrossRefGoogle Scholar
Palumbo, G. and Aust, K.T.: A coincident axial direction (CAD) approach to the structure of triple junctions in polycrystalline materials. Scr. Metall. Mater. 24, 1771 (1990).CrossRefGoogle Scholar
Aborn, R.H. and Bain, E.C.: The nature of nickel-chromium rustless steels. Trans. Am. Soc. Steel Treating 18, 837 (1930).Google Scholar
Kinzel, A.B.: Chromium carbide in stainless steel. Trans. Met. Soc. AIME 194, 469 (1952).Google Scholar
Stickler, R. and Vinckier, A.: Morphology of grain-boundary carbides and its influence on intergranular corrosion of 304 stainless steel. Trans. ASM 54, 362 (1961).Google Scholar
Aust, K.T.: Intergranular corrosion of austenitic stainless steels. Trans. Metall. Soc. AIME 245, 2117 (1969).Google Scholar
Cihal, V.: Intergranular corrosion of steels and alloys, in Materials Science Monographs No.18 (Elsevier Publishing Co., New York, 1984); p. 80.Google Scholar
Bruemmer, S.M.: Grain boundary chemistry and intergranular failure of autenitic stainless steels. Mat. Sci. Forum 46, 309 (1989).CrossRefGoogle Scholar
Palumbo, G. and Aust, K.T.: Structure dependence of intergranular corrosion in high purity nickel. Acta Metall. Mater. 38, 2343 (1990).CrossRefGoogle Scholar
Gay, R.J. and Vander Voort, G.F.: “Metallography,” in Metals Handbook Desk Edition, edited by H.E. Boyer and T.L. Gall, (ASM American Society for Metals, Metals Park, OH, 1985) p. 35.Google Scholar
Randle, V.: Microstructure Determination and its Applications (The Institute of Materials, London, 1992), p. 70.Google Scholar
Zhou, Y., Erb, U., Aust, K.T., and Palumbo, G.: Effects of grain boundary structure on carbide precipitation in 304L stainless steel. Scr. Mater. 45, 49 (2001).CrossRefGoogle Scholar
Kokawa, H., Shimada, M., and Sato, Y.S.: Grain-boundary structure and precipitation in sensitized austenitic stainless steel. JOM 52, 34 (2000).CrossRefGoogle Scholar
Williford, R.E., Windisch, C.F. Jr., and Jones, R.H.: In situ observations of the early stages of localized corrosion in type 304SS using the electrochemical atomic force microscope. Mater. Sci. Eng., A 288, 54 (2000).CrossRefGoogle Scholar
Grimmer, H., Bollmann, W., and Warrington, DH: Coincidence-site lattices and complete pattern-shift in cubic crystals. Acta Crystallogr., Sect. A: Found. Crystallogr. 30, 197 (1974).CrossRefGoogle Scholar
Fortier, P., Aust, K.T., and Miller, W.A.: Effects on symmetry, texture and topology on triple junction character distribution in polycrystalline materials. Acta Metall. Mater. 43, 339 (1995).CrossRefGoogle Scholar
Randle, V. and Ralph, B.: The coincident axial direction (CAD) approach to grain boundary structure. J. Mater. Sci. 23, 934 (1988).CrossRefGoogle Scholar
Brandon, D.G.: The structure of high-angle grain boundaries. Acta Metall. 14, 1479 (1966).CrossRefGoogle Scholar
Kobayashi, S., Inomata, T., Kobayashi, H., Tsurekawa, S., and Watanabe, T.: Effects of grain boundary- and triple junction-character on intergranular fatigue crack nucleation in polycrystalline aluminum. J. Mater. Sci. 43, 3792 (2008).CrossRefGoogle Scholar
Hu, C., Xia, S., Li, H., Liu, T., Zhou, B., Chen, W., and Wang, N.: Improving the intergranular corrosion resistance of 304 stainless steel by grain boundary network control. Corros. Sci. 53, 1880 (2011).CrossRefGoogle Scholar
Kobayashi, S., Tsurekawa, S., and Watanabe, T.: Grain boundary hardening and triple junction hardening in polycrystalline molybdenum. Acta Mater. 53, 1051 (2005).CrossRefGoogle Scholar
Pumphrey, P.H.: A plane matching theory of high angle grain boundary structure. Scr. Metall. 6, 107 (1972).CrossRefGoogle Scholar
Loberg, B. and Norden, H.: High resolution microscopy of grain boundary structure, in Grain Boundary Structure and Properties, edited by Chadwick, G.A. and Smith, D.A. (Academic Press, London, 1976), p. 1.Google Scholar
Clarebrough, L.M. and Forwood, C.T.: Secondary grain boundary dislocation nodes at the junction of three grains. Philos. Mag. A 55, 217 (1987).CrossRefGoogle Scholar
Priester, L. and Yu, P.: Triple junctions at mesoscopic, microscopic and nanoscopics scales. Mater. Sci. Eng., A 188, 113 (1994).CrossRefGoogle Scholar
Palumbo, G. and Aust, K.T.: Comments on triple junctions at mesoscopic, microscopic and nanoscopics scales. Mater. Sci. Eng., A 205, 254 (1996).CrossRefGoogle Scholar
Dimitrakopulos, G.P., Krakostas, T.H., and Pond, R.C.: The defect character of interface junction lines. Interface Sci. 4, 129 (1996).Google Scholar
Müllner, P.: Disclinations at grain boundary triple junctions: Between Bollmann disclinations and Volterra disclinations. Mater. Sci. Forum 294296, 353 (1999).Google Scholar
Read, W.T. and Shockley, W.: Dislocation models of crystal grain boundaries. Phys. Rev. 78, 275 (1950).CrossRefGoogle Scholar
Romanov, A.E. and Vladimirov, V.I.: Disclination in crystalline solids, in Dislocations in Solids, Vol. 9, edited by Nabarro, F.R.N. (Elsevier Publishing Co., Amsterdam, 1992), p.191.Google Scholar