Hostname: page-component-586b7cd67f-rcrh6 Total loading time: 0 Render date: 2024-11-27T22:01:42.126Z Has data issue: false hasContentIssue false
  • English
  • Français

Thickness effect on fracture behavior of columnar-grained Cu with preferentially oriented nanoscale twins

Published online by Cambridge University Press:  22 August 2017

Shusen Luo ,
Zesheng You  and
Lei Lu
Shusen Luo
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China; and University of Chinese Academy of Sciences, Beijing 100049, People’s Republic of China
Zesheng You
Affiliation:
Herbert Gleiter Institute of Nanoscience, Nanjing University of Science and Technology, Nanjing 210094, People’s Republic of China
Lei Lu*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People’s Republic of China
*
a) Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

The effect of specimen thickness on fracture toughness and fracture mechanism was investigated in bulk columnar-grained Cu with preferentially oriented nanoscale growth twins. Below a critical specimen thickness of ∼1.0 mm, plane stress state prevailed ahead of the crack tip and the fracture initiation toughness J C decreased with decreasing thickness. Above the critical thickness, J C decreased with increasing thickness until approaching an intrinsic thickness-independent value when the crack front was mainly under plane strain condition. Under plane strain condition, threading dislocations were majorly activated to glide along the nanotwin channels and to produce severe stress concentrations when they piled-up against grain boundaries (GBs). As a result, intergranular cracking mediated the failure of the nanotwinned Cu. On the contrary, under plane stress condition, dislocations slipping-transfer across twin boundaries (TBs) or partial dislocations gliding at TBs were activated to accommodate the plastic deformation. Consequently, stress intensification at GBs was plastically relaxed through enhanced detwinning and shear banding, which suppressed the intergranular fracture and promoted transgranular shear fracture.

Keywords

fracturenanostructuretoughness
Type
Articles
Information
Journal of Materials Research , Volume 32 , Issue 24: Focus Issue: Mechanical Properties and Microstructure of Advanced Metallic Alloys—in Honor of Prof. Haël Mughrabi PART B , 28 December 2017 , pp. 4554 - 4562
Check for updates
Copyright
Copyright © Materials Research Society 2017 

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

Footnotes

Contributing Editor: Yuntian Zhu

b)

This author was an editor of this journal during the review and decision stage. For the JMR policy on review and publication of manuscripts authored by editors, please refer to http://www.mrs.org/editor-manuscripts/.

References

REFERENCES

Lu, L., Shen, Y., Chen, X., Qian, L., and Lu, K.: Ultrahigh strength and high electrical conductivity in copper. Science 304(5669), 422 (2004).Google Scholar
Lu, K., Lu, L., and Suresh, S.: Strengthening materials by engineering coherent internal boundaries at the nanoscale. Science 324(5925), 349 (2009).Google Scholar
Lu, L., Chen, X., Huang, X., and Lu, K.: Revealing the maximum strength in nanotwinned copper. Science 323(5914), 607 (2009).Google Scholar
Shute, C.J., Myers, B.D., Xie, S., Barbee, T.W. Jr., Hodge, A.M., and Weertman, J.R.: Microstructural stability during cyclic loading of multilayer copper/copper samples with nanoscale twinning. Scr. Mater. 60(12), 1073 (2009).Google Scholar
Shute, C.J., Myers, B.D., Xie, S., Li, S.Y., Barbee, T.W. Jr., Hodge, A.M., and Weertman, J.R.: Detwinning, damage and crack initiation during cyclic loading of Cu samples containing aligned nanotwins. Acta Mater. 59(11), 4569 (2011).Google Scholar
You, Z.S., Lu, L., and Lu, K.: Tensile behavior of columnar grained Cu with preferentially oriented nanoscale twins. Acta Mater. 59(18), 6927 (2011).CrossRefGoogle Scholar
Shan, Z.W., Lu, L., Minor, A.M., Stach, E.A., and Mao, S.X.: The effect of twin plane spacing on the deformation of copper containing a high density of growth twins. JOM 60, 71 (2008).Google Scholar
Qin, E.W., Lu, L., Tao, N.R., Tan, J., and Lu, K.: Enhanced fracture toughness and strength in bulk nanocrystalline Cu with nanoscale twin bundles. Acta Mater. 57(20), 6215 (2009).Google Scholar
Xiong, L., You, Z.S., and Lu, L.: Enhancing fracture toughness of nanotwinned austenitic steel by thermal annealing. Scr. Mater. 119, 55 (2016).Google Scholar
Xiong, L., You, Z.S., and Lu, L.: Fracture behavior of an austenitic stainless steel with nanoscale deformation twins. Scr. Mater. 127, 173 (2017).Google Scholar
Zhou, H. and Qu, S.: The effect of nanoscale twin boundaries on fracture toughness in nanocrystalline Ni. Nanotechnology 21(3), 035706 (2010).Google Scholar
Zhou, H., Qu, S., and Yang, W.: Toughening by nano-scaled twin boundaries in nanocrystals. Modell. Simul. Mater. Sci. Eng. 18(6), 065002 (2010).Google Scholar
Liu, L., Wang, J., Gong, S.K., and Mao, S.X.: Atomistic observation of a crack tip approaching coherent twin boundaries. Sci. Rep. 4, 4397 (2014).Google Scholar
Zeng, Z., Li, X., Lu, L., and Zhu, T.: Fracture in a thin film of nanotwinned copper. Acta Mater. 98, 313 (2015).CrossRefGoogle Scholar
Kim, S-W., Li, X., Gao, H., and Kumar, S.: In situ observations of crack arrest and bridging by nanoscale twins in copper thin films. Acta Mater. 60(6–7), 2959 (2012).Google Scholar
Luo, S.S., You, Z.S., and Lu, L.: Intrinsic fracture toughness of bulk nanostructured Cu with nanoscale deformation twins. Scr. Mater. 133, 1 (2017).Google Scholar
Qin, E.W., Lu, L., Tao, N.R., and Lu, K.: Enhanced fracture toughness of bulk nanocrystalline Cu with embedded nanoscale twins. Scr. Mater. 60(7), 539 (2009).Google Scholar
Zhu, T. and Gao, H.: Plastic deformation mechanism in nanotwinned metals: An insight from molecular dynamics and mechanistic modeling. Scr. Mater. 66(11), 843 (2012).Google Scholar
You, Z., Li, X., Gui, L., Lu, Q., Zhu, T., Gao, H., and Lu, L.: Plastic anisotropy and associated deformation mechanisms in nanotwinned metals. Acta Mater. 61(1), 217 (2013).CrossRefGoogle Scholar
Kobler, A., Hodge, A.M., Hahn, H., and Kübel, C.: Orientation dependent fracture behavior of nanotwinned copper. Appl. Phys. Lett. 106(26), 261902 (2015).Google Scholar
You, Z. and Lu, L.: Effect of strain rate on tensile ductility and fracture behavior of bulk nanotwinned copper. Adv. Eng. Mater. 17(12), 1754 (2015).Google Scholar
Jang, D., Li, X., Gao, H., and Greer, J.R.: Deformation mechanisms in nanotwinned metal nanopillars. Nat. Nanotechnol. 7(9), 594 (2012).CrossRefGoogle ScholarPubMed
Zhao, X., Lu, C., Tieu, A.K., Pei, L., Zhang, L., Su, L., and Zhan, L.: Deformation mechanisms in nanotwinned copper by molecular dynamics simulation. Mater. Sci. Eng., A 687, 343 (2017).Google Scholar
Bufford, D.C., Wang, Y.M., Liu, Y., and Lu, L.: Synthesis and microstructure of electrodeposited and sputtered nanotwinned face-centered-cubic metals. MRS Bull. 41(7), 286 (2016).Google Scholar
ASTM E1820-16: Standard Test Method for Measurement of Fracture Toughness (ASTM International, West Conshohocken, PA, 2016). www.astm.org.Google Scholar
Merz, M.D. and Dahlgren, S.D.: Tensile strength and work hardening of ultrafine-grained high-purity copper. J. Appl. Phys. 46(8), 3235 (1975).Google Scholar
Hodge, A.M., Wang, Y.M., and Barbee, T.W. Jr.: Mechanical deformation of high-purity sputter-deposited nano-twinned copper. Scr. Mater. 59(2), 163 (2008).Google Scholar
Zhang, Y., Tao, N.R., and Lu, K.: Mechanical properties and rolling behaviors of nano-grained copper with embedded nano-twin bundles. Acta Mater. 56(11), 2429 (2008).Google Scholar
Launey, M.E. and Ritchie, R.O.: On the fracture toughness of advanced materials. Adv. Mater. 21, 2103 (2009).Google Scholar
Shahani, A.R., Rastegar, M., Botshekanan Dehkordi, M., and Moayeri Kashani, H.: Experimental and numerical investigation of thickness effect on ductile fracture toughness of steel alloy sheets. Eng. Fract. Mech. 77(4), 646 (2010).Google Scholar
Zhu, Y.T., Liao, X.Z., and Wu, X.L.: Deformation twinning in nanocrystalline materials. Prog. Mater. Sci. 57(1), 1 (2012).Google Scholar
Lu, Q., You, Z., Huang, X., Hansen, N., and Lu, L.: Dependence of dislocation structure on orientation and slip systems in highly oriented nanotwinned Cu. Acta Mater. 127, 85 (2017).CrossRefGoogle Scholar