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Superior thermal interface via vertically aligned carbon nanotubes grown on graphite foils

Published online by Cambridge University Press:  28 December 2012

Sabyasachi Ganguli*
Affiliation:
Nanoelectronic Materials Branch, Materials & Manufacturing Directorate, Air Force Research Laboratory, Dayton, Ohio 45433; and University of Dayton Research Institute, Dayton, Ohio 45469
Ajit K. Roy
Affiliation:
Nanoelectronic Materials Branch, Materials & Manufacturing Directorate, Air Force Research Laboratory, Dayton, Ohio 45433
Robert Wheeler
Affiliation:
UES Inc., Dayton, Ohio 45432
Vikas Varshney
Affiliation:
Nanoelectronic Materials Branch, Materials & Manufacturing Directorate, Air Force Research Laboratory, Dayton, Ohio 45433; and Universal Technology Corporation, Dayton, Ohio 45432
Feng Du
Affiliation:
Department of Chemical Engineering, Case Western Reserve University, Cleveland, Ohio 44106
Liming Dai
Affiliation:
Department of Chemical Engineering, Case Western Reserve University, Cleveland, Ohio 44106
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

In an attempt to study the thermal transport at the interface between nanotubes and graphene, vertically aligned multiwalled carbon nanotubes (CNTs) were grown on graphite thin film substrates. A systematic cross-sectional probing of the materials’ morphology of the interface by scanning electron microscopy and high-resolution transmission electron microscopy revealed that an excellent bond existed between the nanotubes and the substrate along some fraction of interface. Imaging and electron diffraction analyses performed at the boundary reveal a polycrystalline interfacial structure. Compositional probing along the interface by energy dispersive x-ray spectroscopy revealed that there were no catalyst particles or other impurities present. The estimated interfacial thermal resistance of lower than 5–7.5 (mm2K)/W suggests that this type of CNT/graphite interface could open up multiple routes toward the designing and development of advanced thermal interface materials for aerospace and nano-/microelectronics applications.

Type
Articles
Copyright
Copyright © Materials Research Society 2012

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References

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