Hostname: page-component-586b7cd67f-t8hqh Total loading time: 0 Render date: 2024-11-24T19:35:49.405Z Has data issue: false hasContentIssue false
  • English
  • Français

Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu

Published online by Cambridge University Press:  03 March 2011

S.C. Yang ,
C.E. Ho ,
C.W. Chang  and
C.R. Kao
S.C. Yang
Affiliation:
Department of Chemical & Materials Engineering, National Central University, Jhongli City, Taiwan
C.E. Ho
Affiliation:
Department of Chemical & Materials Engineering, National Central University, Jhongli City, Taiwan
C.W. Chang
Affiliation:
Department of Chemical & Materials Engineering, National Central University, Jhongli City, Taiwan
C.R. Kao*
Affiliation:
Department of Materials Science & Engineering, National Taiwan University, Taipei, Taiwan
*
a) Address all correspondence to this author. e-mail: [email protected] This author was an editor of this journal during the review and decision stage. For the JMR policy on review and publication of manuscripts authored by editors, please refer to http://www.mrs.org/jmr_policy
Get access

Abstract

The acute Zn concentration sensitivity of the reaction between Sn-based solders and Cu substrate is reported and explained in this article. Three Sn-xZn solders (x = 0.5, 0.7, and 2 wt%) were reacted with Cu substrates at 250 °C for 2–10 min. A slight variation in the Zn concentration changed the reaction product formed at the interface. When the Zn concentration was low (x = 0.5 wt%), the reaction product was Cu6Sn5. When the Zn concentration was slightly increased to 2 wt%, the reaction product became Cu5Zn8. When Zn concentration was in-between (x = 0.7 wt%), Cu6Sn5 and CuZn co-existed. The above findings are explained using the Cu–Sn–Zn phase diagram. The implication is that the type of compound forms at the interface can be controlled by adjusting the Zn concentration of the Sn-based solders.

Keywords

Chemical reactionElectronic materialSoldering
Type
Rapid Communications
Information
Journal of Materials Research , Volume 21 , Issue 10 , October 2006 , pp. 2436 - 2439
Copyright
Copyright © Materials Research Society 2006

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Anderson, I.E., Harringa, J.L.: Suppression of void coalescence in thermal aging of tin-silver-copper-x solder joints. J. Electron. Mater. 35, 94 (2006).CrossRefGoogle Scholar
2.McCormack, M., Jin, S., Kammlott, G.W., Chen, H.S.: New Pb-free solder alloy with superior mechanical properties. Appl. Phys. Lett. 63, 15 (1993).CrossRefGoogle Scholar
3.Kang, S.K., Shih, D.Y., Leonard, D., Henderson, D.W., Gosselin, T., Cho, S., Yu, J., Choi, W.K.: Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying. JOM 56, 34 (2004).CrossRefGoogle Scholar
4.Kang, S.K., Leonard, D., Shih, D.Y., Gignac, L., Henderson, D.W., Cho, S., Yu, J.: Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition. J. Electron. Mater. 35, 479 (2006).CrossRefGoogle Scholar
5.Kivilahti, J.K.: Modeling joining materials for microelectronics packaging. IEEE Trans. Compon. Pack. Manuf. Technol. B18, 326 (1995).CrossRefGoogle Scholar
6.Liu, C.M., Ho, C.E., Chen, W.T., Kao, C.R.: Reflow soldering and isothermal solid-state aging of Sn-Ag eutectic solder on Au/Ni surface finish. J. Electron. Mater. 30, 1152 (2001).CrossRefGoogle Scholar
7.Ho, C.E., Lin, Y.L., Kao, C.R.: Strong effect of Cu concentration on the reaction between lead-free microelectronic solders and Ni. Chem. Mater. 14, 949 (2002).CrossRefGoogle Scholar
8.Chen, W.T., Ho, C.E., Kao, C.R.: Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders. J. Mater. Res. 17, 263 (2002).CrossRefGoogle Scholar
9.Ho, C.E., Tsai, R.Y., Lin, Y.L., Kao, C.R.: Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni. J. Electron. Mater. 31, 584 (2002).CrossRefGoogle Scholar
10.Tu, K.N., Thompson, R.D.: Kinetics of interfacial reaction in bimetallic Cu-Sn thin films. Acta Metall. 30, 947 (1982).CrossRefGoogle Scholar
11.Bader, S., Gust, W., Hieber, H.: Rapid formation of intermetallic compounds by interdiffusion in the Cu-Sn and Ni-Sn systems. Acta Metall. Mater. 43, 329 (1995).Google Scholar
12.Huang, C.W., Lin, K.L.: Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150 °C. J. Mater. Res. 19, 3560 (2004).CrossRefGoogle Scholar
13.Ho, C.E., Lin, Y.W., Yang, S.C., Kao, C.R. Volume effect on the soldering reaction between SnAgCu solders and Ni, Proceedings of 10th International Symposium on Advanced Packaging Materials (IEEE, Piscataway, NJ, 2005), p. 39.Google Scholar
14.Ho, C.E., Yang, S.C., Kao, C.R.: Interfacial reaction issues for lead-free electronic solders. J. Mater. Sci.-Mater. El. (2006) (in press).CrossRefGoogle Scholar
15.Ho, C.E., Lin, Y.W., Yang, S.C., Kao, C.R., Jiang, D.S.: Effect of limited Cu supply on soldering reactions between SnAgCu and Ni. J. Electron. Mater. 35, 1017 (2006).CrossRefGoogle Scholar
16.Shiau, L.C., Ho, C.E., Kao, C.R.: Reactions between SnAgCu lead-free solders and the Au/Ni surface finish in advanced electronic packages. Solder Surf. Mt. Technol. 14, 25 (2002).CrossRefGoogle Scholar
17.Chou, C.Y., Chen, S.W.: Phase equilibria of Sn-Zn-Cu ternary system. Acta Mater. 54, 2393 (2006).CrossRefGoogle Scholar