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Strong Zn concentration effect on the soldering reactions between Sn-based solders and Cu

Published online by Cambridge University Press:  03 March 2011

S.C. Yang ,
C.E. Ho ,
C.W. Chang  and
C.R. Kao
S.C. Yang
Affiliation:
Department of Chemical & Materials Engineering, National Central University, Jhongli City, Taiwan
C.E. Ho
Affiliation:
Department of Chemical & Materials Engineering, National Central University, Jhongli City, Taiwan
C.W. Chang
Affiliation:
Department of Chemical & Materials Engineering, National Central University, Jhongli City, Taiwan
C.R. Kao*
Affiliation:
Department of Materials Science & Engineering, National Taiwan University, Taipei, Taiwan
*
a) Address all correspondence to this author. e-mail: [email protected] This author was an editor of this journal during the review and decision stage. For the JMR policy on review and publication of manuscripts authored by editors, please refer to http://www.mrs.org/jmr_policy
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Abstract

The acute Zn concentration sensitivity of the reaction between Sn-based solders and Cu substrate is reported and explained in this article. Three Sn-xZn solders (x = 0.5, 0.7, and 2 wt%) were reacted with Cu substrates at 250 °C for 2–10 min. A slight variation in the Zn concentration changed the reaction product formed at the interface. When the Zn concentration was low (x = 0.5 wt%), the reaction product was Cu6Sn5. When the Zn concentration was slightly increased to 2 wt%, the reaction product became Cu5Zn8. When Zn concentration was in-between (x = 0.7 wt%), Cu6Sn5 and CuZn co-existed. The above findings are explained using the Cu–Sn–Zn phase diagram. The implication is that the type of compound forms at the interface can be controlled by adjusting the Zn concentration of the Sn-based solders.

Keywords

Chemical reactionElectronic materialSoldering
Type
Rapid Communications
Information
Journal of Materials Research , Volume 21 , Issue 10 , October 2006 , pp. 2436 - 2439
Copyright
Copyright © Materials Research Society 2006

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