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Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Published online by Cambridge University Press:  03 March 2011

Y.C. Sohn*
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-Dong, Yuseong-Gu, Daejeon 305-701, Korea
Jin Yu
Affiliation:
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology, 373-1 Guseong-Dong, Yuseong-Gu, Daejeon 305-701, Korea
S.K. Kang
Affiliation:
IBM T.J. Watson Research Center, P.O. Box 218/Route 134, Yorktown Heights, New York 10598
D.Y. Shih
Affiliation:
IBM T.J. Watson Research Center, P.O. Box 218/Route 134, Yorktown Heights, New York 10598
T.Y. Lee
Affiliation:
Department of Materials Science and Engineering, Hanbat National University, San 16-1, DukMyoung-Dong, Yuseong-Gu, Deajeon 305-764, Korea
*
a)Address all correspondence to this author.e-mail: [email protected]
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Abstract

Intermetallic compound (IMC) spalling from electroless Ni-P film was investigated with lead-free solders in terms of solder-deposition methods (electroplating, solder paste, and thin foil), P content in the Ni-P film (4.6, 9, and 13 wt% P), and solder thickness (120 versus .200 μm). The reaction of Ni-P with Sn3.5Ag paste easily led to IMC spalling after 2-min reflow at 250 °C while IMCs adhered to the Ni-P layer after 10-min reflow with electroplated Sn or Sn3.5Ag. It has been shown that not only the solder composition but also the deposition method is important for IMC spalling from the Ni-P layer. The spalling increased with P content as well as with solder volume. Ni3Sn4 intermetallics formed as a needle-shaped morphology at an early stage and changed into a chunk-shape. Needle-shaped compounds exhibited a higher propensity for spalling than chunk-shaped compounds because many channels among the needle-shaped IMCs facilitated Sn penetration. A reaction between the penetrated Sn and the Ni3P layer formed a Ni3SnP layer and Ni3Sn4 IMCs spalled off the Ni3SnP surface. Dewetting of solder from the Ni3SnP layer, however, did not occur even after spalling of most IMCs.

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Articles
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1.Tummala, R.R., Rymaszewski, E.J. and Klopfenstein, A.G.: Microelectronics Packaging Handbook, 2nd ed. (Chapman & Hall, 1997) Part 2, Ch 8Google Scholar
2.Baker-Pole, M.: Printed circuits-origin and development, Part 2. Circuit World 10, 8 (1984).CrossRefGoogle Scholar
3.Shimade, Y., Utsumi, K., Suzuki, M., Takamizowa, H., Nitta, M. and Watari, T.: Low firing temperature multiplayer glass-ceramic substrate. IEEE Trans-CHMT . 6, 382 (1983).Google Scholar
4.Kang, S.K. and Ramachandran, V.: Growth kinetics of intermetallic phases at the liquid Sn and solid Ni interface. Scripta Met. 14, 421 (1980).CrossRefGoogle Scholar
5.Walker, G.A., Dehaven, P.W., and Goldsmith, C.C.: (Proc 34th Electronic Components and Technology Conf, 1984), p. 125.Google Scholar
6.Kang, S.K., Rai, R.S. and Purushothaman, S.: Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders. J. Electron. Mater. 25, 1113 (1996).CrossRefGoogle Scholar
7.Li, M., Zhang, F., Chen, W.T., Zeng, K., Tu, K.N., Balkan, H. and Elenius, P.: Interfacial microstructure evolution between eutectic SnAgCu solder and Al/Ni(V)/Cu thin films. J. Mater. Res. 17, 1612 (2002).CrossRefGoogle Scholar
8.Zhang, F., Li, M., Chum, C.C. and Tu, K.N.: Influence of substrate metallization on diffusion and reaction at the under-bump metallization/solder interface in flip-chip packages. J. Mater. Res. 17, 2757 (2002).CrossRefGoogle Scholar
9.Jang, J.W., Frear, D.R., Lee, T.Y. and Tu, K.N.: Morphology of interfacial reaction between lead-free solders and electroless Ni-P under bump metallization. J. Appl. Phys. 88, 6359 (2000).CrossRefGoogle Scholar
10.Kang, S.K., Shih, D.Y., Fogel, K., Lauro, P., Yim, M.J., Advocate, G., Griffin, M., Goldsmith, C., Henderson, D.W., Gosselin, T., King, D., Konrad, J., Sarkhel, A., and Puttlitz, K.J.: Interfacial reaction studies on lead (Pb)-free solder alloys. (Proc 51st Electronic Components and Technology Conf, 2001), p. 448.Google Scholar
11.Ghosh, G.: Dissolution and interfacial reactions of thin-film Ti/Ni/Ag metallizations in solder joints. Acta Mater. 49, 2609 (2001).CrossRefGoogle Scholar
12.Alam, M.O., Chan, Y.C. and Tu, K.N.: Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad. J. Appl. Phys. 94, 4108 (2003).CrossRefGoogle Scholar
13.Liu, C.Y., Chen, Chih, Mal, A.K. and Tu, K.N.: Direct correlation between mechanical failiure and metallurgical reaction in flip chip solder joints. J. Appl. Phys. 85, 3882 (1999).CrossRefGoogle Scholar
14.Kim, P.G., Jang, J.W., Lee, T.Y. and Tu, K.N.: Interfacial reaction and wetting behavior in eutectic SnPb solder on Ni/Ti thin films and Ni foils. J. Appl. Phys. 86, 6746 (1999).CrossRefGoogle Scholar
15.Kim, H.K., Tu, K.N. and Totta, P.A.: Ripening-assisted asymmetric spalling of Cu-Sn compound sheroids in solder joints on Si wafers. Appl. Phys. Lett. 68, 2204 (1996).CrossRefGoogle Scholar
16.Liu, Ann A., Kim, H.K., Tu, K.N. and Totta, P.A.: Spalling of Cu6Sn5 spheroids in the soldering reaction of eutectic SnPb on Cr/Cu/Au thin films. J. Appl. Phys. 80, 2774 (1996).CrossRefGoogle Scholar
17.Pan, G.Z., Liu, Ann A., Kim, H.K., Tu, K.N. and Totta, P.A.: Microstructure of phased-in Cr-Cu/Cu/Au bump-limiting metallization and its soldering behavior with high Pb content and eutectic PbSn solders. Appl. Phys. Lett. 71, 2946 (1997).CrossRefGoogle Scholar
18.Liu, C.Y., Tu, K.N., Sheng, T.T., Tung, C.H., Frear, D.R. and Elenius, P.: Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization. J. Appl. Phys. 87, 750 (2000).CrossRefGoogle Scholar
19.Kreye, H., Müller, F., Lang, K., Isheim, D. and Hentschel, T.: Structure and conversion behavior of nanocrystalline nickel-phosphorus alloys. Z. Metallkd. 86, 184 (1995).Google Scholar
20.Kreye, H., Müller, H-H. and Petzel, T.: Structure and thermal stability of chemically isolated nickel-phosphorus films. Galvanotechnik 77, 561 (1986).Google Scholar
21.Dietz, G. and Schneider, H.D.: Decomposition of crystalline ferromagnetic particles precipitated in amorphous paramagnetic Ni-P. J. Phys. Condens. Matter 2, 2169 (1990).CrossRefGoogle Scholar
22.Park, S.H. and Lee, D.N.: A study on the microstructure and phase transformation of electroless nickel deposits. J. Mater. Sci. 23, 1643 (1988).CrossRefGoogle Scholar
23.Hur, K.H., Jeong, J.H. and Lee, D.N.: Microstructure and crystallization of electroless Ni-P deposits. J. Mater. Sci. 25, 2573 (1990).CrossRefGoogle Scholar
24.Jang, J.W., Kim, P.G., Tu, K.N., Frear, D.R. and Thompson, P.: Solder reaction-assisted crystallization of electroless Ni-P under bump metallization in low cost flip chip technology. J. Appl. Phys. 85, 8456 (1999).CrossRefGoogle Scholar
25.Sohn, Y.C., Jin, Yu., Kang, S.K., Choi, W.K. and Shih, D.Y.: Study of the reaction mechanism between electroless Ni-P and Sn and its effect on the crystallization of Ni-P. J. Mater. Res. 18, 4 (2003).CrossRefGoogle Scholar
26.Sohn, Y.C., Jin, Yu., Kang, S.K., Choi, W.K. and Shih, D.Y.Effect of phosphorus content on the reaction of electroless Ni-P with Sn and crystallization of Ni-P. J. Electron. Mater. (accepted for publication)Google Scholar
27.Zeng, K. and Tu, K.N.: Six cases of reliability study of Pb-free solder joints in electronic packaging technology. Mater. Sci. Eng. R 38, 55 (2002).CrossRefGoogle Scholar
28.Hwang, C.W., Suganuma, K., Kiso, M. and Hashimoto, S.: Interface microstructures between Ni-P alloy plating and Sn-Ag-(Cu) lead-free solders. J. Mater. Res. 18, 2540 (2003).CrossRefGoogle Scholar
29.Sohn, Y.C., Yu, Jin and Lee, T.Y. unpublished workGoogle Scholar
30.Tu, K.N. and Zeng, K.: Tin-lead (SnPb) solder reaction in flip chip technology. Mater. Sci. Eng. R 34, 1 (2001).CrossRefGoogle Scholar