Hostname: page-component-586b7cd67f-gb8f7 Total loading time: 0 Render date: 2024-11-24T15:50:04.822Z Has data issue: false hasContentIssue false
  • English
  • Français

Sequential self-assembly of micron-scale components with light

Published online by Cambridge University Press:  17 January 2011

E. Saeedi ,
J.R. Etzkorn  and
B.A. Parviz
E. Saeedi
Affiliation:
Department of Electrical Engineering, University of Washington, Seattle, Washington 98195
J.R. Etzkorn
Affiliation:
Department of Electrical Engineering, University of Washington, Seattle, Washington 98195
B.A. Parviz*
Affiliation:
Department of Electrical Engineering, University of Washington, Seattle, Washington 98195
*
a)Address all correspondence to this author. e-mail: [email protected]
Get access

Abstract

We present a versatile and flexible method to sequentially self-assemble micron-scale components at specific locations onto unconventional substrates, such as glass and plastic. In this method, components are independently batch fabricated and assembled onto a series of receptor sites incorporated onto a substrate in a fluid medium. Initially, all self-assembly sites are blocked with a photoresist polymer. Controlled light exposure can be used to remove the polymer and make a site available for receiving a microcomponent. By repeating this procedure, various microcomponents may be integrated onto specific locations on the substrate. To demonstrate the process, we prepared four types of 20 μm thick, 320 μm diameter circular silicon components and showed their optically controllable self-assembly in arrays of 640 receptor sites on glass and plastic with yields reaching 85%. The integration and operation of two types of functional components, red light-emitting diodes and silicon resistors, on plastic substrates was also demonstrated.

Type
Reviews
Information
Journal of Materials Research , Volume 26 , Issue 2: Focus Issue: Self-Assembly and Directed Assembly of Advanced Materials , 28 January 2011 , pp. 268 - 276
Copyright
Copyright © Materials Research Society 2011

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1.Morris, C.J., Stauth, S.S., and Parviz, B.A.: Self-assembly for micro and nano scale packaging: Steps towards self-packaging. IEEE Trans. Adv. Packag. 28(4), 600 (2005).CrossRefGoogle Scholar
2.Mastrangeli, M., Abbasi, S., Varel, C., Hoof, C.V., Celis, J.P., and Bohringer, K.F.: Self-assembly from milli-to nanoscales: Methods and applications. J. Micromech. Microeng. 19(8), 083001 (2009).CrossRefGoogle Scholar
3.Whitesides, G.M. and Grzybowski, B.: Self-assembly at all scales. Science 29, 2418 (2002).CrossRefGoogle Scholar
4.Saeedi, E., Abbasi, S., Bohringer, K.F., and Parviz, B.A.: Molten-alloy driven self-assembly for nano and micro scale system integration. Fluid Dyn. Mater. Processing 2, 221 (2006).Google Scholar
5.Keren, K., Berman, R.S., Buchstab, E., Sivan, U., and Braun, E.: DNA-templated carbon nanotube field-effect transistor. Science 302, 1380 (2003).CrossRefGoogle ScholarPubMed
6.Mirkin, C.A.: Programming the assembly of two- and three-dimensional architectures with DNA and nanoscale inorganic building blocks. Inorg. Chem. 39(11), 2258 (2000).CrossRefGoogle ScholarPubMed
7.Salant, A., Sadovsky, E.A., and Banin, U.: Directed self-assembly of gold-tipped CdSe nanorods. J. Am. Chem. Soc. 128(31), 10006 (2006).CrossRefGoogle ScholarPubMed
8.Gole, A. and Murphy, C.J.: Biotin-streptavidin-induced aggregation of gold nanorods: Tuning rod-rod orientation. Langmuir 21, 10756 (2005).CrossRefGoogle ScholarPubMed
9.Chen, M., Guo, L., Ravi, R., and Searson, P.C.: Kinetics of receptor directed assembly of multisegment nanowires. J. Phys. Chem. B 110, 211 (2006).CrossRefGoogle ScholarPubMed
10.Lee, S.W., McNally, H.A., Guo, D., Pingle, M., Bergstrom, D.E., and Bashir, R.: Electric-field-mediated assembly of silicon islands coated with charged molecules. Langmuir 18, 3383 (2002).CrossRefGoogle Scholar
11.Le, J.D., Pinto, Y., Seeman, N.C., Musier-Forsyth, K., Taton, T.A., and Kiehl, R.A.: DNA-templated self-assembly of metallic nanocomponent arrays on a surface. Nano Lett. 4(12), 2343 (2004).CrossRefGoogle Scholar
12.Wang, X., Liu, F., Andavan, G.T., Jing, X., Singh, K., Yazdanpanah, V.R., Bruque, N., Pandey, R.R., Lake, R., Ozkan, M., Wang, K.L., and Ozkan, C.S.: Carbon manotube–DNA nanoarchitectures and electronic functionality. Small 2(11), 1356 (2006).CrossRefGoogle ScholarPubMed
13.Morrow, T.J., Li, M., Kim, J., Mayer, T.S., and Keating, C.D.: Programmed assembly of DNA-coated nanowire devices. Science 323, 352 (2009).CrossRefGoogle ScholarPubMed
14.Xiong, X., Hanein, Y., Fang, J., Wang, Y., Wang, W., Schwartz, D.T., and Böhringer, K.F.: Controlled multibatch self-assembly of microdevices. JMEMS 12(2), 117 (2003).Google Scholar
15.Liu, M., Lau, W.M., and Yang, J.: On-demand multi-batch self-assembly of hybrid MEMS by patterning solders of different melting points. J. Micromech. Microeng. 17, 2163 (2007).CrossRefGoogle Scholar
16.Chung, J., Zheng, W., Hatch, T.J., and Jacobs, H.O.: Programmable reconfigurable self-assembly: Parallel heterogeneous integration of chip-scale components on planar and nonplanar surfaces. JMEMS 15(3), 457 (2006).Google Scholar
17.Sharma, R.: Thermally controlled fluidic self-assembly. Langmuir 23, 6843 (2007).CrossRefGoogle ScholarPubMed
18.Chiou, P.Y., Ohta, A.T., and Wu, M.C.: Massively parallel manipulation of single cells and microparticles using optical images. Nature 436, 370 (2005).CrossRefGoogle ScholarPubMed
19.Subramanian, A., Vikramaditya, B., Nelson, B.J., Bell, D., and Dong, L.: Dielectrophoretic micro/nanoassembly with microtweezers and nanoelectrodes,in IEEE 12th International Conference on Advanced Robotics (ICAR, Seattle, WA, 2005), p. 208.Google Scholar
20.Edman, C.F., Swint, R.B., Gurtner, C., Formosa, R.E., Roh, S.D., Lee, K.E., Swanson, P.D., Ackley, D.E., Coleman, J.J., and Heller, M.J.: Electric field directed assembly of an InGaAs LED onto silicon circuitry. IEEE Photon. Technol. Lett. 12(9), 1198 (2000).CrossRefGoogle Scholar
21.Hunt, T.P., Issadore, D., and Westervelt, R.M.: Integrated circuit/microfluidic chip to programmably trap and move cells and droplets with dielectrophoresis. Lab Chip 8, 81 (2008).CrossRefGoogle ScholarPubMed
22.Papadakis, S.J., Gu, Z., and Gracias, D.H.: Dielectrophoretic assembly of reversible and irreversible metal nanowire networks and vertically aligned arrays. Appl. Phys. Lett. 88, 233118 (2006).CrossRefGoogle Scholar
23.Morris, C.J. and Parviz, B.A.: Micro-scale metal contacts for capillary force-driven self-assembly. J. Micromech. Microeng. 18, 015022 (2008).Google Scholar
24.Saeedi, E., Kim, S., and Parviz, B.A.: Self-assembled crystalline semiconductor optoelectronics on glass and plastic. J. Micromech. Microeng. 18(7), 075019 (2008).CrossRefGoogle Scholar
25.Stauth, S.A. and Parviz, B.A.: Self-assembled single-crystal silicon circuits on plastic. PNAS. 103, 13922 (2006).CrossRefGoogle ScholarPubMed
26.Saeedi, E., Etzkorn, J., Deraghi, L., and Parviz, B.A.: Optically programmable self-assembly of heterogeneous micro-components on unconventional substrates, in 22nd International Conference on IEEE MEMS (Sorento, Italy, 2009), p. 717.Google Scholar