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Relating mechanical testing and microstructural features of polysilicon thin films

Published online by Cambridge University Press:  31 January 2011

S. Jayaraman ,
R. L. Edwards  and
K. J. Hemker
S. Jayaraman
Affiliation:
Department of Materials Science and Engineering, The Johns Hopkins University, 3400 North Charles Street, Baltimore, Maryland 21218
R. L. Edwards
Affiliation:
Applied Physics Laboratory Department of Technical Services, The Johns Hopkins University, 3400 North Charles Street, Baltimore, Maryland 21218
K. J. Hemker*
Affiliation:
Department of Mechanical Engineering, The Johns Hopkins University, 3400 North Charles Street, Baltimore, Maryland 21218
*
b)Author all correspondence to this author. e-mail: [email protected]
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Abstract

Polycrystalline silicon thin films (polysilicon) have been deposited on single crystalline silicon substrates, and square and rectangular windows have been etched into these substrates using standard micromachining techniques. Pressure-displacement curves of the resulting polysilicon membranes have been obtained for these geometries, and this data has been used to determine the elastic constants E and v. The microstructural features of the films have been investigated by transmission electron microscopy (TEM) and x-ray diffraction. The grains were observed to be columnar and were found to have a 〈011〉 out-of-plane texture and a random in-plane grain orientation. A probabilistic model of the texture has been used to calculate the bounds of the elastic constants in the thin films. The results obtained from bulge testing (E = 162 ± 4 GPa and v = 0.20 ± 0.03) fall in the wide range of values previously reported for polysilicon and are in good agreement with the microsample tensile measurements conducted on films deposited in the same run as the present study (168 ± 2 GPa and 0.22 ± 0.01) and the calculated values of the in-plane moduli for 〈1103〉 textured films (E = 163.0–165.5 GPa and v = 0.221–0.239).

Type
Articles
Information
Journal of Materials Research , Volume 14 , Issue 3 , March 1999 , pp. 688 - 697
Copyright
Copyright © Materials Research Society 1999

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