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Preferential growth and orientation relationship of Ag3Sn grains formed between molten Sn and (001) Ag single crystal

Published online by Cambridge University Press:  31 January 2011

H.F. Zou ,
H.J. Yang ,
J. Tan  and
Z.F. Zhang
Z.F. Zhang*
Affiliation:
Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, People's Republic of China
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

The current study shows that there is a preferred orientation relationship between Ag3Sn and Ag in reaction between molten Sn and Ag. Due to the preferred orientation relationship, the morphology of Ag3Sn grains formed on (001) Ag single crystal is different from those formed on (011), (358) single crystal Ag, and polycrystalline Ag Facet scallop-type Ag3Sn grains formed irregularly on (011), (358) single crystal Ag, and polycrystalline Ag; whereas the regular Ag3Sn grains with parallel edges grew on (001) Ag single crystal, and they were elongated along two perpendicular directions. The orientation relationship between Ag3Sn grains and (001) Ag single crystal was determined using electron backscattered diffraction. The preferential growth of regular Ag3Sn grains with parallel edges formed on (001) Ag single crystal can be attributed to their minimum misfit.

Keywords

AgSnSoldering
Type
Articles
Information
Journal of Materials Research , Volume 24 , Issue 6 , June 2009 , pp. 2141 - 2144
Copyright
Copyright © Materials Research Society 2009

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References

1Laurila, T., Vuorinen, V., and Kivilahti, J.K.: Interfacial reactions between lead-free solders and common base materials. Mater. Sci. Eng., R 49, 1 (2005)CrossRefGoogle Scholar
2Abtew, M. and Selvaduray, G.: Lead-free solders in microelectronics. Mater. Sci. Eng., R 27, 95 (2000)CrossRefGoogle Scholar
3Alam, M.O. and Chan, Y.C.: Interfacial reaction phenomena of Sn-Pb solder with Au/Ni/Cu metallization. Chem. Mater. 17, 927 (2005)CrossRefGoogle Scholar
4Tao, W.H., Chen, C., Ho, C.E., Chen, W.T., and Kao, C.R.: Selective interfacial reaction between Ni and eutectic BiSn lead-free solder. Chem. Mater. 13, 1051 (2001)CrossRefGoogle Scholar
5Bae, K.S. and Kim, S.J.: Microstructure and adhesion properties of Sn-0.7Cu/Cu solder joints. J. Mater. Res. 17, 743 (2002)CrossRefGoogle Scholar
6Kim, H.K. and Tu, K.N.: Kinetic analysis of the soldering reaction between eutectic SnPb alloy and Cu accompanied by ripening. Phys. Rev. B 53, 16027 (1996)CrossRefGoogle ScholarPubMed
7Suh, J.O., Tu, K.N., and Tamura, N.: Dramatic morphological change of scallop-type Cu6Sn5 formed on (001) single crystal copper in reaction between molten SnPb solder and Cu. Appl. Phys. Lett. 91, 051907 (2007)CrossRefGoogle Scholar
8Suh, J.O., Tu, K.N., and Tamura, N.: Preferred orientation relationship between Cu6Sn5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu. J. Appl. Phys. 102, 063511 (2007)CrossRefGoogle Scholar
9Zou, H.F., Yang, H.J., and Zhang, Z.F.: Morphologies, orientation relationships and evolution of Cu6Sn5 grains formed between molten Sn and Cu single crystals. Acta Mater. 56, 2649 (2008)CrossRefGoogle Scholar
10Alam, M.O., Chan, Y.C., and Tu, K.N.: Effect of 0.5 wt% Cu in Sn-3.5%Ag solder balls on the solid state interfacial reaction with Au/Ni/Cu bond pads for ball grid array (BGA) applications. Chem. Mater. 17, 2223 (2005)CrossRefGoogle Scholar
11Yen, Y.W., Jao, C.C., and Lee, C.: Effect of Cu addition on inter-facial reaction between Sn-9Zn solder and Ag. J. Mater. Res. 21, 2986 (2006)Google Scholar
12Cheng, M.D., Wang, S.S., and Chuang, T.H.: Soldering reactions between In49Sn and Ag thick films. J. Electron. Mater. 31(3), 171 (2002).CrossRefGoogle Scholar
13Zou, H.F., Zhu, Q.S., and Zhang, Z.F.: Growth kinetics of intermetallic compounds and tensile properties of Sn-Ag-Cu/Ag single crystal joint. J. Alloys Compd. 461, 410 (2008)CrossRefGoogle Scholar
14Li, P., Zhang, Z.F., Li, S.X., and Wang, Z.G.: Effect of orientations on cyclic deformation behaviors of Ag and Cu single crystals: CSS curve and slip morphology. Acta Mater. 56, 2212 (2008)CrossRefGoogle Scholar
15Suh, J.O., Tu, K.N., Lutsenko, G.V., and Gusak, A.M.: Size distribution and morphology of scallops in wetting reaction between molten solder and copper. Acta Mater. 56, 1075 (2008)CrossRefGoogle Scholar
16Fairhurst, C.W. and Cohen, J.B.: The crystal structures of two compounds found in dental amalgam: Ag2Hg3 and Ag3Sn. Acta Crystallogr., Sect. B 28, 371 (1972)CrossRefGoogle Scholar