Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Budiman, Arief Suriadi
Lee, Gyuhyon
Burek, Michael J.
Jang, Dongchan
Han, Seung Min J.
Tamura, Nobumichi
Kunz, Martin
Greer, Julia R.
and
Tsui, Ting Y.
2012.
Plasticity of indium nanostructures as revealed by synchrotron X-ray microdiffraction.
Materials Science and Engineering: A,
Vol. 538,
Issue. ,
p.
89.
Gram, Michael D.
Carpenter, John S.
Payzant, E. Andrew
Misra, Amit
and
Anderson, Peter M.
2013.
X-Ray Diffraction Studies of Forward and Reverse Plastic Flow in Nanoscale Layers During Thermal Cycling.
Materials Research Letters,
Vol. 1,
Issue. 4,
p.
233.
Faurie, Damien
Djaziri, Soundes
Renault, Pierre-Olivier
Le Bourhis, Eric
Goudeau, Philippe
Geandier, Guillaume
and
Thiaudière, Dominique
2015.
Machine biaxiale sur la ligne de lumière Diffabs pour l’étude
des propriétés mécaniques de films minces déposés sur substrats polymères.
Matériaux & Techniques,
Vol. 103,
Issue. 6,
p.
610.
Jamison, Ryan D.
and
Shen, Yu-Lin
2015.
Indentation-derived elastic modulus of multilayer thin films: Effect of unloading-induced plasticity.
Journal of Materials Research,
Vol. 30,
Issue. 15,
p.
2279.
Yang, Li
Ge, Jinguo
Liu, Haixiang
Xu, Liufeng
and
Bo, Anbing
2015.
Effect of Cooling Rate on the Microstructure and Mechanical Properties of Sn-1.0Ag-0.5Cu–0.2BaTiO3 Composite Solder.
Journal of Electronic Materials,
Vol. 44,
Issue. 11,
p.
4595.
Budiman, A.S.
Narayanan, Karthic R.
Li, N.
Wang, J.
Tamura, N.
Kunz, M.
and
Misra, A.
2015.
Plasticity evolution in nanoscale Cu/Nb single-crystal multilayers as revealed by synchrotron X-ray microdiffraction.
Materials Science and Engineering: A,
Vol. 635,
Issue. ,
p.
6.
Polyakov, Mikhail N.
Lohmiller, Jochen
Gruber, Patric A.
and
Hodge, Andrea M.
2015.
Load Sharing Phenomena in Nanoscale Cu/Nb Multilayers.
Advanced Engineering Materials,
Vol. 17,
Issue. 6,
p.
810.
Bie, B.X.
Huang, J.Y.
Su, B.
Lu, L.
Fan, D.
E, J.C.
Sun, T.
Fezzaa, K.
Qi, M.L.
and
Luo, S.N.
2016.
Dynamic tensile deformation and damage of B4C-reinforced Al composites: Time-resolved imaging with synchrotron x-rays.
Materials Science and Engineering: A,
Vol. 664,
Issue. ,
p.
86.
Tian, Tian
Morusupalli, R.
Shin, H.
Son, H.-Y.
Byun, K.-Y.
Joo, Y.-C.
Caramto, R.
Smith, L.
Shen, Y-L.
Kunz, M.
Tamura, N.
and
Budiman, A.S.
2016.
On the Mechanical Stresses of Cu Through-Silicon Via (TSV) Samples Fabricated by SK Hynix vs. SEMATECH – Enabling Robust and Reliable 3-D Interconnect/Integrated Circuit (IC) Technology.
Procedia Engineering,
Vol. 139,
Issue. ,
p.
101.
Rmili, W.
Vivet, N.
Chupin, S.
Le Bihan, T.
Le Quilliec, G.
and
Richard, C.
2016.
Quantitative Analysis of Porosity and Transport Properties by FIB-SEM 3D Imaging of a Solder Based Sintered Silver for a New Microelectronic Component.
Journal of Electronic Materials,
Vol. 45,
Issue. 4,
p.
2242.
Gauss, C.
Souza Filho, I.R.
Sandim, M.J.R.
Suzuki, P.A.
Ramirez, A.J.
and
Sandim, H.R.Z.
2016.
In situ synchrotron X-ray evaluation of strain-induced martensite in AISI 201 austenitic stainless steel during tensile testing.
Materials Science and Engineering: A,
Vol. 651,
Issue. ,
p.
507.
Kim, Youbin
Baek, Jinwook
Kim, Sunghwan
Kim, Sangmin
Ryu, Seunghwa
Jeon, Seokwoo
and
Han, Seung Min
2016.
Radiation Resistant Vanadium-Graphene Nanolayered Composite.
Scientific Reports,
Vol. 6,
Issue. 1,
Rengarajan, Karthic Narayanan
Radchenko, Ihor
Illya, Gregoria
Handara, Vincent
Kunz, Martin
Tamura, Nobumichi
and
Budiman, Arief Suriadi
2016.
Low Stress Encapsulants? Influence of Encapsulation Materials on Stress and Fracture of Thin Silicon Solar Cells as Revealed by Synchrotron X-ray Submicron Diffraction.
Procedia Engineering,
Vol. 139,
Issue. ,
p.
76.
Specht, Paul E.
Weihs, Timothy P.
and
Thadhani, Naresh N.
2016.
Interfacial Effects on the Dispersion and Dissipation of Shock Waves in Ni/Al Multilayer Composites.
Journal of Dynamic Behavior of Materials,
Vol. 2,
Issue. 4,
p.
500.
Morusupalli, Rao
Rao, R.
Lee, Tae-Kyu
Shen, Yu-Lin
Kunz, M.
Tamura, N.
and
Budiman, A.S.
2016.
Critical Temperature Shift for Stress Induced Voiding in Advanced Cu Interconnects for 32 nm and Beyond.
Procedia Engineering,
Vol. 139,
Issue. ,
p.
32.
Rahimi, Reza
Ullrich, Christiane
Klemm, Volker
Rafaja, David
De Cooman, Bruno C.
Biermann, Horst
and
Mola, Javad
2016.
Influence of Al on the temperature dependence of strain hardening behavior and glide planarity in Fe–Cr–Ni–Mn–C austenitic stainless steels.
Materials Science and Engineering: A,
Vol. 649,
Issue. ,
p.
301.
Zhang, Ying
Liu, Dawei
Wang, Yan
Du, Jingyuan
Zhang, Cheng
Feng, Shuaijie
Ouyang, Taoyuan
and
Suo, Jinping
2016.
A 9%Cr ODS steel composite material reinforced by Ti layers.
Materials Science and Engineering: A,
Vol. 676,
Issue. ,
p.
253.
Zhu, Aibin
He, Dayong
He, Renjie
and
Zou, Chao
2016.
Nanoindentation simulation on single crystal copper by quasi-continuum method.
Materials Science and Engineering: A,
Vol. 674,
Issue. ,
p.
76.
Jamison, Ryan D.
and
Shen, Yu-Lin
2016.
Delamination analysis of metal–ceramic multilayer coatings subject to nanoindentation.
Surface and Coatings Technology,
Vol. 303,
Issue. ,
p.
3.
Wang, Jian
Zhou, Qing
Shao, Shuai
and
Misra, Amit
2017.
Strength and plasticity of nanolaminated materials.
Materials Research Letters,
Vol. 5,
Issue. 1,
p.
1.