Crossref Citations
This article has been cited by the following publications. This list is generated based on data provided by
Crossref.
Chen, Sinn-Wen
and
Chang, Cheng-An
2004.
Phase equilibria of the Sn-Ag-Cu-Ni quaternary system at the sn-rich corner.
Journal of Electronic Materials,
Vol. 33,
Issue. 10,
p.
1071.
Chiu, Chen-nan
Huang, Yu-chih
Zi, An-ren
and
Chen, Sinn-wen
2005.
Isoplethal Sections of the Liquidus Projection and the 250°C Phase Equilibria of the Sn–Ag–Cu–Ni Quaternary System at the Sn-Rich Corner.
MATERIALS TRANSACTIONS,
Vol. 46,
Issue. 11,
p.
2426.
Yeh, Po-Yi
Song, Jenn-Ming
and
Lin, Kwang-Lung
2006.
Dissolution behavior of Cu and Ag substrates in molten solders.
Journal of Electronic Materials,
Vol. 35,
Issue. 5,
p.
978.
Chen, Sinn-Wen
Wang, Chao-Hong
Lin, Shih-Kang
and
Chiu, Chen-Nan
2006.
Phase Diagrams of Pb-Free Solders and their Related Materials Systems.
Journal of Materials Science: Materials in Electronics,
Vol. 18,
Issue. 1-3,
p.
19.
Yi-Shao Lai
Chiu-Wen Lee
Ying-Ta Chiu
and
Yu-Hsiu Shao
2006.
Electromigration of 96.5Sn-3Ag-0.5Cu Flip-chip Solder Bumps Bonded on Substrate Pads of Au/Ni/Cu or Cu Metallization.
p.
641.
Yen, Yee-Wen
Jao, Chien-Chung
Hsiao, Hsien-Ming
Lin, Chung-Yung
and
Lee, Chiapyng
2007.
Investigation of the Phase Equilibria of Sn-Cu-Au Ternary and Ag-Sn-Cu-Au Quaternary Systems and Interfacial Reactions in Sn-Cu/Au Couples.
Journal of Electronic Materials,
Vol. 36,
Issue. 2,
p.
147.
Kroupa, A.
Dinsdale, A. T.
Watson, A.
Vrestal, J.
Vízdal, J.
and
Zemanova, A.
2007.
The development of the COST 531 lead-free solders thermodynamic database.
JOM,
Vol. 59,
Issue. 7,
p.
20.
Lai, Yi-Shao
and
Chiu, Ying-Ta
2007.
Failure Mechanism of Sn-Ag-Cu Flip-chip Solder Joints with Different Cu Weight Contents Under Comparatively Low Current Stressing.
p.
1462.
Chen, Sinn-Wen
Wang, Chao-Hong
Lin, Shih-Kang
and
Chiu, Chen-Nan
2007.
Lead-Free Electronic Solders.
p.
19.
Liu, X. J.
Wang, C. P.
Gao, F.
Ohnuma, I.
and
Ishida, K.
2007.
Thermodynamic Calculation of Phase Equilibria in the Sn-Ag-Cu-Ni-Au System.
Journal of Electronic Materials,
Vol. 36,
Issue. 11,
p.
1429.
Chen, S.-W.
Chiu, C.-N.
and
Hsieh, K.-C.
2007.
Phase Equilibria of the Sn-Ag-Cu-Ni Quaternary System at 210°C.
Journal of Electronic Materials,
Vol. 36,
Issue. 3,
p.
197.
Lai, Yi-Shao
and
Chiu, Ying-Ta
2008.
Electromigration Reliability With Respect to Cu Weight Contents of Sn–Ag–Cu Flip-Chip Solder Joints Under Comparatively Low Current Stressing.
Journal of Electronic Packaging,
Vol. 130,
Issue. 4,
Liou, Wei-kai
and
Yen, Yee-Wen
2009.
Phase equilibria of the Au–Sn–Zn ternary system and interfacial reactions in Sn–Zn/Au couples.
Intermetallics,
Vol. 17,
Issue. 1-2,
p.
72.
Izuta, G.
Tanabe, T.
and
Suganuma, K.
2009.
Simplified Measuring Method of Copper Concentration in Solder Bath Utilizing Copper Dissolution.
IEEE Transactions on Electronics Packaging Manufacturing,
Vol. 32,
Issue. 3,
p.
138.
Lai, Yi-Shao
Chiu, Ying-Ta
and
Lee, Chiu-Wen
2009.
Electromigration Reliability of 96.5Sn–3Ag–0.5Cu Flip-Chip Solder Joints With Au/Ni/Cu or Cu Substrate Pad Metallization.
Journal of Electronic Packaging,
Vol. 131,
Issue. 2,
Kopyto, Marek
Onderka, Boguslaw
and
Zabdyr, Leszek A.
2010.
Thermodynamic properties of the liquid Ag–Cu–Sn lead-free solder alloys.
Materials Chemistry and Physics,
Vol. 122,
Issue. 2-3,
p.
480.
Hsieh, Hsin-Hsin
Lee, Wen-Kuei
Chang, Tao-Chih
and
Hsi, Chi-Shiung
2010.
Photovoltaic modules of crystalline solar cells using a new type assembly structure.
p.
1.
Hsieh, Hsin-Hsin
Lin, Fu-Ming
and
Yu, Shan-Pu
2011.
Performance of low series-resistance interconnections on the polycrystalline solar cells.
Solar Energy Materials and Solar Cells,
Vol. 95,
Issue. 1,
p.
39.
Pan, Hsin Jen
Lin, Chao Yang
Mohanty, Udit Surya
and
Chou, Jung Hua
2011.
Synthesis of Sn-3.5Ag Alloy Nanosolder by Chemical Reduction Method.
Materials Sciences and Applications,
Vol. 02,
Issue. 10,
p.
1480.
Chen, Sinn‐Wen
Gierlotka, Wojciech
Wu, Hsin‐Jay
and
Lin, Shih‐Kang
2012.
Lead‐Free Solders: Materials Reliability for Electronics.
p.
11.