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Oxidation kinetics of copper nanowires synthesized by AC electrodeposition of copper into porous aluminum oxide templates

Published online by Cambridge University Press:  01 June 2012

Xiaoxiong Luo ,
Uttandaraman Sundararaj  and
Jing-Li Luo
Xiaoxiong Luo
Affiliation:
Department of Chemical and Petroleum Engineering, University of Calgary, Calgary, Alberta T2N 1N4, Canada; and Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta T6G 2G6, Canada
Uttandaraman Sundararaj*
Affiliation:
Department of Chemical and Petroleum Engineering, University of Calgary, Calgary, Alberta T2N 1N4, Canada
Jing-Li Luo
Affiliation:
Department of Chemical and Materials Engineering, University of Alberta, Edmonton, Alberta T6G 2G6, Canada
*
a)Address all correspondence to this author. e-mail: [email protected]
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Abstract

Oxidation kinetics of copper nanowires (CuNWs) with diameter 25 ± 4 nm were studied. The dry powder of CuNWs before oxidation comprises 73.2 wt% Cu and 26.8 wt% Cu2O. The oxidation reaction can be divided into two stages at weight of 111.2%. Oxidized CuNWs after Stage 1 consist of Cu2O and CuO. Oxidized CuNWs after Stage 2 comprise CuO only. The activation energies for both stages are determined by Kissinger method and other five isoconversional methods: Flynn–Wall–Osawa, Starink, Kissinger–Akahira–Sunose, Boswell and Friedman differential methods. The isoconversional activation energies determined by Starink method are used to fit different master plots. The Johnson–Mehl–Avrami equation gives the best fit. Surface atoms are the sites for the random nucleation, and the crystallite strain in CuNWs is the driving force for the growth of nuclei during the oxidation process.

Keywords

oxidationkineticsnanostructure
Type
Articles
Information
Journal of Materials Research , Volume 27 , Issue 13 , 14 July 2012 , pp. 1755 - 1762
Copyright
Copyright © Materials Research Society 2012

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References

REFERENCES

1.Mohl, M., Pusztai, P., Kukovecz, A., Konya, Z., Kukkola, J., Kordas, K., Vajtai, R., and Ajayan, P.M.: Low-temperature large-scale synthesis and electrical testing of ultralong copper nanowires. Langmuir 26, 16496 (2010).CrossRefGoogle ScholarPubMed
2.Duan, J.L., Liu, J., Yao, H.J., Mo, D., Hou, M.D., Suna, Y.M., Chen, Y.F., and Zhang, L.: Controlled synthesis and diameter-dependent optical properties of Cu nanowire arrays. Mater. Sci. Eng., B 147, 57 (2008).CrossRefGoogle Scholar
3.Shi, Y., Li, H., Chen, L.Q., and Huang, H.J.: Obtaining ultra-long copper nanowires via a hydrothermal process. Sci. Technol. Adv. Mater. 6, 761 (2005).CrossRefGoogle Scholar
4.Zhou, Z.F., Zhou, Y.C., Pan, Y., and Wang, X.G.: Growth of the nickel nanorod arrays fabricated using electrochemical deposition on anodized Al templates. Mater. Lett. 62, 3419 (2008).CrossRefGoogle Scholar
5.Bridges, D.W., Baur, J.P., Baur, G.S., and Fassell, W.M.: Oxidation of copper to Cu2O and CuO (600°–1000°C and 0.026–20.4 atm oxygen). J. Electrochem. Soc. 103, 475 (1956).CrossRefGoogle Scholar
6.Gao, W., Gong, H., He, J., Thomas, A., Chan, L., and Li, S.: Oxidation behaviour of Cu thin films on Si wafer at 175–400°C. Mater. Lett. 51, 78 (2001).CrossRefGoogle Scholar
7.Zhu, Y.F., Mimura, K., Lim, J.W., Isshiki, M., and Jiang, Q.: Brief review of oxidation kinetics of copper at 350 °C to 1050 °C. Metall. Mater. Trans. A 37, 1231 (2006).Google Scholar
8.Gelves, G.A., Murakami, Z.T.M., Krantz, M.J., and Haber, J.A.: Multigram synthesis of copper nanowires using ac electrodeposition into porous aluminium oxide templates. J. Mater. Chem. 16, 3075 (2006).CrossRefGoogle Scholar
9.Kissinger, H.E.: Reaction kinetics in differential thermal analysis. Anal. Chem. 29, 1702 (1957).CrossRefGoogle Scholar
10.Flynn, J.H. and Wall, L.A.: A quick, direct method for the determination of activation energy from thermogravimetric data. J. Polym. Sci., Part B: Polym. Lett. 4, 323 (1966).CrossRefGoogle Scholar
11.Starink, M.J.: A new method for the derivation of activation energies from experiments performed at constant heating rate. Thermochim. Acta. 288, 97 (1996).CrossRefGoogle Scholar
12.Robinson, P.P., Arun, V., Manju, S., Aniz, C.U., and Yusuff, K.K.M.: Oxidation kinetics of nickel nano crystallites obtained by controlled thermolysis of diaquabis(ethylenediamine) nickel(II) nitrate. J. Therm. Anal. Calorim. 100, 733 (2010).CrossRefGoogle Scholar
13.Friedman, H.L.: New methods for evaluating kinetic parameters from thermal analysis data. J. Polym. Sci., Part B: Polym. Lett. 7, 41 (1969).CrossRefGoogle Scholar
14.Boswell, P.G.: On the calculation of activation energies using a modified Kissinger method. J. Therm. Anal. Calorim. 18, 353 (1980).CrossRefGoogle Scholar
15.Song, P., Wen, D., Guo, Z.X., and Korakianitis, T.: Oxidation investigation of nickel nanoparticles. Phys. Chem. Chem. Phys. 10, 5057 (2008).CrossRefGoogle ScholarPubMed
16.Gotor, F.J., Criado, J.M., Malek, J., and Koga, N.: Kinetic analysis of solid-state reactions: The universality of master plots for analyzing isothermal and nonisothermal experiments. J. Phys. Chem. A 104, 10777 (2000).CrossRefGoogle Scholar
17.Yang, J.C., Bharadwaj, M.D., Zhou, G., and Tropia, L.: Surface kinetics of copper oxidation investigated by in situ ultra-high vacuum transmission electron microscopy. Microsc. Microanal. 7, 486 (2001).CrossRefGoogle ScholarPubMed
18.Yang, J.C., Yeadon, M., Kolasa, B., and Gibson, J.M.: The homogeneous nucleation mechanism of Cu2O on Cu(001). Scr. Mater. 8, 1237 (1998).CrossRefGoogle Scholar
19.Yang, J.C., Yeadon, M., Kolasa, B., and Gibson, J.M.: Oxygen surface diffusion in three-dimensional Cu2O growth on Cu(001) thin films. Appl. Phys. Lett. 70, 3522 (1997).CrossRefGoogle Scholar
20.Zhu, Y., Mimura, K., and Isshiki, M.: Oxidation mechanism of copper at 623-1073 K. Mater. Trans. 43, 2173 (2002).CrossRefGoogle Scholar
21.Yabuki, A. and Tanaka, S.: Oxidation behavior of copper nanoparticles at low temperature. Mater. Res. Bull. 46, 2323 (2011).CrossRefGoogle Scholar