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Novel technique for measuring the mechanical properties of porous materials by nanoindentation

Published online by Cambridge University Press:  01 March 2006

Xi Chen ,
Yong Xiang  and
Joost J. Vlassak
Xi Chen*
Affiliation:
Department of Civil Engineering and Engineering Mechanics, Columbia University, New York, New York 10027-6699
Yong Xiang
Affiliation:
Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138-2901
Joost J. Vlassak
Affiliation:
Division of Engineering and Applied Sciences, Harvard University, Cambridge, Massachusetts 02138-2901
*
a) Address all correspondence to this author. e-mail: [email protected]
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Abstract

A new technique for measuring the elastic-plastic properties of porous thin films by means of nanoindentation is proposed. The effects of porosity on indentation hardness and modulus are investigated through finite element analyses based on the Gurson model for plastic deformation of ductile porous materials. Intrinsic mechanical properties of the thin film are obtained by eliminating both substrate and densification effects. The technique is applied to the special case of a porous, low-permittivity dielectric thin film. The results are in good agreement with those obtained independently using the plane-strain bulge test.

Keywords

FilmHardnessPorosity
Type
Articles
Information
Journal of Materials Research , Volume 21 , Issue 3 , March 2006 , pp. 715 - 724
Copyright
Copyright © Materials Research Society 2006

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